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公开(公告)号：US12016162B2
公开(公告)日：2024-06-18
申请号：US17434546
申请日：2020-02-25
发明人： Thomas Gradinger , Jürgen Schuderer , Felix Traub , Chunlei Lui , Fabian Mohn , Daniele Torresin
IPC分类号： H05K7/20 , H01L23/473
CPC分类号： H05K7/20927 , H01L23/473
摘要： An electric power converter device includes a first power semiconductor module and a frame for a closed cooler. The first power semiconductor module includes a first base plate having a first main side, a second main side opposite the first main side and a lateral side surface extending along a circumferential edge of the first base plate and connecting the first and the second main side. The frame is attached to the second main side of the first base plate. The first base plate has a first step on the second main side along the circumferential edge of the first base plate to form a first recess along the circumferential edge of the first base plate, in which first recess a first portion of the frame is received.
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2.发明授权公开(公告)号：US11848252B2
公开(公告)日：2023-12-19
申请号：US16846844
申请日：2020-04-13
发明人： Thomas Gradinger , Daniele Torresin
IPC分类号： H01L23/473 , H01L21/48 , H01L25/07
CPC分类号： H01L23/473 , H01L21/4882 , H01L25/072
摘要： A semiconductor component, including a support frame and at least one semiconductor module attached to the support frame, wherein the support frame includes a respective passage (on the edge of which a base plate of the semiconductor module rests, wherein the base plate is soldered to the support frame.
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公开(公告)号：US20240030101A1
公开(公告)日：2024-01-25
申请号：US18026924
申请日：2021-09-16
发明人： Niko Pavlicek , Didier Cottet , Thomas Gradinger , Chunlei Liu , Fabian Mohn , Giovanni Salvatore , Juergen Schuderer , Daniele Torresin , Felix Traub
IPC分类号： H01L23/473 , H01L25/18 , H01L23/498 , H01L23/31 , H01L21/56
CPC分类号： H01L23/473 , H01L25/18 , H01L23/49811 , H01L23/3121 , H01L21/56
摘要： A power module includes a power semiconductor module having a semiconductor chip arranged on a substrate. A lead frame is arranged in electrical contact with the semiconductor chip. Abase plate includes cooling structures and micro channels that are connected to an inlet port and an outlet port. A bond layer connects the power semiconductor module and the base plate. A mold compound is arranged on the power semiconductor module, the bond layer and the base plate. The bond layer is encapsulated completely by the power semiconductor module, the base plate and the mold compound and the lead frame is arranged at least partially within the mold compound.
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公开(公告)号：US11557428B2
公开(公告)日：2023-01-17
申请号：US16537868
申请日：2019-08-12
发明人： Lise Donzel , Rudi Velthuis , Thomas Gradinger , Felix Greuter
摘要： A transformer is provided, which includes a tank having an enclosed volume with an insulating material, the tank including at least one channel extending through the tank, wherein the interior of the at least one channel is separated from the enclosed volume of the tank by a channel wall. A transformer core is provided outside of the enclosed volume, including at least one core leg extending through the tank via the at least one channel. At least one coil is located inside the enclosed volume, the coil being wound about the at least one channel, the tank has an inner wall or outer wall including a weakly-conductive layer, which includes fibers embedded in an impregnating material.
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公开(公告)号：US20220262707A1
公开(公告)日：2022-08-18
申请号：US17629904
申请日：2020-07-24
发明人： Thomas Gradinger , Milad Maleki , Daniele Torresin
IPC分类号： H01L23/473
摘要： An apparatus includes a baseplate and a cooler providing a cooling channel adapted for providing a coolant flow. An electronic circuit includes a power semiconductor device disposed at the first side of baseplate. A footprint of the power semiconductor device defines a device area on the first side. A cooling area at the second side of the baseplate opposite the device area is adapted for dissipating heat from the baseplate by bringing the cooling area into thermal contact with the coolant flow in the cooling channel. An auxiliary area is located on the second side of the baseplate adjacent to the cooling area. The auxiliary area includes a flow guide for reducing a flow rate of the coolant flow in the auxiliary area and the cooling channel is adapted to receive the cooling area and the flow guide.
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公开(公告)号：US20220254654A1
公开(公告)日：2022-08-11
申请号：US17630091
申请日：2020-07-23
IPC分类号： H01L21/48 , H01L23/473 , H01L23/367
摘要： One embodiment provides a method of providing a power semiconductor module with a cooler. A power semiconductor module includes a substrate having a first substrate side for carrying at least one electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side is connected to a first baseplate side and the baseplate also includes a second baseplate side being located opposite to its first baseplate side and being adapted for coming in contact with the cooler. The cooler includes a first casing component and a second casing component. The baseplate side is equipped with a cooling area that is surrounded by a connecting area.
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公开(公告)号：US11562911B2
公开(公告)日：2023-01-24
申请号：US17630091
申请日：2020-07-23
IPC分类号： H01L21/48 , H01L23/367 , H01L23/473 , H01L23/10
摘要： One embodiment provides a method of providing a power semiconductor module with a cooler. A power semiconductor module includes a substrate having a first substrate side for carrying at least one electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side is connected to a first baseplate side and the baseplate also includes a second baseplate side being located opposite to its first baseplate side and being adapted for coming in contact with the cooler. The cooler includes a first casing component and a second casing component. The baseplate side is equipped with a cooling area that is surrounded by a connecting area.
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公开(公告)号：US20220254653A1
公开(公告)日：2022-08-11
申请号：US17630080
申请日：2020-07-24
IPC分类号： H01L21/48 , H01L23/473 , H01L23/367
摘要： In one embodiment a power semiconductor module includes a substrate having a first substrate side for carrying an electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side has a flat surface and is adapted for coming in contact with a cooler. A cooling area that is surrounded by a connecting area is located at the second substrate side. A first casing component of the cooler is connected to the second substrate side at the connecting area and a second casing component is connected to the first casing component such that a cooling channel for providing the cooling area with cooling fluid is provided between the first casing component and the second casing component. A cooling structure can be welded to the cooling area at the second substrate side.
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公开(公告)号：US12108580B2
公开(公告)日：2024-10-01
申请号：US17435489
申请日：2020-02-27
申请人： AUDI AG , Hitachi Energy Ltd
IPC分类号： H05K7/20 , H01L23/473
CPC分类号： H05K7/20927 , H01L23/473
摘要： A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.
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