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公开(公告)号：US20230121991A1
公开(公告)日：2023-04-20
申请号：US17501043
申请日：2021-10-14
IPC分类号： H01L23/00 , H01L25/065
摘要： A multichip module comprises a carrier, a plurality of chips, an electrical insulating layer, and an electrical interconnect structure. The carrier includes a bottom wall and four side walls defining an internal cavity. The chips are positioned in the internal cavity, with each chip including a plurality of bond pads. The electrical insulating layer is formed from electrically insulating material and is positioned on an upper surface of the carrier and the chips. The electrical interconnect structure includes a plurality of interconnect traces, with each interconnect trace formed from electrically conductive material and electrically connected to a first bond pad on a first chip and a second bond pad on a second chip. Each interconnect trace includes a bridge having a segment that is spaced apart from, and positioned above, the electrical insulating layer.
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公开(公告)号：US20230092166A1
公开(公告)日：2023-03-23
申请号：US17482992
申请日：2021-09-23
发明人： Barbara Diane Young , Steven James Sedlock , Gregory Layton Lane, JR. , Kevin Christopher Ledden
IPC分类号： G03F7/20 , H01L21/027
摘要： A system, device, and method for imparting or transferring a geometric pattern on the surface of a substrate. The device comprises, a housing forming at least a partially enclosed space, a light source body comprising an array of light emitters, a base disposed below the light source body and configured for supporting the substrate having a photoresist layer thereon, and a controller for activating a predetermined number of individual light emitters corresponding to the predetermined geometric pattern. Each individual light emitter within the array of light emitters is selectively activatable to emit a light. The array of light emitters comprises a plurality of light-emitting diodes, a plurality of quantum dots, or both.
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公开(公告)号：US20230411827A1
公开(公告)日：2023-12-21
申请号：US18461654
申请日：2023-09-06
CPC分类号： H01Q1/2283 , H01Q1/422 , H01Q1/38
摘要： A method for tuning a resonant frequency of wireless communication circuitry on a multichip module including a plurality of chips includes applying an electrical insulator to an upper surface of the multichip module; creating a plurality of openings in the electrical insulator, each opening being positioned at a successive one of the bond pads to be electrically connected to create a plurality of exposed bond pads; applying metal to each exposed bond pad to form a successive one of a plurality of interconnect bases; removing a portion of the layer of photoresist to create a plurality of bridge supports, each bridge support positioned between a successive pair of interconnect bases; applying metal to each bridge support and associated interconnect bases to form a successive one of the interconnect traces; removing the bridge supports; and disconnecting one or more of the interconnect traces as necessary to obtain a target resonant frequency.
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公开(公告)号：US11806964B2
公开(公告)日：2023-11-07
申请号：US17462273
申请日：2021-08-31
CPC分类号： B32B15/017 , B32B15/012 , Y10T428/1275 , Y10T428/12903 , Y10T428/12944 , Y10T428/12951
摘要： Systems, methods, components, and parts are provided for improving casting and electroplating performance of a plated cast part by doping a semiconductor material with an electrically active dopant before mixing the semiconductor material into a base material. The doped semiconductor material improves the castability of the base material and has an improved electrical conductivity which is closer to that of the base material such that a consistency of a subsequent plating on the part is improved.
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公开(公告)号：US12062834B2
公开(公告)日：2024-08-13
申请号：US18461654
申请日：2023-09-06
CPC分类号： H01Q1/2283 , H01Q1/38 , H01Q1/422
摘要： A method for tuning a resonant frequency of wireless communication circuitry on a multichip module including a plurality of chips includes applying an electrical insulator to an upper surface of the multichip module; creating a plurality of openings in the electrical insulator, each opening being positioned at a successive one of the bond pads to be electrically connected to create a plurality of exposed bond pads; applying metal to each exposed bond pad to form a successive one of a plurality of interconnect bases; removing a portion of the layer of photoresist to create a plurality of bridge supports, each bridge support positioned between a successive pair of interconnect bases; applying metal to each bridge support and associated interconnect bases to form a successive one of the interconnect traces; removing the bridge supports; and disconnecting one or more of the interconnect traces as necessary to obtain a target resonant frequency.
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公开(公告)号：US20230128829A1
公开(公告)日：2023-04-27
申请号：US17511054
申请日：2021-10-26
摘要： A method for tuning a resonant frequency of wireless communication circuitry on a multichip module including a plurality of chips includes applying an electrical insulator to an upper surface of the multichip module; creating a plurality of openings in the electrical insulator, each opening being positioned at a successive one of the bond pads to be electrically connected to create a plurality of exposed bond pads; applying metal to each exposed bond pad to form a successive one of a plurality of interconnect bases; removing a portion of the layer of photoresist to create a plurality of bridge supports, each bridge support positioned between a successive pair of interconnect bases; applying metal to each bridge support and associated interconnect bases to form a successive one of the interconnect traces; removing the bridge supports; and disconnecting one or more of the interconnect traces as necessary to obtain a target resonant frequency.
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公开(公告)号：US20230063553A1
公开(公告)日：2023-03-02
申请号：US17462273
申请日：2021-08-31
摘要： Systems, methods, components, and parts are provided for improving casting and electroplating performance of a plated cast part by doping a semiconductor material with an electrically active dopant before mixing the semiconductor material into a base material. The doped semiconductor material improves the castability of the base material and has an improved electrical conductivity which is closer to that of the base material such that a consistency of a subsequent plating on the part is improved.
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公开(公告)号：US11880139B2
公开(公告)日：2024-01-23
申请号：US17482992
申请日：2021-09-23
发明人： Barbara Diane Young , Steven James Sedlock , Gregory Layton Lane, Jr. , Kevin Christopher Ledden
IPC分类号： G03F7/00 , H01L21/027
CPC分类号： G03F7/70275 , G03F7/70008 , G03F7/70575 , H01L21/0274
摘要： A system, device, and method for imparting or transferring a geometric pattern on the surface of a substrate. The device comprises, a housing forming at least a partially enclosed space, a light source body comprising an array of light emitters, a base disposed below the light source body and configured for supporting the substrate having a photoresist layer thereon, and a controller for activating a predetermined number of individual light emitters corresponding to the predetermined geometric pattern. Each individual light emitter within the array of light emitters is selectively activatable to emit a light. The array of light emitters comprises a plurality of light-emitting diodes, a plurality of quantum dots, or both.
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公开(公告)号：US11811132B2
公开(公告)日：2023-11-07
申请号：US17511054
申请日：2021-10-26
CPC分类号： H01Q1/2283 , H01Q1/38 , H01Q1/422
摘要： A method for tuning a resonant frequency of wireless communication circuitry on a multichip module including a plurality of chips includes applying an electrical insulator to an upper surface of the multichip module; creating a plurality of openings in the electrical insulator, each opening being positioned at a successive one of the bond pads to be electrically connected to create a plurality of exposed bond pads; applying metal to each exposed bond pad to form a successive one of a plurality of interconnect bases; removing a portion of the layer of photoresist to create a plurality of bridge supports, each bridge support positioned between a successive pair of interconnect bases; applying metal to each bridge support and associated interconnect bases to form a successive one of the interconnect traces; removing the bridge supports; and disconnecting one or more of the interconnect traces as necessary to obtain a target resonant frequency.
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公开(公告)号：US11810895B2
公开(公告)日：2023-11-07
申请号：US17501043
申请日：2021-10-14
IPC分类号： H01L23/00 , H01L25/065
CPC分类号： H01L24/82 , H01L24/24 , H01L25/0655 , H01L24/06 , H01L24/25 , H01L2224/06165 , H01L2224/2405 , H01L2224/24011 , H01L2224/24101 , H01L2224/24137 , H01L2224/25175 , H01L2224/82002 , H01L2224/82101 , H01L2224/82106 , H01L2224/82986 , H01L2924/3512
摘要： A multichip module comprises a carrier, a plurality of chips, an electrical insulating layer, and an electrical interconnect structure. The carrier includes a bottom wall and four side walls defining an internal cavity. The chips are positioned in the internal cavity, with each chip including a plurality of bond pads. The electrical insulating layer is formed from electrically insulating material and is positioned on an upper surface of the carrier and the chips. The electrical interconnect structure includes a plurality of interconnect traces, with each interconnect trace formed from electrically conductive material and electrically connected to a first bond pad on a first chip and a second bond pad on a second chip. Each interconnect trace includes a bridge having a segment that is spaced apart from, and positioned above, the electrical insulating layer.
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