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公开(公告)号：US11428593B2
公开(公告)日：2022-08-30
申请号：US16689933
申请日：2019-11-20
发明人： Lokesha Bhat , Palani Thanigachalam , Vijaya Krishna N K , Vijayakumar S , Shridhara Shanbhogue
摘要： Methods and apparatuses related to freeze resistant sensing assemblies are provided. An example pressure sensing assembly may include: a first member defining an aperture, the aperture comprising an inner opening disposed on an inner surface of the first member and an outer opening disposed on an outer surface of the first member; a protection diaphragm disposed on the inner surface of the first member; and a sensing diaphragm disposed in a second member fastened to the first member.
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公开(公告)号：US11592349B2
公开(公告)日：2023-02-28
申请号：US17248660
申请日：2021-02-02
发明人： Palani Thanigachalam , Vijayakumar S , Nirmala H J
摘要： Example apparatuses and systems for a combined temperature and pressure sensing device with improved electronic protection are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.
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公开(公告)号：US20240124717A1
公开(公告)日：2024-04-18
申请号：US18475865
申请日：2023-09-27
发明人： Sandeep MAUT , Vijayakumar S , Nikhil P.S.
IPC分类号： C09D5/18 , C09D179/08 , C09D183/06
CPC分类号： C09D5/18 , C09D179/08 , C09D183/06 , H05K5/0247
摘要： Various embodiments are directed to a method for protecting an electronic comprising: depositing a first epoxy resin on the electronic component; curing the first epoxy resin to form a first cured epoxy layer, disposing a polyimide film on the first cured epoxy layer to form a polyimide layer, depositing a second epoxy resin on the polyimide layer, and curing the second epoxy resin to form a second cured epoxy layer. The first cured epoxy layer, the polyimide layer, and the second epoxy layer form a multi-layered protective coating that is configured at least in part to protect the electronic component from at least adverse effects from varying light intensities.
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公开(公告)号：US20210148775A1
公开(公告)日：2021-05-20
申请号：US16689933
申请日：2019-11-20
发明人： Lokesha Bhat , Palani Thanigachalam , Vijaya Krishna N K , Vijayakumar S , Shridhara Shanbhogue
摘要： Methods and apparatuses related to freeze resistant sensing assemblies are provided. An example pressure sensing assembly may include: a first member defining an aperture, the aperture comprising an inner opening disposed on an inner surface of the first member and an outer opening disposed on an outer surface of the first member; a protection diaphragm disposed on the inner surface of the first member; and a sensing diaphragm disposed in a second member fastened to the first member.
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公开(公告)号：US20240019287A1
公开(公告)日：2024-01-18
申请号：US18342895
申请日：2023-06-28
CPC分类号： G01F22/02 , A61B5/02042 , G08B21/182
摘要： Example methods, apparatuses, and computer program products for measuring fluid volumes are provided. An example fluid volume measuring assembly includes a first perforated tube, a total fluid volume measuring device, and a non-blood fluid volume measuring device. In some examples, the total fluid volume measuring device includes a membrane sack positioned in the first perforated tube and a first pressure sensor positioned in the membrane sack. In some examples, the non-blood fluid volume measuring device includes a second perforated tube covered by a filter paper and positioned in the first perforated tube and a second pressure sensor positioned in the second perforated tube.
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公开(公告)号：US11852550B2
公开(公告)日：2023-12-26
申请号：US18160227
申请日：2023-01-26
发明人： Palani Thanigachalam , Vijayakumar S , Nirmala HJ
CPC分类号： G01L19/0092 , G01K7/16 , G01L9/0035
摘要： Example apparatuses and systems for a combined temperature and pressure sensing device with improved electronic protection are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.
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7.发明公开公开(公告)号：US20230168140A1
公开(公告)日：2023-06-01
申请号：US18160227
申请日：2023-01-26
发明人： Palani THANIGACHALAM , Vijayakumar S , Nirmala HJ
CPC分类号： G01L19/0092 , G01K7/16 , G01L9/0035
摘要： Example methods, apparatuses and systems for a combined temperature and pressure sensing device are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.
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公开(公告)号：US20220244125A1
公开(公告)日：2022-08-04
申请号：US17248660
申请日：2021-02-02
发明人： Palani THANIGACHALAM , Vijayakumar S , Nirmala HJ
摘要： Example methods, apparatuses and systems for a combined temperature and pressure sensing device are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.
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9.发明授权公开(公告)号：US11268928B2
公开(公告)日：2022-03-08
申请号：US16019373
申请日：2018-06-26
发明人： Richard Wade , Keith Francis Edwin Pratt , Robert Higashi , Scott Edward Beck , Vijayakumar S , Cristian Diaconu
IPC分类号： G01N27/407 , G01N33/00 , B81B1/00 , G01N27/404 , G01N27/406 , G01N27/30
摘要： Apparatus and associated methods relate to a compact gas sensor (CGS) including a housing with a central stepped cavity with one or more first lead contact(s) forming a portion of a base plane in a bottom of the cavity and one or more second lead contact(s) forming a portion of a stepped plane higher than the base plane, the cavity sized to receive a chemically based stack of material made up of a bottom diffusion electrode layer, a middle electrolyte gel layer, and a top diffusion electrode layer. The bottom diffusion electrode layer is in electrical contact with the first lead contact(s). The top diffusion electrode layer electrically couples to the second lead contact(s) via an overlaying micro electromechanical system (MEMS) element layer with conductive coating. In an illustrative example, the CGS may provide gas sensing in small spaces.
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10.发明申请公开(公告)号：US20180372675A1
公开(公告)日：2018-12-27
申请号：US16019373
申请日：2018-06-26
发明人： Richard Wade , Keith Francis Edwin Pratt , Robert Higashi , Scott Edward Beck , Vijayakumar S , Cristian Diaconu
IPC分类号： G01N27/407 , G01N33/00 , G01N27/406 , B81B1/00
摘要： Apparatus and associated methods relate to a compact gas sensor (CGS) including a housing with a central stepped cavity with one or more first lead contact(s) forming a portion of a base plane in a bottom of the cavity and one or more second lead contact(s) forming a portion of a stepped plane higher than the base plane, the cavity sized to receive a chemically based stack of material made up of a bottom diffusion electrode layer, a middle electrolyte gel layer, and a top diffusion electrode layer. The bottom diffusion electrode layer is in electrical contact with the first lead contact(s). The top diffusion electrode layer electrically couples to the second lead contact(s) via an overlaying micro electromechanical system (MEMS) element layer with conductive coating. In an illustrative example, the CGS may provide gas sensing in small spaces.
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