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公开(公告)号：US10900138B2
公开(公告)日：2021-01-26
申请号：US16328509
申请日：2017-10-30
申请人： HITACHI METALS, LTD.
发明人： Junichi Matsuda , Atsushi Okamoto
摘要： Provided are a metallic foil manufacturing method in which a metallic film electrodeposited by electrolysis on the surface of an electrodeposition surface of a cathode is peeled off to form a metallic foil, and the electrodeposition surface used therein is obtained by subjecting a roughened surface, which results from roughening a smoothed surface made of titanium or titanium alloy using a blast treatment, etc., to an oxidation treatment selected from thermal oxidation, anodic oxidation (preferably anodic oxidation carried out while moving the anodic oxidation solution), or a combination treatment of thermal oxidation and anodic oxidation so that the electrodeposition surface has an oxidation layer with a thickness of 30 to 250 nm on the uppermost layer and has a surface roughness RZJIS of 4 to 10 μm.
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公开(公告)号：US09954230B2
公开(公告)日：2018-04-24
申请号：US14890209
申请日：2014-06-16
申请人： HITACHI METALS, LTD.
发明人： Tatsuya Toyama , Shin Takahashi , Atsushi Okamoto
IPC分类号： H01M4/70 , H01M4/13 , H01M4/66 , H01M10/0525
CPC分类号： H01M4/70 , H01M4/13 , H01M4/661 , H01M10/0525 , H01M2220/20
摘要： A current collector for a lithium ion secondary battery, on which an electrode mixture layer is formed, satisfies A≥0.10 μm and 6≤(B/A)≤15 when assuming that a three-dimensional center plane average roughness SRa of a surface of at least one side of the current collector on which the electrode mixture layer is formed is A and a ratio of an actual surface area of the surface of at least one side of the current collector to a geometric area of the surface of at least one side of the current collector, which is (actual surface area)/(geometric area), is B.
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公开(公告)号：US09991519B2
公开(公告)日：2018-06-05
申请号：US14917807
申请日：2015-02-19
申请人： Hitachi Metals, Ltd.
发明人： Atsushi Okamoto , Junichi Matsuda
IPC分类号： H01M4/66 , C25D1/04 , C25D3/44 , H01G11/68 , H01G11/86 , H01M10/0525 , H01G11/70 , H01G11/84 , H01G9/045
CPC分类号： H01M4/661 , C25D1/04 , C25D3/44 , H01G9/045 , H01G9/055 , H01G11/68 , H01G11/70 , H01G11/84 , H01G11/86 , H01M10/0525 , Y02E60/13 , Y02T10/7022
摘要： An object of the present invention is to provide an electrolytic aluminum foil having no significant difference in properties between one surface and the other surface thereof, and also a method for producing the same. Another object is to provide a current collector for an electrical storage device using the electrolytic aluminum foil, an electrode for an electrical storage device, and an electrical storage device. An electrolytic aluminum foil of the present invention as a means for achieving the object is characterized in that both surfaces of the foil have L* values of 86.00 or more in the L*a*b* color space (SCI method). The electrolytic aluminum foil of the present invention can be produced, for example, employing a method for producing an electrolytic aluminum foil, which comprises applying a current between a cathode drum partially immersed in a plating solution and an anode plate immersed in the plating solution to form an aluminum film on the surface of the cathode drum, and then separating, from the cathode drum, the aluminum film raised from the liquid surface by rotating the cathode drum, and in which the dew point of a treatment atmosphere at the time of the separation of the aluminum film from the cathode drum to give an electrolytic aluminum foil is controlled to be −50.0° C. or less.
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4.发明授权Method for preparing low-melting-point plating solution for aluminum electroplating, plating solution for aluminum electroplating, method for producing aluminum foil, and method for lowering melting point of plating solution for aluminum electroplating 有权铝电镀低熔点电镀液的制备方法，铝电镀用溶液，铝箔的制造方法以及铝电镀用溶液的熔点降低方法公开(公告)号：US09382634B2
公开(公告)日：2016-07-05
申请号：US14381753
申请日：2013-02-27
申请人： HITACHI METALS, LTD.
发明人： Atsushi Okamoto , Junichi Matsuda
CPC分类号： C25D3/44 , C25D1/04 , C25D3/665 , H01G11/68 , H01G11/84 , H01M4/661 , H01M10/0525 , Y02E60/13 , Y02T10/7011 , Y02T10/7022
摘要： An object of the present invention is to provide a method for preparing a plating solution for aluminum electroplating useful for the production of a high-ductility, high-purity aluminum foil at a high film formation rate, etc., which is an easy-to-handle plating solution that does not solidify and allows for an electroplating treatment even at 25° C. The present invention as a means for achieving the object is characterized in that in a preparation of a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) a nitrogen-containing compound, the blending proportions of the dialkyl sulfone, the aluminum halide, and the nitrogen-containing compound are such that per 10 mol of the dialkyl sulfone, the aluminum halide is 3.5+n to 4.2+n mol, and the nitrogen-containing compound is n mol (wherein n is 0.001 to 2.0 mol). In addition, a plating solution for aluminum electroplating prepared by the method of the present invention allows for an electroplating treatment with high aluminum deposition efficiency relative to the current flow, and is thus advantageous in that electricity usage can be reduced, resulting in excellent economic efficiency.
摘要翻译： 本发明的目的是提供一种用于制备用于制备高成膜速率等的高延展性，高纯度铝箔的铝电镀用溶液的方法，该方法易于制备 即使在25℃下也不固化并允许进行电镀处理的手提电镀液。作为实现该目的的手段的本发明的特征在于，在制备含有至少（1）二烷基砜 ，（2）卤化铝和（3）含氮化合物，二烷基砜，卤化铝和含氮化合物的配合比例使得每10摩尔二烷基砜，卤化铝 为3.5 + n〜4.2 + n摩尔，含氮化合物为n摩尔（n为0.001〜2.0摩尔）。 此外，通过本发明的方法制备的用于电镀铝的电镀溶液允许相对于电流流动具有高的铝沉积效率的电镀处理，因此有利的是可以减少电力使用，从而获得优异的经济效率 。
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5.发明申请METHOD FOR PREPARING LOW-MELTING-POINT PLATING SOLUTION FOR ALUMINUM ELECTROPLATING, PLATING SOLUTION FOR ALUMINUM ELECTROPLATING, METHOD FOR PRODUCING ALUMINUM FOIL, AND METHOD FOR LOWERING MELTING POINT OF PLATING SOLUTION FOR ALUMINUM ELECTROPLATING 有权用于制备用于铝电镀的低熔点镀层溶液的方法，用于铝电镀的镀层溶液，用于生产铝箔的方法，以及用于降低铝电解镀层溶液的熔点的方法公开(公告)号：US20150068909A1
公开(公告)日：2015-03-12
申请号：US14381753
申请日：2013-02-27
申请人： HITACHI METALS, LTD.
发明人： Atsushi Okamoto , Junichi Matsuda
CPC分类号： C25D3/44 , C25D1/04 , C25D3/665 , H01G11/68 , H01G11/84 , H01M4/661 , H01M10/0525 , Y02E60/13 , Y02T10/7011 , Y02T10/7022
摘要： An object of the present invention is to provide a method for preparing a plating solution for aluminum electroplating useful for the production of a high-ductility, high-purity aluminum foil at a high film formation rate, etc., which is an easy-to-handle plating solution that does not solidify and allows for an electroplating treatment even at 25° C. The present invention as a means for achieving the object is characterized in that in a preparation of a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) a nitrogen-containing compound, the blending proportions of the dialkyl sulfone, the aluminum halide, and the nitrogen-containing compound are such that per 10 mol of the dialkyl sulfone, the aluminum halide is 3.5+n to 4.2+n mol, and the nitrogen-containing compound is n mol (wherein n is 0.001 to 2.0 mol). In addition, a plating solution for aluminum electroplating prepared by the method of the present invention allows for an electroplating treatment with high aluminum deposition efficiency relative to the current flow, and is thus advantageous in that electricity usage can be reduced, resulting in excellent economic efficiency.
摘要翻译： 本发明的目的是提供一种用于制备用于制备高成膜速率等的高延展性，高纯度铝箔的铝电镀用溶液的方法，该方法易于制备 即使在25℃下也不固化并允许进行电镀处理的手提电镀液。作为实现该目的的手段的本发明的特征在于，在制备含有至少（1）二烷基砜 ，（2）卤化铝和（3）含氮化合物，二烷基砜，卤化铝和含氮化合物的配合比例使得每10摩尔二烷基砜，卤化铝 为3.5 + n〜4.2 + n摩尔，含氮化合物为n摩尔（n为0.001〜2.0摩尔）。 此外，通过本发明的方法制备的用于电镀铝的电镀溶液允许相对于电流流动具有高的铝沉积效率的电镀处理，因此有利的是可以减少电力使用，从而获得优异的经济效率 。
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公开(公告)号：US09812700B2
公开(公告)日：2017-11-07
申请号：US14354237
申请日：2012-10-25
申请人： HITACHI METALS, LTD.
发明人： Atsushi Okamoto
摘要： A method for producing a porous aluminum foil of the present invention is characterized in that a porous aluminum film is formed on a surface of a substrate by electrolysis using a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) a nitrogen-containing compound, and having a water content of 100 to 2000 ppm, and then the film is separated from the substrate. The nitrogen-containing compound is preferably at least one selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by the general formula: R1R2R3R4N.X (R1 to R4 independently represent an alkyl group and are the same as or different from one another, and X represents a counteranion for the quaternary ammonium cation).
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7.发明申请公开(公告)号：US20140272598A1
公开(公告)日：2014-09-18
申请号：US14354237
申请日：2012-10-25
申请人： HITACHI METALS, LTD.
发明人： Atsushi Okamoto
摘要： A method for producing a porous aluminum foil of the present invention is characterized in that a porous aluminum film is formed on a surface of a substrate by electrolysis using a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) a nitrogen-containing compound, and having a water content of 100 to 2000 ppm, and then the film is separated from the substrate. The nitrogen-containing compound is preferably at least one selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by the general formula: R1R2R3R4N.X (R1 to R4 independently represent an alkyl group and are the same as or different from one another, and X represents a counteranion for the quaternary ammonium cation).
摘要翻译： 本发明的多孔铝箔的制造方法的特征在于，通过使用含有至少（1）二烷基砜的电镀溶液进行电解，在基板的表面上形成多孔铝膜，（2）卤化铝 ，和（3）含氮化合物，水分含量为100〜2000ppm，然后将膜与基材分离。 含氮化合物优选为选自卤化铵，伯胺的卤化氢盐，仲胺的卤化氢盐，叔胺的卤化氢盐和季铵盐的卤化物中的至少一种， 由以下通式表示的铵盐：R1R2R3R4N.X（R1至R4独立地表示烷基，彼此相同或不同，X表示季铵阳离子的抗衡阴离子）。
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