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公开(公告)号：US20240030101A1
公开(公告)日：2024-01-25
申请号：US18026924
申请日：2021-09-16
发明人： Niko Pavlicek , Didier Cottet , Thomas Gradinger , Chunlei Liu , Fabian Mohn , Giovanni Salvatore , Juergen Schuderer , Daniele Torresin , Felix Traub
IPC分类号： H01L23/473 , H01L25/18 , H01L23/498 , H01L23/31 , H01L21/56
CPC分类号： H01L23/473 , H01L25/18 , H01L23/49811 , H01L23/3121 , H01L21/56
摘要： A power module includes a power semiconductor module having a semiconductor chip arranged on a substrate. A lead frame is arranged in electrical contact with the semiconductor chip. Abase plate includes cooling structures and micro channels that are connected to an inlet port and an outlet port. A bond layer connects the power semiconductor module and the base plate. A mold compound is arranged on the power semiconductor module, the bond layer and the base plate. The bond layer is encapsulated completely by the power semiconductor module, the base plate and the mold compound and the lead frame is arranged at least partially within the mold compound.
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公开(公告)号：US12016162B2
公开(公告)日：2024-06-18
申请号：US17434546
申请日：2020-02-25
发明人： Thomas Gradinger , Jürgen Schuderer , Felix Traub , Chunlei Lui , Fabian Mohn , Daniele Torresin
IPC分类号： H05K7/20 , H01L23/473
CPC分类号： H05K7/20927 , H01L23/473
摘要： An electric power converter device includes a first power semiconductor module and a frame for a closed cooler. The first power semiconductor module includes a first base plate having a first main side, a second main side opposite the first main side and a lateral side surface extending along a circumferential edge of the first base plate and connecting the first and the second main side. The frame is attached to the second main side of the first base plate. The first base plate has a first step on the second main side along the circumferential edge of the first base plate to form a first recess along the circumferential edge of the first base plate, in which first recess a first portion of the frame is received.
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