公开(公告)号：US20240096729A1

公开(公告)日：2024-03-21

申请号：US18468174

申请日：2023-09-15

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Dong Chen ,  Fenglong Lu ,  Yunyu Tang ,  Lei Shi ,  Yunfeng Liu ,  Shuyi Lv ,  Pengcheng Zhang

IPC: H01L23/367 ,  H01L23/13 ,  H01L23/373

CPC classification number: H01L23/367 ,  H01L23/13 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3121

Abstract: A packaged device includes a circuit board, an electronic component, and a heat storage portion. The electronic component is electrically coupled to the circuit board; and the heat storage portion is disposed on the circuit board or embedded in the circuit board, and the heat storage portion is adjacent to the electronic component, where a specific heat capacity of the heat storage portion is higher than a specific heat capacity of the circuit board, and the heat storage portion is configured to store and release heat. A heat storage material with a relatively high specific heat capacity is introduced into the packaged device, and the heat storage portion is disposed on the circuit board around the electronic component where a large amount of heat generated by the electronic component in a short time can be quickly stored in the heat storage portion and then released to the outside.