公开(公告)号：US09363884B2

公开(公告)日：2016-06-07

申请号：US14072199

申请日：2013-11-05

Applicant: Huawei Device Co., Ltd.

Inventor： Jun Yang ,  Liechun Zhou ,  Hualin Li ,  Xijie Wu

IPC: H05K7/20 ,  H05K1/02 ,  H05K9/00 ,  H01L23/552 ,  H01L23/00

CPC classification number: H05K1/0204 ,  H01L23/552 ,  H01L24/18 ,  H05K1/0216 ,  H05K7/20472 ,  H05K9/003 ,  H05K2201/0715 ,  H05K2201/2018 ,  Y02D70/122 ,  Y10T428/264 ,  Y10T428/30 ,  Y10T428/31504 ,  Y10T428/31678

Abstract: A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.

Abstract translation: 在本发明的实施例中公开了与电子组装技术领域有关的复合材料和电子装置。 解决了内部结构过于复杂的现有电子设备的技术问题。 复合材料包括导电导热层，粘胶层和绝缘层，其中导电层和绝缘层粘贴在粘胶层的两侧; 粘胶胶层是导电的。 电子设备包括电路板和复合材料。 在对应于电子部件和/或屏蔽框架的位置的绝缘层处形成间隙，粘胶层露出，复合材料通过粘胶胶层粘贴到电子部件和/或屏蔽框架上。 本发明应用于简化电子设备的结构。

公开(公告)号：US20140055957A1

公开(公告)日：2014-02-27

申请号：US14072199

申请日：2013-11-05

Applicant: Huawei Device Co., Ltd.

Inventor： Jun Yang ,  Liechun Zhou ,  Hualin Li ,  Xijie Wu

IPC: H05K1/02

CPC classification number: H05K1/0204 ,  H01L23/552 ,  H01L24/18 ,  H05K1/0216 ,  H05K7/20472 ,  H05K9/003 ,  H05K2201/0715 ,  H05K2201/2018 ,  Y02D70/122 ,  Y10T428/264 ,  Y10T428/30 ,  Y10T428/31504 ,  Y10T428/31678

Abstract: A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.

Abstract translation: 在本发明的实施例中公开了与电子组装技术领域有关的复合材料和电子装置。 解决了内部结构过于复杂的现有电子设备的技术问题。 复合材料包括导电导热层，粘胶层和绝缘层，其中导电层和绝缘层粘贴在粘胶层的两侧; 粘胶胶层是导电的。 电子设备包括电路板和复合材料。 在对应于电子部件和/或屏蔽框架的位置的绝缘层处形成间隙，粘胶层露出，复合材料通过粘胶胶层粘贴到电子部件和/或屏蔽框架上。 本发明应用于简化电子设备的结构。

公开(公告)号：US20140102678A1

公开(公告)日：2014-04-17

申请号：US14105465

申请日：2013-12-13

Applicant: Huawei Device Co., Ltd.

Inventor： Jie Zou ,  Liechun Zhou ,  Xijie Wu ,  Jun Yang

IPC: H05K7/20

CPC classification number: H05K7/20 ,  H01M10/658 ,  H05K5/0213

Abstract: Embodiments of the present invention provide an apparatus with a heat insulation structure, where the apparatus includes an object to be heat-insulated and also includes a heat insulation closed layer disposed between the object to be heat-insulated and a heat source. The heat insulation structure adopted in the present invention specifically is a heat insulation closed layer, where the heat insulation closed layer performs heat insulation protection through a closed space between the object to be heat-insulated and the heat source, rather than performing heat insulation mainly through a physical material with a small heat conduction coefficient.

Abstract translation: 本发明的实施例提供了一种具有隔热结构的设备，其中该设备包括被隔热的物体，并且还包括设置在要被隔热的物体和热源之间的绝热封闭层。 本发明中采用的隔热结构具体是隔热封闭层，其中绝热封闭层通过绝热物体与热源之间的封闭空间进行绝热保护，而不是主要进行绝热 通过物理材料具有较小的导热系数。