公开(公告)号：US12184201B2

公开(公告)日：2024-12-31

申请号：US18175583

申请日：2023-02-28

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Yongbing Gao ,  Yunyu Tang ,  Lei Shi

IPC: H02M7/48 ,  H02J3/38 ,  H02M1/08 ,  H02M1/32 ,  H02M3/04 ,  H02S40/32 ,  H02S40/36

Abstract: A converter includes a power conversion circuit, a switching device, and a controller, and includes N phases, where N is 2 or 3. An input end of the power conversion circuit is connected to a direct current power supply, and the power conversion circuit converts a direct current output by the direct current power supply into an alternating current. The switching device includes at least the following two stages: a first-stage switching device and a second-stage switching device. The first-stage switching device and the second-stage switching device separately include N switches, and the N switches are connected in series to the N phases respectively. An output end of the power conversion circuit is connected to an alternating current power grid through the first-stage switching device and the second-stage switching device that are connected in series.

公开(公告)号：US20240096729A1

公开(公告)日：2024-03-21

申请号：US18468174

申请日：2023-09-15

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Dong Chen ,  Fenglong Lu ,  Yunyu Tang ,  Lei Shi ,  Yunfeng Liu ,  Shuyi Lv ,  Pengcheng Zhang

IPC: H01L23/367 ,  H01L23/13 ,  H01L23/373

CPC classification number: H01L23/367 ,  H01L23/13 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3121

Abstract: A packaged device includes a circuit board, an electronic component, and a heat storage portion. The electronic component is electrically coupled to the circuit board; and the heat storage portion is disposed on the circuit board or embedded in the circuit board, and the heat storage portion is adjacent to the electronic component, where a specific heat capacity of the heat storage portion is higher than a specific heat capacity of the circuit board, and the heat storage portion is configured to store and release heat. A heat storage material with a relatively high specific heat capacity is introduced into the packaged device, and the heat storage portion is disposed on the circuit board around the electronic component where a large amount of heat generated by the electronic component in a short time can be quickly stored in the heat storage portion and then released to the outside.

公开(公告)号：US11728769B2

公开(公告)日：2023-08-15

申请号：US17673140

申请日：2022-02-16

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Yongbing Gao ,  Yunyu Tang ,  Lei Shi

IPC: H02S40/32 ,  H02J3/00 ,  H02S50/10

CPC classification number: H02S50/10 ,  H02J3/001 ,  H02S40/32

Abstract: A fault detection apparatus includes a temperature detection unit, a current detection unit, a controller, and a breaking unit. The temperature detection unit is configured to detect temperatures of the plurality of filter capacitors and output the temperatures to the controller. The current detection unit is coupled to the plurality of filter capacitors and is configured to detect currents of the plurality of filter capacitors and output the currents to the controller. The controller is separately connected to the temperature detection unit, the current detection unit, and the breaking unit, and is configured to: when the received temperature exceeds a first threshold and the received current exceeds a second threshold, control the breaking unit to be disconnected. The breaking unit is connected between the output end of the grid-tied inverter and the plurality of filter capacitors and is configured to be disconnected or connected under control of the controller.