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    Manufacturing method and structure of a wafer level image sensor module with package structure
    1.
    发明授权
    Manufacturing method and structure of a wafer level image sensor module with package structure 失效
    具有封装结构的晶片级图像传感器模块的制造方法和结构

    公开(公告)号：US08378441B2

    公开(公告)日：2013-02-19

    申请号：US13010880

    申请日：2011-01-21

    申请人： Hsiu-Wen Tu ,  Chung-Hsien Hsin ,  Han-Hsing Chen ,  Ming-Hui Chen ,  Ren-Long Kuo ,  Chih-Cheng Hsu ,  Young-Houng Shiao ,  Tsao-Pin Chen

    发明人： Hsiu-Wen Tu ,  Chung-Hsien Hsin ,  Han-Hsing Chen ,  Ming-Hui Chen ,  Ren-Long Kuo ,  Chih-Cheng Hsu ,  Young-Houng Shiao ,  Tsao-Pin Chen

    IPC分类号： H01L33/0232 ,  H01L21/00

    CPC分类号： H01L27/14618 ,  H01L24/97 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/13 ,  H01L2924/181 ,  H01L2924/00

    摘要： The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product, a plurality of solder balls, and an encapsulant. The semi-finished product includes an image sensing chip and a wafer level lens assembly. The encapsulant is disposed on lateral sides of the image sensing chip and the wafer level lens assembly. Also, the manufacturing method includes the steps of: providing a silicon wafer, dicing the silicon wafer, providing a lens assembly wafer, fabricating a plurality of semi-finished products, performing a packaging process, mounting the solder balls, and cutting the encapsulant. Accordingly, the encapsulant encapsulates each of the semi-finished products by being disposed on the lateral sides thereof.

    摘要翻译： 本发明公开了一种具有封装结构的晶片级图像传感器模块的制造方法和结构。 具有封装结构的晶片级图像传感器模块的结构包括半成品，多个焊球和密封剂。 半成品包括图像感测芯片和晶片级透镜组件。 密封剂设置在图像感测芯片和晶片级透镜组件的侧面上。 此外，制造方法包括以下步骤：提供硅晶片，切割硅晶片，提供透镜组件晶片，制造多个半成品，执行封装工艺，安装焊球以及切割密封剂。 因此，密封剂通过设置在其两侧而封装每个半成品。

    WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
    5.
    发明申请
    WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR THE SAME 有权
    滤波器水平图像传感器包装结构及其制造方法

    公开(公告)号：US20110291215A1

    公开(公告)日：2011-12-01

    申请号：US12947316

    申请日：2010-11-16

    申请人： Hsiu-Wen Tu ,  Han-Hsing Chen ,  Chung-Hsien Hsin ,  Ming-Hui Chen

    发明人： Hsiu-Wen Tu ,  Han-Hsing Chen ,  Chung-Hsien Hsin ,  Ming-Hui Chen

    IPC分类号： H01L31/0203 ,  H01L31/18

    CPC分类号： H01L27/14618 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/1469 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/13

    摘要： The present invention discloses a wafer level image sensor packaging structure and a manufacturing method for the same. The manufacturing method includes the following steps: providing a silicon wafer with image sensor chips, providing a plurality of transparent lids, allotting one said transparent lid on top of the corresponding image sensor chip, and carrying out a packaging process. The manufacturing method of the invention has the advantage of having a simpler process, lower cost, and higher production yield rate. The encapsulation compound arranges on the first surface of the image sensor chip and covers the circumference of the transparent lid to avoid the side light leakage as traditional chip scale package (CSP). Thus, the sensing performance of the wafer level image sensor packaging structure can be enhanced.

    摘要翻译： 本发明公开了一种晶片级图像传感器封装结构及其制造方法。 该制造方法包括以下步骤：向硅晶片提供图像传感器芯片，提供多个透明盖，在相应的图像传感器芯片的顶部上分配一个所述透明盖，并执行封装处理。 本发明的制造方法具有工艺简单，成本低，生产率高的优点。 封装化合物布置在图像传感器芯片的第一表面上，并覆盖透明盖的周边，以避免像传统芯片级封装（CSP）那样的侧面漏光。 因此，可以提高晶片级图像传感器封装结构的感测性能。

    Manufacturing method and structure for wafer level image sensor module with fixed focal length
    6.
    发明授权
    Manufacturing method and structure for wafer level image sensor module with fixed focal length 有权
    具有固定焦距的晶片级图像传感器模块的制造方法和结构

    公开(公告)号：US08440488B2

    公开(公告)日：2013-05-14

    申请号：US12948020

    申请日：2010-11-17

    申请人： Hsiu-Wen Tu ,  Han-Hsing Chen ,  Chung-Hsien Hsin ,  Ming-Hui Chen

    发明人： Hsiu-Wen Tu ,  Han-Hsing Chen ,  Chung-Hsien Hsin ,  Ming-Hui Chen

    IPC分类号： H01L21/00

    CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14685 ,  H01L27/1469 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2924/0002 ,  H01L2924/00

    摘要： This present invention discloses a manufacturing method and structure for a wafer level image sensor module with fixed focal length. The method includes the following steps. First, a silicon wafer comprising several image sensor chips having a photosensitive area and a lens module array wafer comprising several wafer level lens modules with fixed focal length are provided. Next, the image sensor chips and the wafer level lens modules are sorted in grades according to the different quality grades. According to the sorting results, each of the wafer level lens modules is assigned to be situated above the image sensor chip that has the same grade. At the same time, each of the wafer level lens modules is directed to face the photosensitive area of each image sensor chip. Finally, in the packaging process, the wafer level lens module is surrounded by an encapsulation material.

    摘要翻译： 本发明公开了一种具有固定焦距的晶片级图像传感器模块的制造方法和结构。 该方法包括以下步骤。 首先，提供包括具有感光区域的多个图像传感器芯片和包括具有固定焦距的多个晶片级透镜模块的透镜模块阵列晶片的硅晶片。 接下来，图像传感器芯片和晶片级透镜模块根据不同的质量等级被分级。 根据分选结果，将每个晶片级透镜模块分配为位于具有相同等级的图像传感器芯片上方。 同时，每个晶片级透镜模块被指向面对每个图像传感器芯片的光敏区域。 最后，在封装过程中，晶片级透镜模块被封装材料包围。

    Wafer level image sensor packaging structure and manufacturing method for the same
    7.
    发明授权
    Wafer level image sensor packaging structure and manufacturing method for the same 有权
    晶圆级图像传感器封装结构及制造方法相同

    公开(公告)号：US08563350B2

    公开(公告)日：2013-10-22

    申请号：US12947316

    申请日：2010-11-16

    申请人： Hsiu-Wen Tu ,  Han-Hsing Chen ,  Chung-Hsien Hsin ,  Ming-Hui Chen

    发明人： Hsiu-Wen Tu ,  Han-Hsing Chen ,  Chung-Hsien Hsin ,  Ming-Hui Chen

    IPC分类号： H01L31/0203 ,  H01L21/00

    CPC分类号： H01L27/14618 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/1469 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/13

    摘要： The present invention discloses a wafer level image sensor packaging structure and a manufacturing method for the same. The manufacturing method includes the following steps: providing a silicon wafer with image sensor chips, providing a plurality of transparent lids, allotting one said transparent lid on top of the corresponding image sensor chip, and carrying out a packaging process. The manufacturing method of the invention has the advantage of having a simpler process, lower cost, and higher production yield rate. The encapsulation compound arranges on the first surface of the image sensor chip and covers the circumference of the transparent lid to avoid the side light leakage as traditional chip scale package (CSP). Thus, the sensing performance of the wafer level image sensor packaging structure can be enhanced.

    摘要翻译： 本发明公开了一种晶片级图像传感器封装结构及其制造方法。 该制造方法包括以下步骤：向硅晶片提供图像传感器芯片，提供多个透明盖，在相应的图像传感器芯片的顶部上分配一个所述透明盖，并执行封装处理。 本发明的制造方法具有工艺简单，成本低，生产率高的优点。 封装化合物布置在图像传感器芯片的第一表面上，并覆盖透明盖的周边，以避免像传统芯片级封装（CSP）那样的侧面漏光。 因此，可以提高晶片级图像传感器封装结构的感测性能。

    MANUFACTURING METHOD AND STRUCTURE FOR WAFER LEVEL IMAGE SENSOR MODULE WITH FIXED FOCAL LENGTH
    8.
    发明申请
    MANUFACTURING METHOD AND STRUCTURE FOR WAFER LEVEL IMAGE SENSOR MODULE WITH FIXED FOCAL LENGTH 有权
    具有固定长度的水平图像传感器模块的制造方法和结构

    公开(公告)号：US20110279815A1

    公开(公告)日：2011-11-17

    申请号：US12948020

    申请日：2010-11-17

    申请人： Hsiu-Wen Tu ,  Han-Hsing Chen ,  Chung-Hsien Hsin ,  Ming-Hui Chen

    发明人： Hsiu-Wen Tu ,  Han-Hsing Chen ,  Chung-Hsien Hsin ,  Ming-Hui Chen

    IPC分类号： G01J1/00 ,  H01L21/56

    CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14685 ,  H01L27/1469 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2924/0002 ,  H01L2924/00

    摘要： This present invention discloses a manufacturing method and structure for a wafer level image sensor module with fixed focal length. The method includes the following steps. First, a silicon wafer comprising several image sensor chips having a photosensitive area and a lens module array wafer comprising several wafer level lens modules with fixed focal length are provided. Next, the image sensor chips and the wafer level lens modules are sorted in grades according to the different quality grades. According to the sorting results, each of the wafer level lens modules is assigned to be situated above the image sensor chip that has the same grade. At the same time, each of the wafer level lens modules is directed to face the photosensitive area of each image sensor chip. Finally, in the packaging process, the wafer level lens module is surrounded by an encapsulation material.

    摘要翻译： 本发明公开了一种具有固定焦距的晶片级图像传感器模块的制造方法和结构。 该方法包括以下步骤。 首先，提供包括具有感光区域的多个图像传感器芯片和包括具有固定焦距的多个晶片级透镜模块的透镜模块阵列晶片的硅晶片。 接下来，图像传感器芯片和晶片级透镜模块根据不同的质量等级被分级。 根据分选结果，将每个晶片级透镜模块分配为位于具有相同等级的图像传感器芯片上方。 同时，每个晶片级透镜模块被指向面对每个图像传感器芯片的光敏区域。 最后，在封装过程中，晶片级透镜模块被封装材料包围。

    ELECTRONIC DEVICE AND FIXING STRUCTURE THEREOF
    9.
    发明申请
    ELECTRONIC DEVICE AND FIXING STRUCTURE THEREOF 失效
    电子设备及其固定结构

    公开(公告)号：US20120329408A1

    公开(公告)日：2012-12-27

    申请号：US13239975

    申请日：2011-09-22

    申请人： Ming-Hui Chen ,  Chia-Chen Chen ,  Shih-Hsun Yang ,  Pin-Chang Chu ,  Chih-Chia Chang ,  Cheng-Tai Ho

    发明人： Ming-Hui Chen ,  Chia-Chen Chen ,  Shih-Hsun Yang ,  Pin-Chang Chu ,  Chih-Chia Chang ,  Cheng-Tai Ho

    IPC分类号： H04B15/00

    CPC分类号： H01Q1/243 ,  H01Q1/12 ,  H04W84/18

    摘要： A fixing structure including a metal housing and a fixing base is disclosed. The housing has a carrying plane and the fixing base having a first contact end and, opposite, a second contact end is disposed on the housing. The perpendicular distance from the first contact end to the carrying plane is greater than that from the second contact end to the carrying plane. A wireless transmission device is disposed on the fixing base and in contact with the first contact end and the second contact end, so that a perpendicular distance from an antenna end of the wireless transmission device to the carrying plane is greater than a perpendicular distance from a fixed end of the wireless transmission device to the carrying plane. Therefore, a relatively great distance is kept between the antenna end and the housing for preventing the antenna end from being interfered by the metal housing.

    摘要翻译： 公开了一种包括金属外壳和固定底座的固定结构。 壳体具有承载平面，并且固定底座具有第一接触端，并且相对于第二接触端设置在壳体上。 从第一接触端到承载平面的垂直距离大于从第二接触端到承载平面的垂直距离。 无线传输装置设置在固定基座上并与第一接触端和第二接触端接触，使得从无线传输装置的天线端到承载平面的垂直距离大于从一个 无线传输设备的固定端到承载平面。 因此，天线端和壳体之间保持相对较大的距离，以防止天线端被金属壳体干扰。

    PORTABLE COMPUTER AND HINGE MECHANISM THEREOF
    10.
    发明申请
    PORTABLE COMPUTER AND HINGE MECHANISM THEREOF 有权
    便携式计算机及其机械机构

    公开(公告)号：US20100134970A1

    公开(公告)日：2010-06-03

    申请号：US12480462

    申请日：2009-06-08

    申请人： Ming-Feng Chen ,  Chien-Chung Chien ,  Ming-Hui Chen ,  Shu-Hua Yeh ,  Chien-Heng Kuo ,  Yen-Chang Lai

    发明人： Ming-Feng Chen ,  Chien-Chung Chien ,  Ming-Hui Chen ,  Shu-Hua Yeh ,  Chien-Heng Kuo ,  Yen-Chang Lai

    IPC分类号： G06F1/16 ,  E05D5/10

    CPC分类号： G06F1/1681 ,  G06F1/1616 ,  G06F1/1656 ,  Y10T16/551 ,  Y10T16/557

    摘要： A portable computer and a hinge mechanism thereof are provided. The portable computer includes a display screen, a host and a hinge mechanism. The hinge mechanism is connected with the display screen and the host. The hinge mechanism is used for rotating the display screen around the host. The hinge mechanism includes a bottom board, a pivot, a network connecter and a slanting board. The pivot is disposed on the bottom board, wherein one end of the pivot is connected with the host and the other end of the pivot is connected with the display screen. The network connecter is disposed on the bottom board. The slanting board is disposed on the bottom board and slants to the pivot. The slanting board has an opening which exposes the network connecter.

    摘要翻译： 提供便携式计算机及其铰链机构。 便携式计算机包括显示屏，主机和铰链机构。 铰链机构与显示屏和主机连接。 铰链机构用于围绕主机旋转显示屏。 铰链机构包括底板，枢轴，网络连接器和倾斜板。 枢轴设置在底板上，其中枢轴的一端与主机连接，枢轴的另一端与显示屏连接。 网络连接器设置在底板上。 倾斜板设置在底板上并倾斜到枢轴。 倾斜板具有露出网络连接器的开口。