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公开(公告)号：US20230048878A1
公开(公告)日：2023-02-16
申请号：US17795951
申请日：2021-01-27
IPC分类号： H01L23/31 , H01L23/473 , H01L23/00 , H01L23/498 , H01L25/16 , G01R33/09
摘要： A power semiconductor module includes a substrate with a metallization layer that is structured. A semiconductor chip having a first side bonded to the metallization layer. A metal clip, which is a strip of metal, has a first planar part bonded to a second side of the semiconductor chip opposite to the first side. The metal clip also has a second planar part bonded to the metallization layer. A mold encapsulation at least partially encloses the substrate and the metal clip. The mold encapsulation has a recess approaching towards the first planar part of the metal clip. The semiconductor chip is completely enclosed by the mold encapsulation, the substrate and the metal clip and the first planar part of the metal clip is at least partially exposed by the recess. A sensor is accommodated in the recess.
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公开(公告)号：US20220238493A1
公开(公告)日：2022-07-28
申请号：US17611305
申请日：2020-04-02
发明人： Arne Schroeder , Slavo Kicin , Fabian Mohn , Juergen Schuderer
IPC分类号： H01L25/07 , H01L23/373 , H01L23/538 , H01L23/00
摘要： A power semiconductor module includes a main substrate and power semiconductor chips. Each power semiconductor chip is bonded to the main conductive layer with the first power electrode. A first group of the power semiconductor chips is connected in parallel via the second power electrodes and a second group of the power semiconductor chips is connected in parallel via the second power electrodes. The module also includes a first insulation layer and a first conductive layer overlying the first insulation layer as well as a second insulation layer and a second conductive layer overlying the second insulation layer. The first conductive layer provides a first gate conductor area and a first auxiliary emitter conductor area for the first group. The second conductive layer provides a second gate conductor area and a second auxiliary emitter conductor area for the second group.
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公开(公告)号：US20220254654A1
公开(公告)日：2022-08-11
申请号：US17630091
申请日：2020-07-23
IPC分类号： H01L21/48 , H01L23/473 , H01L23/367
摘要： One embodiment provides a method of providing a power semiconductor module with a cooler. A power semiconductor module includes a substrate having a first substrate side for carrying at least one electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side is connected to a first baseplate side and the baseplate also includes a second baseplate side being located opposite to its first baseplate side and being adapted for coming in contact with the cooler. The cooler includes a first casing component and a second casing component. The baseplate side is equipped with a cooling area that is surrounded by a connecting area.
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公开(公告)号：US20240030101A1
公开(公告)日：2024-01-25
申请号：US18026924
申请日：2021-09-16
发明人： Niko Pavlicek , Didier Cottet , Thomas Gradinger , Chunlei Liu , Fabian Mohn , Giovanni Salvatore , Juergen Schuderer , Daniele Torresin , Felix Traub
IPC分类号： H01L23/473 , H01L25/18 , H01L23/498 , H01L23/31 , H01L21/56
CPC分类号： H01L23/473 , H01L25/18 , H01L23/49811 , H01L23/3121 , H01L21/56
摘要： A power module includes a power semiconductor module having a semiconductor chip arranged on a substrate. A lead frame is arranged in electrical contact with the semiconductor chip. Abase plate includes cooling structures and micro channels that are connected to an inlet port and an outlet port. A bond layer connects the power semiconductor module and the base plate. A mold compound is arranged on the power semiconductor module, the bond layer and the base plate. The bond layer is encapsulated completely by the power semiconductor module, the base plate and the mold compound and the lead frame is arranged at least partially within the mold compound.
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公开(公告)号：US20230116118A1
公开(公告)日：2023-04-13
申请号：US17795970
申请日：2021-01-28
发明人： Juergen Schuderer , Slavo Kicin , Fabian Mohn , Gernot Riedel
IPC分类号： H01L23/538 , H01L23/498 , H01L25/16 , H01L23/00
摘要： A power semiconductor module includes a semiconductor board and a number of semiconductor chips attached to the semiconductor board. Each semiconductor chip has two power electrodes. An adapter board is attached to the semiconductor board above the semiconductor chips. The adapter board includes a terminal area for each semiconductor chip on a side facing away from the semiconductor board. The adapter board, in each terminal area, provides a power terminal for each power electrode of the semiconductor chip associated with the terminal area. Each power terminal is electrically connected via a respective vertical post below the terminal area with a respective semiconductor chip and each of the power terminals has at least two plug connectors. Jumper connectors interconnect the plug connectors for electrically connecting power electrodes of different semiconductor chips.
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公开(公告)号：US11562911B2
公开(公告)日：2023-01-24
申请号：US17630091
申请日：2020-07-23
IPC分类号： H01L21/48 , H01L23/367 , H01L23/473 , H01L23/10
摘要： One embodiment provides a method of providing a power semiconductor module with a cooler. A power semiconductor module includes a substrate having a first substrate side for carrying at least one electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side is connected to a first baseplate side and the baseplate also includes a second baseplate side being located opposite to its first baseplate side and being adapted for coming in contact with the cooler. The cooler includes a first casing component and a second casing component. The baseplate side is equipped with a cooling area that is surrounded by a connecting area.
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公开(公告)号：US20220254653A1
公开(公告)日：2022-08-11
申请号：US17630080
申请日：2020-07-24
IPC分类号： H01L21/48 , H01L23/473 , H01L23/367
摘要： In one embodiment a power semiconductor module includes a substrate having a first substrate side for carrying an electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side has a flat surface and is adapted for coming in contact with a cooler. A cooling area that is surrounded by a connecting area is located at the second substrate side. A first casing component of the cooler is connected to the second substrate side at the connecting area and a second casing component is connected to the first casing component such that a cooling channel for providing the cooling area with cooling fluid is provided between the first casing component and the second casing component. A cooling structure can be welded to the cooling area at the second substrate side.
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