公开(公告)号：US20230332936A1

公开(公告)日：2023-10-19

申请号：US17796957

申请日：2020-12-22

Applicant: Hitachi Astemo, Ltd.

Inventor： Mizuki SHIBATA ,  Takayuki YOGO ,  Akira UENODAN ,  Hiroyuki ABE ,  Binti Haridan FATIN FARHANAH

IPC: G01F1/684 ,  G01F1/696

CPC classification number: G01F1/6842 ,  G01F1/6847 ,  G01F1/696

Abstract: Provided is a highly reliable thermal flow meter. In a thermal flow meter 20, a flow rate detection element 321 that detects an air flow rate, and a conductive coating film 400 containing a conductive substance and a resin as constituent elements are provided on at least a part of a portion provided in an auxiliary passage 135 on a surface facing a detection surface 322 of the flow rate detection element 321.

公开(公告)号：US20220390264A1

公开(公告)日：2022-12-08

申请号：US17776859

申请日：2020-10-20

Applicant: Hitachi Astemo, Ltd.

Inventor： Takayuki YOGO ,  Binti Haridan FATIN FARHANAH ,  Akira UENODAN ,  Hiroyuki ABE ,  Mizuki IJUIN

IPC: G01F15/16

Abstract: The objective of the present invention is to obtain a flow rate measurement device capable of reducing variations in the flow rate detection accuracy by suppressing the inclination of a chip package relative to a circuit board. A flow rate measurement device 20 of the present invention includes a chip package 310 having a flow rate sensor 311 and a passage wall 314 formed therein, and a circuit board 300 on which the chip package 310 is mounted, in which the chip package 310 is mounted such that the flow rate sensor 311 faces a portion of the circuit board 300 and a portion of the passage wall 314 as a resin portion of the chip package 310 contacts the circuit board 300.

公开(公告)号：US20230079532A1

公开(公告)日：2023-03-16

申请号：US17801620

申请日：2020-12-25

Applicant: Hitachi Astemo, Ltd.

Inventor： Binti Haridan FATIN FARHANAH ,  Hiroyuki ABE ,  Takayuki YOGO ,  Nozomi YATSUMONJI ,  Mizuki IJUIN

IPC: G01F1/692

Abstract: To provide an airflow amount measuring device capable of accurately measuring a flow amount of air without occurrence of warpage in a thin film portion when an airflow measuring element is mounted on a lead frame to form a resin-sealed package in which the airflow amount measuring element and the lead frame are sealed. A chip package includes a lead frame, an element mounted on the lead frame and having a detection portion, and a structure for sealing the lead frame and the element such that at least the detection portion is exposed. Then, the curvature radius ρ of the exposed portion of the element exposed from the sealing resin member is 2.13 or less.

公开(公告)号：US20220082421A1

公开(公告)日：2022-03-17

申请号：US17423946

申请日：2020-01-21

Applicant: Hitachi Astemo, Ltd.

Inventor： Masatoshi OGATA ,  Norio ISHITSUKA ,  Takahiro MIKI ,  Akira UENODAN ,  Takayuki YOGO

IPC: G01F1/684 ,  G01F15/14

Abstract: An object is to improve measurement accuracy of a thermal air flow meter. A flow-rate measuring device comprising: a sensor assembly having a flow-rate detecting element; a circuit board on which the sensor assembly is mounted; and a housing on which the circuit board is mounted, wherein the sensor assembly is mounted on the circuit board such that a detection portion side of the flow-rate detecting element is closer to the housing, and the sensor assembly includes a contact portion in contact with the housing on the detection portion side.

公开(公告)号：US20210398886A1

公开(公告)日：2021-12-23

申请号：US17288618

申请日：2019-09-20

Applicant: Hitachi Astemo, Ltd.

Inventor： Binti Haridan FATIN FARHANAH ,  Takayuki YOGO ,  Hiroyuki ABE

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/04 ,  H05K3/34 ,  H05K1/18 ,  G01F5/00

Abstract: To obtain a chip package positioning structure capable of adjusting a tilt and a position of a chip package with respect to the circuit board and reducing mounting variations. The chip package positioning and fixing structure that positions and fixes, to a circuit board 4, a chip package 5 in which a flow rate detection element 53 is sealed with a resin so that a detection portion is at least exposed, in which the chip package includes a solder fixation portion 52 that fixes the chip package to the circuit board by soldering, and a positioning portion 514 that performs positioning to the circuit board, and the positioning portion is provided closer to the flow rate detection element from the solder fixation portion.

公开(公告)号：US20210396561A1

公开(公告)日：2021-12-23

申请号：US17291535

申请日：2019-11-14

Applicant: Hitachi Astemo, Ltd.

Inventor： Takayuki YOGO ,  Binti Haridan FATIN FARHANAH ,  Hiroyuki ABE ,  Satoshi IKEO ,  Yuta CHIBA

IPC: G01F1/69

Abstract: Provided is a physical quantity measurement device capable of preventing a sealing of a cavity portion on a back surface side of a diaphragm of a thermal air flow rate sensor while improving measurement accuracy of the thermal air flow rate sensor as compared with the related art. A physical quantity measurement device 20 includes a lead frame 208f having a mounting surface f1 on which a flow rate sensor 205 which is the thermal air flow rate sensor is mounted, and a flow passage forming member 209 disposed on a back surface f2 opposite to the mounting surface f1 of the lead frame 208f. A ventilation flow path 210 is formed by a first through hole 211 provided in the lead frame 208f and communicating with a cavity portion 205c of the flow rate sensor 205, a second through hole 212 provided in the lead frame 208f and opened in the mounting surface f1, and a connection flow path 213 that is defined between the lead frame 208f and the flow passage forming member 209 and connecting the first through hole 211 and the second through hole 212.