公开(公告)号：US20220203433A1

公开(公告)日：2022-06-30

申请号：US17544006

申请日：2021-12-07

Applicant: Hitachi Metals, Ltd.

Inventor： Keisuke Fujito ,  Takayuki Tsuji ,  Shohei Hata

IPC: B22D11/108

Abstract: A manufacturing efficiency of the wire rod made of the cast alloy including the additive element having the high activity to the oxygen is improved. An apparatus of manufacturing a wire rod includes: a tundish storing a molten metal; a mold for use in continuously casting the molten metal fed from the tundish; and an additive-element feeding unit continuously feeding an additive element (wire) to a feeding port of the mold.

公开(公告)号：US10006138B2

公开(公告)日：2018-06-26

申请号：US14497709

申请日：2014-09-26

Applicant: Hitachi Metals, Ltd.

Inventor： Hideyuki Sagawa ,  Keisuke Fujito ,  Takumi Sato ,  Hiromitsu Kuroda

IPC: C25D7/06 ,  C25D5/50

CPC classification number: C25D7/0614 ,  C25D5/50 ,  Y10T428/1266

Abstract: A copper foil includes a copper-based metal sheet including mainly a copper, and a surface-treated layer that is provided on the copper-based metal sheet and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper. A total thickness of the copper-based metal sheet and the surface-treated layer is less than 0.55 mm.

公开(公告)号：US11715584B2

公开(公告)日：2023-08-01

申请号：US17410770

申请日：2021-08-24

Applicant: Hitachi Metals, Ltd.

Inventor： Hiromitsu Kuroda ,  Tamotsu Sakurai ,  Keisuke Fujito ,  Yoshiki Nakade ,  Detian Huang ,  Hideki Nonen

IPC: H01B11/10 ,  H01B11/18 ,  G01N23/2252 ,  H01B13/22 ,  H01B13/016

CPC classification number: H01B11/1808 ,  G01N23/2252 ,  H01B13/016 ,  H01B13/225

Abstract: A coaxial cable is composed of a conductor, an insulator around the conductor, a shield layer around the insulator, and a sheath around the shield layer. The shield layer includes a lateral winding shielding portion with metal wires helically wrapped around the insulator, and a batch plating portion covering the lateral winding shielding portion. The shield layer includes a joining portion where adjacent metal wires are joined with each other with the batch plating portion at a gap between the adjacent metal wires, and inner peripheral portions where the metal wires are not being covered with the batch plating portion and plating layers are exposed. The joining portion is provided between adjacent inner peripheral portions. When an elemental analysis is performed in any analysis region having an area of 0.015 mm2 or more and 0.300 mm2 or less in an insulator-side surface of the shield layer which is stripped from the insulator, an area of a chlorine present region where chlorine is present in the analysis region is 5% or less of an area of the analysis region.

公开(公告)号：US11476024B2

公开(公告)日：2022-10-18

申请号：US16874231

申请日：2020-05-14

Applicant: Hitachi Metals, Ltd.

Inventor： Keisuke Fujito ,  Shohei Hata ,  Hiromitsu Kuroda ,  Takayuki Tuji

IPC: H01B1/02 ,  H01F5/06 ,  H01F41/04 ,  H01B3/30

Abstract: An insulated electric wire is composed of a conductor composed of a copper material, and an electrical insulating layer provided on an outer periphery of the conductor. For the constituent conductor of the insulated electric wire, in an orientation intensity ratio obtained by X-ray diffraction of a transverse cross section of the conductor, an intensity in a [200] crystal orientation is higher than an intensity in a [111] crystal orientation.

公开(公告)号：US11094434B2

公开(公告)日：2021-08-17

申请号：US16144191

申请日：2018-09-27

Applicant: Hitachi Metals, Ltd.

Inventor： Hiromitsu Kuroda ,  Shohei Hata ,  Takayuki Tsuji ,  Keisuke Fujito

IPC: H01B7/30 ,  H01B3/30 ,  H01B1/10 ,  H01B1/08 ,  H01F5/06 ,  H01B1/02 ,  H01B13/14

Abstract: An insulated wire includes a conductor including a copper material, and an insulation layer that is formed on an outer periphery of the conductor. A restoring temperature TB of the conductor is not more than 130° C. The restoring temperature TB is a temperature that is needed to restore a conductivity of the conductor after a coil processing to a conductivity of the conductor before the coil processing.

公开(公告)号：US09564255B2

公开(公告)日：2017-02-07

申请号：US14091674

申请日：2013-11-27

Applicant: HITACHI METALS, LTD.

Inventor： Hideyuki Sagawa ,  Seigi Aoyama ,  Toru Sumi ,  Keisuke Fujito ,  Detian Huang

IPC: H01B11/18 ,  H01B13/016 ,  H01B1/02

CPC classification number: H01B1/026

Abstract: A high-speed transmission cable conductor includes a core material includes mainly copper, and a surface treated layer formed around a surface of the core material. The surface treated layer includes an amorphous layer including a metal element having a higher affinity for oxygen than the copper, and oxygen.

Abstract translation: 高速传输电缆导体包括主要包括铜的芯材和在芯材表面周围形成的表面处理层。 表面处理层包括非晶层，其包括对铜的氧的亲和性高于铜的金属元素和氧。

公开(公告)号：US11545277B2

公开(公告)日：2023-01-03

申请号：US16538106

申请日：2019-08-12

Applicant: Hitachi Metals, Ltd.

Inventor： Kazuhisa Takahashi ,  Shohei Hata ,  Hiromitsu Kuroda ,  Toru Sumi ,  Kazuya Nishi ,  Keisuke Fujito ,  Takayuki Tuji

IPC: H01B1/02 ,  C22C9/00 ,  C22F1/08 ,  H01B13/00

Abstract: Bendability of a copper alloy wire is improved without decrease in an electrical conductivity of the copper alloy wire made of copper alloy containing zirconium. A cable includes: a two-core stranded wire formed by intertwining two electrical wires made of a conductor and an insulating layer covering the conductor; a filler formed around the two-core stranded wire; and a sheath formed around the filler and the electrical wire. The conductor is a copper alloy wire in which a precipitate containing the zirconium disperses, and has a crystal gain diameter that is equal to or smaller than 1 μm, an electrical conductivity that is equal to or higher than 87% IACS, and a tensile stress that is equal to or larger than 545 MPa.

公开(公告)号：US09960289B2

公开(公告)日：2018-05-01

申请号：US14497655

申请日：2014-09-26

Applicant: Hitachi Metals, Ltd.

Inventor： Hideyuki Sagawa ,  Keisuke Fujito ,  Takayuki Tsuji ,  Hiromitsu Kuroda

IPC: H01L31/0224 ,  B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  B23K35/36 ,  C22C13/00 ,  C22C9/00 ,  C23C28/02 ,  C23C30/00 ,  C23C10/28

CPC classification number: H01L31/022425 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0238 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/302 ,  B23K35/36 ,  B23K35/3602 ,  C22C9/00 ,  C22C13/00 ,  C23C10/28 ,  C23C28/021 ,  Y02B10/12 ,  Y02E10/50 ,  Y10T428/1266

Abstract: A solder joint material includes a copper-based metal material including mainly a copper, a surface-treated layer that is provided on the copper-based metal material and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper, and a Sn-based solder plating layer provided on the surface-treated layer.

公开(公告)号：US20170368599A1

公开(公告)日：2017-12-28

申请号：US15622374

申请日：2017-06-14

Applicant: Hitachi Metals, Ltd.

Inventor： Keisuke Fujito ,  Shohei Hata ,  Takayuki Tsuji ,  Hiromitsu Kuroda

IPC: B22D11/116 ,  C22C1/02 ,  B21B3/00 ,  B22D11/00 ,  C22C9/00 ,  C22C1/10

CPC classification number: B22D11/116 ,  B21B3/003 ,  B21B2003/005 ,  B22D11/004 ,  C22C1/02 ,  C22C1/0425 ,  C22C1/1036 ,  C22C9/00

Abstract: A copper alloy material manufacturing equipment for manufacturing a copper alloy material by continuously casting molten copper. The equipment includes an element adding means for adding a metal element to the molten copper, a tundish for holding the molten copper containing the metal element, a pouring nozzle connected to the tundish to feed the molten copper from the tundish, and a trapping member arranged inside the tundish and including a same type of material as at least one of an oxide of the metal element, a nitride of the metal element, a carbide of the metal element and a sulfide of the metal element.

公开(公告)号：US11053569B2

公开(公告)日：2021-07-06

申请号：US15010780

申请日：2016-01-29

Applicant: Hitachi Metals, Ltd.

Inventor： Keisuke Fujito ,  Takashi Hayasaka ,  Takeshi Usami ,  Toru Sumi

IPC: C22C9/00 ,  C22C1/06 ,  C22C1/02 ,  B21C37/04 ,  H01B1/00 ,  B21C1/02 ,  B21C1/00

Abstract: An alloying-element additive for adding an alloy element to a copper melt formed by melting a base material including a copper in manufacturing a copper alloy. The alloying-element additive includes a wire-shaped or plate-shaped core including an alloy element, and an outer layer material including a copper and covering the core. A weight ratio of the copper in the outer layer material and the alloy element in the core is in a range of weight ratio where the alloying-element additive has a liquid phase in a temperature range of not more than a melting point of the copper in a copper-alloy element phase diagram.