公开(公告)号：US5428503A

公开(公告)日：1995-06-27

申请号：US317614

申请日：1994-09-26

申请人： Hitoshi Matsushima ,  Toshihiro Komatu ,  Yoshihiro Kondou ,  Toshio Hatada ,  Susumu Iwai ,  Tetsuro Honma ,  Toshiki Iino ,  Takao Ohba ,  Akira Yamagiwa

发明人： Hitoshi Matsushima ,  Toshihiro Komatu ,  Yoshihiro Kondou ,  Toshio Hatada ,  Susumu Iwai ,  Tetsuro Honma ,  Toshiki Iino ,  Takao Ohba ,  Akira Yamagiwa

IPC分类号： H05K7/20

CPC分类号： H05K7/20154 ,  Y10S165/908

摘要： A cooling apparatus for electronic equipment for improving the reliability of the equipment by making uniform the temperature distribution of heat generating devices mounted on the electronic equipment, more particularly on a computer and for reducing the working process required at the time of performing a maintenance of a printed circuit board in the electronic equipment by stacking, in a frame, the electronic printed circuit boards on which the heat generating devices, such as a CPU and memories, are mounted at predetermined intervals. The cooling apparatus has a fan fastened to one wall surface of a chamber and a plurality of jet cooling devices formed on the surface opposing the wall surface. The jet cooling devices are formed in parallel to the printed circuit boards. The jet cooling devices are slits, or nozzles or jet stream ducts extending among the printed circuit boards and are so formed as to supply cooling air in a jet stream state to each heat generating device. Therefore, the cooling air can be concentrated to locally cool the printed circuit board including the device that generates heat of a large heating value. Hence, the temperature rise in the heat generating devices can be made uniform.

摘要翻译： 一种用于电子设备的冷却装置，用于通过使安装在电子设备上的发热装置的温度分布均匀，更具体地在计算机上，并且为了减少进行维护时所需的工作过程而提高设备的可靠性 电子设备中的印刷电路板通过在框架中堆叠以预定间隔安装诸如CPU和存储器的发热装置的电子印刷电路板。 冷却装置具有固定在室的一个壁表面上的风扇和形成在与壁表面相对的表面上的多个喷射冷却装置。 喷射冷却装置与印刷电路板平行地形成。 喷射冷却装置是在印刷电路板之间延伸的狭缝或喷嘴或喷射流管道，并且形成为将喷射流状态的冷却空气供应到每个发热装置。 因此，冷却空气可以集中以局部冷却印刷电路板，包括产生大热值的热的装置。 因此，能够使发热元件的温度上升均匀。

公开(公告)号：US5959351A

公开(公告)日：1999-09-28

申请号：US103227

申请日：1993-08-09

申请人： Shigeyuki Sasaki ,  Tadakatsu Nakajima ,  Noriyuki Ashiwake ,  Yasuo Ohsone ,  Toshio Hatada ,  Toshiki Iino ,  Akio Idei ,  Kenichi Kasai

发明人： Shigeyuki Sasaki ,  Tadakatsu Nakajima ,  Noriyuki Ashiwake ,  Yasuo Ohsone ,  Toshio Hatada ,  Toshiki Iino ,  Akio Idei ,  Kenichi Kasai

IPC分类号： H01L23/44 ,  F15D1/08 ,  H01L23/427 ,  H01L23/473 ,  H01L23/34

CPC分类号： F15D1/08 ,  H01L23/473 ,  F28F13/02 ,  H01L2924/0002

摘要： There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.

摘要翻译： 公开了一种液冷电子装置。 半导体器件安装在浸没在冷却液中的半导体模块的衬底上。 在各冷却介质供给部件的冷却介质喷出口附近设置有线状部件，冷却介质供给部件通过冷却液喷射冷却各个半导体器件。 通过这种布置，线状构件下游的冷却液的流动受到干扰，促使半导体装置的整个表面沸腾，并且当半导体装置被冷却时，瞬态温度上升在 开始半导体器件通电的时间，从而稳定半导体器件的温度。

公开(公告)号：US5705850A

公开(公告)日：1998-01-06

申请号：US290155

申请日：1994-08-15

申请人： Noriyuki Ashiwake ,  Takahiro Daikoku ,  Kenichi Kasai ,  Keizou Kawamura ,  Hideyuki Kimura ,  Atsuo Nishihara ,  Toshio Hatada ,  Toshiki Iino

发明人： Noriyuki Ashiwake ,  Takahiro Daikoku ,  Kenichi Kasai ,  Keizou Kawamura ,  Hideyuki Kimura ,  Atsuo Nishihara ,  Toshio Hatada ,  Toshiki Iino

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/473 ,  H01L21/10 ,  H01L23/34 ,  H02B1/00 ,  H02B1/01

CPC分类号： H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253

摘要： The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.

摘要翻译： 所公开的发明的目的在于提供一种具有高吸收热变形能力的半导体模块结构，散热能力优异，能够容易地进行维护操作。 为此，在本发明的半导体模块中，提供了热导体构件，其各自具有与半导体器件或壳体的内表面接触的区域并且具有相对的传热表面。 散热器一体地形成在壳体上。 利用这种结构，可以吸收由高的发热密度设计引起的大的热变形，并且同时可以有效地辐射来自半导体器件的热量。

公开(公告)号：US5406807A

公开(公告)日：1995-04-18

申请号：US77109

申请日：1993-06-16

申请人： Noriyuki Ashiwake ,  Tadakatsu Nakajima ,  Shigeyuki Sasaki ,  Yasuo Ohsone ,  Toshio Hatada ,  Toshiki Iino ,  Kenichi Kasai ,  Akio Idei

发明人： Noriyuki Ashiwake ,  Tadakatsu Nakajima ,  Shigeyuki Sasaki ,  Yasuo Ohsone ,  Toshio Hatada ,  Toshiki Iino ,  Kenichi Kasai ,  Akio Idei

IPC分类号： H01L23/427 ,  F25D17/02

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  Y10S165/908

摘要： An apparatus for cooling semiconductor devices includes a module for cooling semiconductor devices; a refrigerant cooling device for receiving via an outlet pipe the refrigerant discharged through an outlet port of the module to cool the refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, the refrigerant cooled by the refrigerant cooling device and sending the refrigerant to the module via an inlet pipe; and a refrigerant-flow stabilizing mechanism for stabilizing a refrigerant circulation flow discharged from the refrigerant circulation pump to be returned to the refrigerant circulation pump via the module and the refrigerant cooling device. Since the refrigerant-flow stabilizing mechanism stabilize the refrigerant flow, the refrigerant flow can be stably circulated so that the semiconductor devices in the module are stably cooled.

摘要翻译： 一种用于冷却半导体器件的设备包括用于冷却半导体器件的模块; 制冷剂冷却装置，用于经由出口管接收通过模块的出口排出的制冷剂以冷却制冷剂; 制冷剂循环泵，其经由吸入管接收由所述制冷剂冷却装置冷却的制冷剂，并且经由入口管将所述制冷剂输送到所述组件; 以及制冷剂流量稳定机构，其使从制冷剂循环泵排出的制冷剂循环流量稳定化，经由模块和制冷剂冷却装置返回到制冷剂循环泵。 由于制冷剂流动稳定机构使制冷剂流动稳定，所以可以稳定地循环制冷剂流，使得模块中的半导体器件稳定地冷却。

公开(公告)号：US5592363A

公开(公告)日：1997-01-07

申请号：US128227

申请日：1993-09-29

申请人： Takayuki Atarashi ,  Toshio Hatada ,  Takahiro Daikoku ,  Nobuo Kawasaki ,  Toshiki Iino ,  Tamotsu Tsukaguchi ,  Kenichi Kasai ,  Fumiyuki Kobayashi ,  Yoshito Hayashi

发明人： Takayuki Atarashi ,  Toshio Hatada ,  Takahiro Daikoku ,  Nobuo Kawasaki ,  Toshiki Iino ,  Tamotsu Tsukaguchi ,  Kenichi Kasai ,  Fumiyuki Kobayashi ,  Yoshito Hayashi

IPC分类号： H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002

摘要： An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.

摘要翻译： 在每个半导体器件上设置具有多个半导体器件的电子设备，所述多个半导体器件在操作期间产生热量，散热片具有多个平板状或针状散热片。 喷嘴与散热器相关联，以将冷却流体供应到散热器中。 散热器布置成使得所有这些散热器沿相同的方向引导和排出冷却流体。 在由散热器确定的流体的流动方向（x方向）和冷却流体的排放量上测量的各个喷嘴的宽度小于相关散热器的宽度。 在与x方向垂直的方向（y方向）上测量的喷嘴的宽度小于相关联的散热器的宽度。 相邻喷嘴之间的空间提供了足够横截面的排放通道，其减小被加热的冷却介质通过其排出所遇到的阻力。

公开(公告)号：US5504651A

公开(公告)日：1996-04-02

申请号：US220256

申请日：1994-03-30

申请人： Takayuki Atarashi ,  Toshio Hatada ,  Tetsuya Tanaka ,  Toshiki Iino ,  Kenichi Kasai ,  Takahiro Daikoku ,  Tamotsu Tsukaguchi

发明人： Takayuki Atarashi ,  Toshio Hatada ,  Tetsuya Tanaka ,  Toshiki Iino ,  Kenichi Kasai ,  Takahiro Daikoku ,  Tamotsu Tsukaguchi

IPC分类号： H01L23/36 ,  H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002

摘要： An electronic equipment has a cooling structure in which air discharged from heat sinks can be recovered without any leakage and compact blow ducts and discharge ducts are disposed in a narrow space. A supply opening and a discharge opening for cooling air are independently formed in a heat sink. A plurality of supply branched ducts and discharge branched ducts are combined in a comb-like shape along the axis of the ducts. Ejection openings for cooling air are formed on each of the supply branched ducts in positions corresponding to each of the heat sinks. Such ejection openings are closely connected to the supply openings for cooling air of the heat sinks. On the other hand, recovery openings for cooling air are formed on each of the refrigerant discharge ducts in a position corresponding to each of the heat sinks. Such recovery openings are closely connected to the discharge openings for gas refrigerant of the heat sinks.

摘要翻译： 电子设备具有冷却结构，其中可以在没有泄漏的情况下回收从散热器排出的空气，并且在狭窄的空间中设置紧凑的吹气管道和排放管道。 用于冷却空气的供给开口和排出口独立地形成在散热器中。 多个供应分支管道和排出分支管道沿着管道的轴线组合成梳状形状。 在每个供应分支管道上，在对应于每个散热器的位置中形成用于冷却空气的喷射开口。 这样的喷射开口紧密地连接到用于冷却散热器的空气的供应开口。 另一方面，冷却空气的回收开口形成在与各散热器对应的位置上的每个制冷剂排出管上。 这种回收开口与散热器的气体制冷剂的排出口紧密连接。

公开(公告)号：US4538960A

公开(公告)日：1985-09-03

申请号：US234178

申请日：1981-02-13

申请人： Toshiki Iino ,  Kunio Kamata

发明人： Toshiki Iino ,  Kunio Kamata

IPC分类号： F04D15/00 ,  F01D3/04

CPC分类号： F01D3/04

摘要： This invention relates to an axial thrust balancing device for pumps which cancels an axial thrust caused by impellers by utilizing a discharge water pressure. In the device, there is provided a small axial gap between a low pressure sidewall of a balancing drum tightly fitted over a shaft of impellers and a flange-like end wall extending inwardly from a stationary wall along the low pressure sidewall of said balancing drum. On application of the device to a vertical pump, in particular, the balancing drum is prevented from being in contact with the end wall during suspension of operation.

摘要翻译： 本发明涉及一种用于泵的轴向推力平衡装置，其通过利用排放水压来抵消由叶轮引起的轴向推力。 在该装置中，提供了紧密配合在叶轮轴上的平衡鼓的低压侧壁与沿着所述平衡鼓的低压侧壁从固定壁向内延伸的凸缘状端壁之间的小的轴向间隙。 在将装置应用于垂直泵时，尤其是在操作暂停期间防止平衡滚筒与端壁接触。

公开(公告)号：US4493610A

公开(公告)日：1985-01-15

申请号：US436715

申请日：1982-10-26

申请人： Toshiki Iino ,  Hiromi Kaneko ,  Michiyuki Takagi ,  Kazuhiro Komatsu

发明人： Toshiki Iino ,  Hiromi Kaneko ,  Michiyuki Takagi ,  Kazuhiro Komatsu

IPC分类号： F04D15/00 ,  F01D3/00 ,  F01D25/04 ,  F01D3/04

CPC分类号： F01D25/04 ,  F01D3/00

摘要： An axial thrust balancing system including a sleeve for balancing an axial thrust applied to a rotary shaft and a bush defining therebetween a clearance having arranged therein at least one pressure chamber for dividing the clearance into a plurality of smaller clearances. The axial division of the clearance reduced the ratio of the axial length of the clearance to the diameter of the sleeve and stabilizes the bearing characteristics of a film of fluid in the clearance, thereby inhibiting the generation of a self-excited vibration of the shaft up to a high rotation velocity.

摘要翻译： 一种轴向推力平衡系统，包括用于平衡施加到旋转轴的轴向推力的套筒和在其间限定有间隙的衬套，其间布置有至少一个压力室，用于将所述间隙分成多个更小的间隙。 间隙的轴向间隔减小了间隙的轴向长度与套筒的直径的比率，并且使间隙中的流体膜的轴承特性稳定，从而抑制了轴的自激振动的产生 到高转速。