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公开(公告)号：US10345130B2
公开(公告)日：2019-07-09
申请号：US15358970
申请日：2016-11-22
摘要： Embodiments relate generally to a sensor for sensing a thermal property of a fluid and may comprise an upstream resistive element having a first resistance that changes with temperature; a downstream resistive element having a second resistance that changes with temperature, wherein the downstream resistive element is situated downstream of the upstream resistive element in the flow direction of the fluid; and at least one tail resistor configured to determine one or more thermal properties of the fluid, wherein the upstream resistive element and the downstream resistive element are operatively connected in a bridge circuit, wherein the at least one tail resistor is stable with temperature, and wherein the at least one tail resistor is electrically coupled to at least one of the upstream resistive element or the downstream resistive element.
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公开(公告)号：US10775217B1
公开(公告)日：2020-09-15
申请号：US16389647
申请日：2019-04-19
发明人： Robert Higashi , Scott Edward Beck , Yong-Fa Wang , Ian Bentley , Bill Hoover
摘要： Example systems, apparatuses, and methods are disclosed sensing a flow of fluid using a thermopile-based flow sensing device. An example apparatus includes a flow sensing device comprising a heating structure having a centerline. The flow sensing device may further comprise a thermopile. At least a portion of the thermopile may be disposed over the heating structure. The thermopile may comprise a first thermocouple having a first thermocouple junction disposed upstream of the centerline of the heating structure. The thermopile may further comprise a second thermocouple having a second thermocouple junction disposed downstream of the centerline of the heating structure.
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公开(公告)号：US20190285453A1
公开(公告)日：2019-09-19
申请号：US15920205
申请日：2018-03-13
发明人： Robert Higashi , Wei Yang
摘要： A sensor for sensing a flow rate of a fluid comprises an upstream resistive element having a first resistance that changes with temperature, a downstream resistive element having a second resistance that changes with temperature, at least one tail resistor configured to determine thermal conductivity of the fluid, at least one pressure sensor configured to determine a differential pressure in the flow direction of the fluid, and circuitry configured to use the differential pressure with the thermal conductivity to determine a kinematic viscosity of the fluid, and compensate an output of the bridge circuit. The downstream resistive element is situated downstream of the upstream resistive element in the flow direction of the fluid, and the upstream resistive element and the downstream resistive element are operatively connected in a bridge circuit.
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公开(公告)号：US20180143051A1
公开(公告)日：2018-05-24
申请号：US15358970
申请日：2016-11-22
IPC分类号： G01F1/69
CPC分类号： G01F1/69 , G01F1/6888 , G01F1/692 , G01F1/7084 , G01N25/18
摘要： Embodiments relate generally to a sensor for sensing a thermal property of a fluid and may comprise an upstream resistive element having a first resistance that changes with temperature; a downstream resistive element having a second resistance that changes with temperature, wherein the downstream resistive element is situated downstream of the upstream resistive element in the flow direction of the fluid; and at least one tail resistor configured to determine one or more thermal properties of the fluid, wherein the upstream resistive element and the downstream resistive element are operatively connected in a bridge circuit, wherein the at least one tail resistor is stable with temperature, and wherein the at least one tail resistor is electrically coupled to at least one of the upstream resistive element or the downstream resistive element.
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公开(公告)号：US11747184B2
公开(公告)日：2023-09-05
申请号：US16992411
申请日：2020-08-13
发明人： Robert Higashi , Scott Edward Beck , Yong-Fa Wang , Ian Bentley , Bill Hoover
IPC分类号： G01F1/688 , G01F1/684 , H10N10/851 , H10N19/00
CPC分类号： G01F1/6888 , G01F1/6847 , H10N10/851 , H10N19/00
摘要： Example systems, apparatuses, and methods are disclosed sensing a flow of fluid using a thermopile-based flow sensing device. An example apparatus includes a flow sensing device comprising a heating structure having a centerline. The flow sensing device may further comprise a thermopile. At least a portion of the thermopile may be disposed over the heating structure. The thermopile may comprise a first thermocouple having a first thermocouple junction disposed upstream of the centerline of the heating structure. The thermopile may further comprise a second thermocouple having a second thermocouple junction disposed downstream of the centerline of the heating structure.
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公开(公告)号：US12078519B2
公开(公告)日：2024-09-03
申请号：US18352767
申请日：2023-07-14
发明人： Robert Higashi , Scott Edward Beck , Yong-Fa Wang , Ian Bentley , Bill Hoover
IPC分类号： G01F1/688 , G01F1/684 , H10N10/851 , H10N19/00
CPC分类号： G01F1/6888 , G01F1/6847 , H10N10/851 , H10N19/00
摘要： Example systems, apparatuses, and methods are disclosed sensing a flow of fluid using a thermopile-based flow sensing device. An example apparatus includes a flow sensing device comprising a heating structure having a centerline. The flow sensing device may further comprise a thermopile. At least a portion of the thermopile may be disposed over the heating structure. The thermopile may comprise a first thermocouple having a first thermocouple junction disposed upstream of the centerline of the heating structure. The thermopile may further comprise a second thermocouple having a second thermocouple junction disposed downstream of the centerline of the heating structure.
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公开(公告)号：US20230358586A1
公开(公告)日：2023-11-09
申请号：US18352767
申请日：2023-07-14
发明人： Robert Higashi , Scott Edward Beck , Yong-Fa Wang , Ian Bentley , Bill Hoover
IPC分类号： G01F1/688 , G01F1/684 , H10N10/851 , H10N19/00
CPC分类号： G01F1/6888 , G01F1/6847 , H10N10/851 , H10N19/00
摘要： Example systems, apparatuses, and methods are disclosed sensing a flow of fluid using a thermopile-based flow sensing device. An example apparatus includes a flow sensing device comprising a heating structure having a centerline. The flow sensing device may further comprise a thermopile. At least a portion of the thermopile may be disposed over the heating structure. The thermopile may comprise a first thermocouple having a first thermocouple junction disposed upstream of the centerline of the heating structure. The thermopile may further comprise a second thermocouple having a second thermocouple junction disposed downstream of the centerline of the heating structure.
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8.发明授权公开(公告)号：US11268928B2
公开(公告)日：2022-03-08
申请号：US16019373
申请日：2018-06-26
发明人： Richard Wade , Keith Francis Edwin Pratt , Robert Higashi , Scott Edward Beck , Vijayakumar S , Cristian Diaconu
IPC分类号： G01N27/407 , G01N33/00 , B81B1/00 , G01N27/404 , G01N27/406 , G01N27/30
摘要： Apparatus and associated methods relate to a compact gas sensor (CGS) including a housing with a central stepped cavity with one or more first lead contact(s) forming a portion of a base plane in a bottom of the cavity and one or more second lead contact(s) forming a portion of a stepped plane higher than the base plane, the cavity sized to receive a chemically based stack of material made up of a bottom diffusion electrode layer, a middle electrolyte gel layer, and a top diffusion electrode layer. The bottom diffusion electrode layer is in electrical contact with the first lead contact(s). The top diffusion electrode layer electrically couples to the second lead contact(s) via an overlaying micro electromechanical system (MEMS) element layer with conductive coating. In an illustrative example, the CGS may provide gas sensing in small spaces.
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公开(公告)号：US10996190B2
公开(公告)日：2021-05-04
申请号：US16178935
申请日：2018-11-02
发明人： Scott Edward Beck , Yong-Fa Wang , Robert Higashi , Philip Clayton Foster , Keith Francis Edwin Pratt , Cristian Vasile Diaconu
IPC分类号： G01N27/407 , G01N27/404 , B81B7/00 , B81C1/00
摘要： Apparatus and associated methods relate to a micro-electro-mechanical system (MEMS) based gas sensor including an electrolyte contacting one or more top electrode(s) arranged on the bottom surface of a top semiconductor substrate (TSS), and one or more bottom electrode(s) arranged on the top of a bottom semiconductor substrate (BSS), the TSS and BSS joined with an adhesive seal around the electrolyte, the sensor including one or more capillaries providing gaseous communication to the electrolyte from an external ambient environment. The electrodes may be electrically accessed by one or more vias to externally accessible bond pads. In some examples, an electrical connection may be made from an additional bond pad on top of the TSS to the electrolyte. Various embodiments may reduce the size of various gas sensors to advantageously allow their inclusion into portable electronic devices.
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10.发明申请公开(公告)号：US20180372675A1
公开(公告)日：2018-12-27
申请号：US16019373
申请日：2018-06-26
发明人： Richard Wade , Keith Francis Edwin Pratt , Robert Higashi , Scott Edward Beck , Vijayakumar S , Cristian Diaconu
IPC分类号： G01N27/407 , G01N33/00 , G01N27/406 , B81B1/00
摘要： Apparatus and associated methods relate to a compact gas sensor (CGS) including a housing with a central stepped cavity with one or more first lead contact(s) forming a portion of a base plane in a bottom of the cavity and one or more second lead contact(s) forming a portion of a stepped plane higher than the base plane, the cavity sized to receive a chemically based stack of material made up of a bottom diffusion electrode layer, a middle electrolyte gel layer, and a top diffusion electrode layer. The bottom diffusion electrode layer is in electrical contact with the first lead contact(s). The top diffusion electrode layer electrically couples to the second lead contact(s) via an overlaying micro electromechanical system (MEMS) element layer with conductive coating. In an illustrative example, the CGS may provide gas sensing in small spaces.
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