CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

    公开(公告)号:US20240276651A1

    公开(公告)日:2024-08-15

    申请号:US18005461

    申请日:2022-08-18

    CPC classification number: H05K3/3468 H05K1/113 H05K3/3485 H05K3/425

    Abstract: A circuit board assembly and an electronic is provided. The circuit board assembly includes at least a frame plate and circuit boards. The frame plate includes a frame body, first soldering portions, and second soldering portions. The frame body has a middle accommodating hole, an inner wall facing the middle accommodating hole, and an outer wall facing away from the middle accommodating hole. The first soldering portions are provided in an intermediate region located on the frame body between the inner wall and the outer wall. At least one of the inner wall and the outer wall is provided with accommodating grooves. The accommodating grooves extend along a thickness direction of the frame plate. The second soldering portions are provided in the accommodating grooves and connected to the frame body. Two circuit boards are respectively provided on two opposite sides of the frame plate along the thickness direction. The circuit board includes pads.

    TERMINAL DEVICE AND COMMUNICATION METHOD

    公开(公告)号:US20230024741A1

    公开(公告)日:2023-01-26

    申请号:US17783882

    申请日:2020-11-16

    Abstract: This application provides a terminal device and a communication method. The terminal device is in a dual-connectivity network including a long term evolution (LTE) link and a new radio (NR) link, and when the terminal device detects that the terminal device is in a power saving mode, and/or when the terminal device detects that battery power of the terminal device is less than or equal to a first preset value, and/or when the terminal device detects that temperature of a rear cover of the terminal device is greater than or equal to a second preset value, the terminal device releases the NR link, and uses the LTE link for communication.

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