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公开(公告)号:US11721573B2
公开(公告)日:2023-08-08
申请号:US17302437
申请日:2021-05-03
Applicant: HIWIN TECHNOLOGIES CORP.
Inventor: Yan-Yu Chen , Ming-Shiou Liu
CPC classification number: H01L21/681 , G01B11/24 , G01B11/26
Abstract: A method for detecting positions of wafers includes: rotating a rotation table with a wafer thereon in a first direction at a first speed; detecting a contour of the wafer rotating in the first direction at the first speed to provide contour data; rotating the rotation table in a second direction at a second speed when an aiming feature of the wafer passes the detector in the first direction at the first speed; detecting the contour of the wafer rotating in the second direction at the second speed to provide new contour data; and stopping the rotation of the rotation table and the detection of the wafer according to an accumulation of contour data and corresponding rotation angles, to estimate an eccentric position of the wafer and a position of the aiming feature when the aiming feature passes the detector in the second direction at the second speed.
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公开(公告)号:US20200269422A1
公开(公告)日:2020-08-27
申请号:US16281116
申请日:2019-02-21
Applicant: HIWIN TECHNOLOGIES CORP.
Inventor: Mei-Yu Huang , Ming-Shiou Liu
Abstract: A system for eliminating interference of randomly stacked workpieces is disclosed. The system includes a three-dimensional sensing module, a pick-up apparatus and a control module. The control module is coupled to the three-dimensional sensing module and the pick-up apparatus. The control module is configured to control the three-dimensional sensing module to capture a three-dimensional image, analyze the three-dimensional image to obtain an image information, select a target workpiece to be picked up according to the image information, arrange an interference elimination path for the target workpiece, and control the pick-up apparatus to eliminate interference of the target workpiece according to the interference elimination path.
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公开(公告)号:US20220072717A1
公开(公告)日:2022-03-10
申请号:US17303576
申请日:2021-06-02
Applicant: HIWIN TECHNOLOGIES CORP.
Inventor: Ming-Shiou Liu , Chen-Ming Wong
IPC: B25J15/02
Abstract: A gripper device includes a base and two gripping assemblies, each including a gripping member, a stand, and an elastic member. The gripping member includes a gripping portion and a supporting portion. The stand is movably disposed to the base and includes a connecter and a supporter. The supporting portion is pivotally connected to the supporter at a position between the gripping portion and the connecter so that the gripping member is pivotable relative to the stand. Two opposite ends of the elastic member are respectively connected to the supporting portion and the connecter. When one of the gripping portions touches an object, the gripping member pivots relative to the corresponding stand. Therefore, gripping a target may not be interrupted by interference objects around the target.
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公开(公告)号:US20220059382A1
公开(公告)日:2022-02-24
申请号:US17302437
申请日:2021-05-03
Applicant: HIWIN TECHNOLOGIES CORP.
Inventor: Yan-Yu Chen , Ming-Shiou Liu
Abstract: A method and an apparatus for detecting positions of wafers. A rotation table, on which the wafer with an aiming feature is disposed, rotates in a direction at a faster speed while a detector detects a periphery of the wafer and provides a controller with a detection result. The rotation table rotates in an opposite direction at a slower speed after the aiming feature passes the detector, while the detector detects the periphery of the wafer and provides the controller with a new detection result. A respective detection result corresponds to a rotation angle. When the aiming feature passes the detector again, the rotation table stops rotating, and the controller computes the eccentric position of the wafer and the position of the aiming feature according to the detection results and their rotation angles. Therefore, the time for detection may decrease.
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公开(公告)号:US11485015B2
公开(公告)日:2022-11-01
申请号:US16281116
申请日:2019-02-21
Applicant: HIWIN TECHNOLOGIES CORP.
Inventor: Mei-Yu Huang , Ming-Shiou Liu
Abstract: A system for eliminating interference of randomly stacked workpieces is disclosed. The system includes a three-dimensional sensing module, a pick-up apparatus and a control module. The control module is coupled to the three-dimensional sensing module and the pick-up apparatus. The control module is configured to control the three-dimensional sensing module to capture a three-dimensional image, analyze the three-dimensional image to obtain an image information, select a target workpiece to be picked up according to the image information, arrange an interference elimination path for the target workpiece, and control the pick-up apparatus to eliminate interference of the target workpiece according to the interference elimination path.
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公开(公告)号:US09964156B2
公开(公告)日:2018-05-08
申请号:US14803474
申请日:2015-07-20
Applicant: HIWIN TECHNOLOGIES CORP.
Inventor: Chen-Ming Wong , Ming-Shiou Liu , Yan-Shun Huang
IPC: B23B31/171 , F16D1/10 , B23B31/107 , B25J15/04
CPC classification number: F16D1/10 , B23B31/1074 , B23B2260/136 , B25J15/0408 , F16D1/112
Abstract: A mechanical end-effector changer includes a first connection unit and a second connection unit. The first connection unit has mounted therein multiple movable members and mating elastic members. Subject to the linking relationship between each movable member and the respective elastic member, the first connection unit and the second connection unit can be automatically connected together or detached from each other, facilitating end-effector change.
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公开(公告)号:US11850734B2
公开(公告)日:2023-12-26
申请号:US17303576
申请日:2021-06-02
Applicant: HIWIN TECHNOLOGIES CORP.
Inventor: Ming-Shiou Liu , Chen-Ming Wong
IPC: B25J15/02
CPC classification number: B25J15/0206
Abstract: A gripper device includes a base and two gripping assemblies, each including a gripping member, a stand, and an elastic member. The gripping member includes a gripping portion and a supporting portion. The stand is movably disposed to the base and includes a connecter and a supporter. The supporting portion is pivotally connected to the supporter at a position between the gripping portion and the connecter so that the gripping member is pivotable relative to the stand. Two opposite ends of the elastic member are respectively connected to the supporting portion and the connecter. When one of the gripping portions touches an object, the gripping member pivots relative to the corresponding stand. Therefore, gripping a target may not be interrupted by interference objects around the target.
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公开(公告)号:US10520424B2
公开(公告)日:2019-12-31
申请号:US15943808
申请日:2018-04-03
Applicant: Hiwin Technologies Corp.
Inventor: Ming-Shiou Liu
Abstract: A method includes selecting a candidate image property data set and a corresponding candidate light source parameter set, obtaining multiple adjusted light source parameter sets based on the candidate light source parameter set, projecting light onto an article and capturing images in multiple projecting modes, one by one, according to the adjusted light source parameter sets, obtaining multiple adjusted image property data sets each from the images captured in one projecting mode, and selecting a target image property data set from the adjusted image property data sets and a corresponding target light source parameter set.
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公开(公告)号:US20190302004A1
公开(公告)日:2019-10-03
申请号:US15943808
申请日:2018-04-03
Applicant: Hiwin Technologies Corp.
Inventor: Ming-Shiou Liu
Abstract: A method includes selecting a candidate image property data set and a corresponding candidate light source parameter set, obtaining multiple adjusted light source parameter sets based on the candidate light source parameter set, projecting light onto an article and capturing images in multiple projecting modes, one by one, according to the adjusted light source parameter sets, obtaining multiple adjusted image property data sets each from the images captured in one projecting mode, and selecting a target image property data set from the adjusted image property data sets and a corresponding target light source parameter set.
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