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公开(公告)号：US20090017299A1
公开(公告)日：2009-01-15
申请号：US12170139
申请日：2008-07-09
IPC分类号： B32B7/12
CPC分类号： C08L9/02 , B41M5/42 , B41M5/44 , B41M5/502 , B41M5/504 , B41M2205/04 , B41M2205/36 , C08F212/08 , C08F218/08 , C08F220/06 , C08F220/14 , C08F220/18 , C08F220/44 , C08F220/58 , C08F222/02 , C08L13/00 , C08L33/08 , C08L51/003 , C08L51/04 , C08L2666/04 , C09J133/18 , G03G7/004 , G03G8/00 , Y10T428/2896 , C08L2666/02
摘要： An object of the present invention is to provide a thermosensitive adhesive material which is superior in blocking resistance when not active and which has adequate adhesion in a wide temperature range to a target with little smoothness such as corrugated fiberboard. Specifically, the present invention relates to a thermosensitive adhesive material including a support, and a thermosensitive adhesive layer provided on one surface of the support, the thermosensitive adhesive layer containing as essential components a thermoplastic resin and a hot-melt material that melts when heated, wherein the thermoplastic resin contains as a main component a (meth)acrylic copolymer in which acrylonitrile, a monomer component, occupies 5% by mass to 20% by mass of all monomer components, and wherein the glass transition temperature of the copolymer is in the range of −70° C. to −30° C.
摘要翻译： 本发明的目的是提供一种热敏粘合材料，其在无活性时具有优异的抗粘连性，并且在宽的温度范围内具有足够的粘合性，使其具有很小平滑度的目标，例如瓦楞纸。 具体而言，本发明涉及一种热敏粘合剂材料，其包括载体和设置在载体的一个表面上的热敏粘合剂层，热敏粘合剂层包含作为热塑性树脂的主要组分和在加热时熔化的热熔性材料， 其中所述热塑性树脂作为主要成分含有（甲基）丙烯酸共聚物，其中丙烯腈，单体组分占所有单体成分的5质量％至20质量％，并且其中所述共聚物的玻璃化转变温度为 范围为-70°C至-30°C
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2.发明申请公开(公告)号：US20080026205A1
公开(公告)日：2008-01-31
申请号：US11881234
申请日：2007-07-26
申请人： Takayuki Sasaki , Mitsunobu Morita , Takehito Yamaguchi , Kunio Hayakawa , Hitoshi Shimbo , Yutaka Kuga
发明人： Takayuki Sasaki , Mitsunobu Morita , Takehito Yamaguchi , Kunio Hayakawa , Hitoshi Shimbo , Yutaka Kuga
CPC分类号： B41M5/42 , B41M5/423 , B41M5/44 , B41M2205/04 , B41M2205/36 , C08K5/005 , C08K5/1345 , C08K5/50 , C08K5/526 , C08L13/00 , C09J7/29 , C09J7/385 , C09J2201/162 , C09J2205/102 , C09J2205/106 , C09J2205/11 , C09J2433/00 , C09J2453/00 , Y10T428/24942 , Y10T428/25 , Y10T428/273 , Y10T428/2826
摘要： A heat-sensitive pressure-sensitive adhesive which contains at least a thermoplastic resin and a thermofusible material, wherein the thermoplastic resin has a glass transition temperature of −70° C. to −30° C., and the thermofusible material comprises triphenylphosphine, and at least any one of tris(2,4-di-t-butylphenyl)phosphite and tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate]methane, or a heat-sensitive pressure-sensitive adhesive which contains at least a thermoplastic resin, a thermofusible material and a non-thermofusible material, wherein the thermofusible material contains triphenylphosphine.
摘要翻译： 含有至少热塑性树脂和热熔性材料的热敏压敏粘合剂，其中所述热塑性树脂的玻璃化转变温度为-70℃至-30℃，所述热熔性材料包括三苯基膦，和 亚磷酸三（2,4-二叔丁基苯基）酯和四[3-（3,5-二叔丁基-4-羟基苯基）丙酸酯]甲烷中的至少一种或热敏感应 含有至少热塑性树脂的粘合剂，热熔性材料和非热熔性材料，其中所述热熔性材料含有三苯基膦。
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3.发明授权公开(公告)号：US07993732B2
公开(公告)日：2011-08-09
申请号：US11881234
申请日：2007-07-26
申请人： Takayuki Sasaki , Mitsunobu Morita , Takehito Yamaguchi , Kunio Hayakawa , Hitoshi Shimbo , Yutaka Kuga
发明人： Takayuki Sasaki , Mitsunobu Morita , Takehito Yamaguchi , Kunio Hayakawa , Hitoshi Shimbo , Yutaka Kuga
IPC分类号： B32B7/02
CPC分类号： B41M5/42 , B41M5/423 , B41M5/44 , B41M2205/04 , B41M2205/36 , C08K5/005 , C08K5/1345 , C08K5/50 , C08K5/526 , C08L13/00 , C09J7/29 , C09J7/385 , C09J2201/162 , C09J2205/102 , C09J2205/106 , C09J2205/11 , C09J2433/00 , C09J2453/00 , Y10T428/24942 , Y10T428/25 , Y10T428/273 , Y10T428/2826
摘要： A heat-sensitive pressure-sensitive adhesive which contains at least a thermoplastic resin and a thermofusible material, wherein the thermoplastic resin has a glass transition temperature of −70° C. to −30° C., and the thermofusible material comprises triphenylphosphine, and at least any one of tris(2,4-di-t-butylphenyl)phosphite and tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate]methane, or a heat-sensitive pressure-sensitive adhesive which contains at least a thermoplastic resin, a thermofusible material and a non-thermofusible material, wherein the thermofusible material contains triphenylphosphine.
摘要翻译： 含有至少热塑性树脂和热熔性材料的热敏压敏粘合剂，其中所述热塑性树脂的玻璃化转变温度为-70℃至-30℃，所述热熔性材料包括三苯基膦，和 亚磷酸三（2,4-二叔丁基苯基）酯和四[3-（3,5-二叔丁基-4-羟基苯基）丙酸酯]甲烷中的至少一种或热敏感应 含有至少热塑性树脂的粘合剂，热熔性材料和非热熔性材料，其中所述热熔性材料含有三苯基膦。
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公开(公告)号：US08354359B2
公开(公告)日：2013-01-15
申请号：US11899868
申请日：2007-09-07
IPC分类号： B41M5/20
CPC分类号： B41M5/42 , B41M5/423 , B41M5/44 , B41M2205/04 , B41M2205/36 , C09J7/35 , C09J2205/11 , C09J2407/00 , C09J2433/00 , Y10T428/249982 , Y10T428/2813 , Y10T428/2817 , Y10T428/2826
摘要： Provided is a heat-sensitive adhesive agent that mainly comprises a thermoplastic resin and a heat-meltable substance capable of melting upon heating, and further comprises swellable mica.
摘要翻译： 本发明提供一种热敏粘合剂，其主要包括热塑性树脂和能够加热熔融的热熔性物质，并且还包括可膨胀的云母。
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公开(公告)号：US20080176012A1
公开(公告)日：2008-07-24
申请号：US11899868
申请日：2007-09-07
CPC分类号： B41M5/42 , B41M5/423 , B41M5/44 , B41M2205/04 , B41M2205/36 , C09J7/35 , C09J2205/11 , C09J2407/00 , C09J2433/00 , Y10T428/249982 , Y10T428/2813 , Y10T428/2817 , Y10T428/2826
摘要： Provided is a heat-sensitive adhesive agent that mainly comprises a thermoplastic resin and a heat-meltable substance capable of melting upon heating, and further comprises swellable mica.
摘要翻译： 本发明提供一种热敏粘合剂，其主要包括热塑性树脂和能够加热熔融的热熔性物质，并且还包括可膨胀的云母。
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6.发明授权公开(公告)号：US07989529B2
公开(公告)日：2011-08-02
申请号：US11598132
申请日：2006-11-10
CPC分类号： C09J11/02 , B41M5/42 , B41M5/504 , B41M2205/32 , C08K5/0016 , C08K5/11 , C08K5/3475 , C08K5/50 , C08L43/00 , C09J7/29 , C09J7/35 , C09J2201/162 , C09J2205/102 , C09J2205/11 , Y10T428/24355 , Y10T428/24802 , Y10T428/249971 , Y10T428/31504
摘要： A thermosensitive adhesive composition including a thermosensitive plastic resin, a dispersing agent, a solid plasticizing agent and a eutectic agent represented by the following chemical structure (1): wherein X1 and X2 independently represent any one of a hydrogen atom, a halogen atom and an alkyl group, p and q independently represent an integer of from 1 to 5.
摘要翻译： 一种热敏粘合剂组合物，其包含热敏塑料树脂，分散剂，固体增塑剂和由以下化学结构（1）表示的共晶剂：其中X1和X2独立地表示氢原子，卤素原子和 烷基，p和q独立地表示1〜5的整数。
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7.发明申请公开(公告)号：US20070112113A1
公开(公告)日：2007-05-17
申请号：US11598132
申请日：2006-11-10
CPC分类号： C09J11/02 , B41M5/42 , B41M5/504 , B41M2205/32 , C08K5/0016 , C08K5/11 , C08K5/3475 , C08K5/50 , C08L43/00 , C09J7/29 , C09J7/35 , C09J2201/162 , C09J2205/102 , C09J2205/11 , Y10T428/24355 , Y10T428/24802 , Y10T428/249971 , Y10T428/31504
摘要： A thermosensitive adhesive composition including a thermosensitive plastic resin, a dispersing agent, a solid plasticizing agent and a eutectic agent represented by the following chemical structure (1): wherein X1 and X2 independently represent any one of a hydrogen atom, a halogen atom and an alkyl group, p and q independently represent an integer of from 1 to 5.
摘要翻译： 一种热敏粘合剂组合物，其包含热敏塑料树脂，分散剂，固体增塑剂和由以下化学结构（1）表示的共晶剂：其中X 1和X 2， SUP>独立地表示氢原子，卤素原子和烷基中的任一个，p和q独立地表示1〜5的整数。
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公开(公告)号：US07811661B2
公开(公告)日：2010-10-12
申请号：US11225226
申请日：2005-09-13
申请人： Hiroshi Goto , Tomoyuki Kugo , Mitsunobu Morita , Norihiko Inaba , Tohru Kitano , Takehito Yamaguchi
发明人： Hiroshi Goto , Tomoyuki Kugo , Mitsunobu Morita , Norihiko Inaba , Tohru Kitano , Takehito Yamaguchi
CPC分类号： C09J7/22 , B41M5/42 , B41M5/423 , B41M5/44 , B41M2205/36 , B41M2205/38 , C09J7/35 , Y10T428/249924 , Y10T428/249971 , Y10T428/249987 , Y10T428/28 , Y10T428/2813
摘要： In order to provide heat-sensitive adhesive materials that represent high pressure-sensitive adhesive strength with respect to rough adherends such as cardboards or polyolefin wraps and lower decrease of adhesive strength with time, are thermally activated with lower energy and exhibit excellent blocking resistance, heat-sensitive adhesive materials are disclosed that contain a support, an underlayer, and a heat-sensitive adhesive layer, in this order, wherein the underlayer comprises a thermoplastic resin and a hollow filler, and the glass transition temperature of the thermoplastic resin is −70° C. or higher and below 0° C.
摘要翻译： 为了提供相对于诸如纸板或聚烯烃膜的粗糙被粘物表现出高压敏粘合强度的热敏粘合剂材料和随时间降低的粘合强度，以较低的能量热活化并表现出优异的抗粘连性，热性 公开了含有载体，底层和热敏粘合剂层的感光性粘合剂材料，其中底层包含热塑性树脂和中空填料，热塑性树脂的玻璃化转变温度为-70 ℃以上且低于0℃
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公开(公告)号：US20060068191A1
公开(公告)日：2006-03-30
申请号：US11225226
申请日：2005-09-13
申请人： Hiroshi Goto , Tomoyuki Kugo , Mitsunobu Morita , Norihiko Inaba , Tohru Kitano , Takehito Yamaguchi
发明人： Hiroshi Goto , Tomoyuki Kugo , Mitsunobu Morita , Norihiko Inaba , Tohru Kitano , Takehito Yamaguchi
CPC分类号： C09J7/22 , B41M5/42 , B41M5/423 , B41M5/44 , B41M2205/36 , B41M2205/38 , C09J7/35 , Y10T428/249924 , Y10T428/249971 , Y10T428/249987 , Y10T428/28 , Y10T428/2813
摘要： In order to provide heat-sensitive adhesive materials that represent high pressure-sensitive adhesive strength with respect to rough adherends such as cardboards or polyolefin wraps and lower decrease of adhesive strength with time, are thermally activated with lower energy and exhibit excellent blocking resistance, heat-sensitive adhesive materials are disclosed that contain a support, an underlayer, and a heat-sensitive adhesive layer, in this order, wherein the underlayer comprises a thermoplastic resin and a hollow filler, and the glass transition temperature of the thermoplastic resin is −70° C. or higher and below 0° C.
摘要翻译： 为了提供相对于诸如纸板或聚烯烃膜的粗糙被粘物表现出高压敏粘合强度的热敏粘合剂材料和随时间降低的粘合强度，以较低的能量热活化并表现出优异的抗粘连性，热性 公开了含有载体，底层和热敏粘合剂层的感光性粘合剂材料，其中底层包含热塑性树脂和中空填料，热塑性树脂的玻璃化转变温度为-70 ℃以上且低于0℃
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公开(公告)号：US10829631B2
公开(公告)日：2020-11-10
申请号：US16458464
申请日：2019-07-01
申请人： Takao Hiraoka , Mitsunobu Morita , Takashi Okada , Soh Noguchi , Tatsuki Yamaguchi , Masahide Kobayashi , Takenori Suenaga
发明人： Takao Hiraoka , Mitsunobu Morita , Takashi Okada , Soh Noguchi , Tatsuki Yamaguchi , Masahide Kobayashi , Takenori Suenaga
摘要： A composition contains an acrylamide compound A1 having an ester structure and a polymerization initiator B1 having a molecular weight of 800 or more.
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