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1.发明申请公开(公告)号：US20200321673A1
公开(公告)日：2020-10-08
申请号：US16908321
申请日：2020-06-22
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Jie SUN , Yan GAO , Zhixiong ZENG
Abstract: Embodiments of this application disclose a signal processing circuit, a radio frequency signal transmitter, and a communications device, and relate to the field of electronic device technologies, to improve power amplification efficiency of the signal processing circuit. The signal processing circuit includes: a splitter, a radio frequency signal converter, a first branch power amplifier, a second branch power amplifier, and a combiner. The splitter is connected to the radio frequency signal converter, the radio frequency signal converter is connected to the first branch power amplifier and the second branch power amplifier, and the first branch power amplifier and the second branch power amplifier are connected to the combiner.
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公开(公告)号：US20250014227A1
公开(公告)日：2025-01-09
申请号：US18889967
申请日：2024-09-19
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Zhao Yi SUN , Yuliang HUANG , Leonarduzzi Roberto FABIO , Jie SUN
Abstract: An image compression method to perform a linear regression operation on a plurality of neighborhood pixel values and pixel values, so as to obtain model parameter values of images in all bands. Compared with a recursion method for calculating the model parameter values, this method can reduce calculation duration, to improve compression efficiency.
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公开(公告)号：US20220271716A1
公开(公告)日：2022-08-25
申请号：US17744033
申请日：2022-05-13
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Zhixiong ZENG , Jie SUN
Abstract: The present disclosure provides example power amplifier combiner apparatuses and power amplifier circuits. One example power amplifier combiner apparatus includes a signal processing unit and n power amplifier units. The signal processing unit is separately coupled to input terminals of the n power amplifier units. Output terminals of the n power amplifier units are separately coupled to a load. When an output power of the power amplifier combiner apparatus is less than a first threshold, the signal processing unit controls a first power amplifier unit to operate. When the output power is greater than or equal to an ith threshold and is less than an (i+1)th threshold, the signal processing unit controls the first i+1 power amplifier units to operate. When the output power is not less than an (n−1)th threshold, the signal processing unit controls the n power amplifier units to operate, where i=1, . . . , or n−2.
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公开(公告)号：US20220254717A1
公开(公告)日：2022-08-11
申请号：US17732120
申请日：2022-04-28
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Dong CHEN , Jie SUN , Zhixiong ZENG
IPC: H01L23/522 , H01L23/528 , H01L23/66 , H01L49/02
Abstract: A semiconductor device and a manufacturing method therefor are provided. The semiconductor device includes a substrate and an inductor, where a shield layer may be formed between the substrate and the inductor, and the shield layer is used to shield an electrical coupling between the substrate and the inductor. In this way, a coupling current in the substrate can be reduced, an energy loss in the inductor is reduced, a quality factor of the inductor is improved, and performance of the semiconductor device is improved.
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5.发明申请公开(公告)号：US20210328619A1
公开(公告)日：2021-10-21
申请号：US17360639
申请日：2021-06-28
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Jie SUN , Zhixiong ZENG
Abstract: The present disclosure discloses example transmission/reception separation circuits and transceiver. One example transmission/reception separation circuit includes a transmission amplification circuit, an impedance adjustment circuit, and a reception amplification circuit. An output end of the transmission amplification circuit is connected to the impedance adjustment circuit. The impedance adjustment circuit is further connected to an input end of the reception amplification circuit. The second end of the impedance adjustment circuit and the input end of the reception amplification circuit are further configured to be connected to an antenna. The transmission amplification circuit amplifies a first signal to be transmitted. The reception amplification circuit amplifies a second signal received. When the antenna transmits the amplified first signal, a first impedance is in a high impedance state. The impedance adjustment circuit adjusts a second impedance to a high impedance state when the antenna receives the second signal.
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Patent Agency Ranking
公开(公告)号：US20250070731A1
公开(公告)日：2025-02-27
申请号：US18941540
申请日：2024-11-08
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Yiping SUN , Chuan HE , Jie SUN
Abstract: A power amplifier circuit includes a power amplifier unit and a broadband improvement unit. The power amplifier unit includes a signal input port, a signal output port, a power transistor, and a first inductor. The power transistor is configured to perform power amplification on radio frequency signals in a plurality of frequency bands. The broadband improvement unit adjusts a parallel resonance frequency of the power amplifier unit, to reduce envelope impedance of the power amplifier unit between a first target frequency and a second target frequency. The first target frequency is a maximum frequency difference between the plurality of frequency bands, and the second target frequency is a minimum frequency difference between the plurality of frequency bands.
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公开(公告)号：US20230300985A1
公开(公告)日：2023-09-21
申请号：US18325551
申请日：2023-05-30
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Jie SUN , Ruiming MO , Xichen YANG , Yi XU
CPC classification number: H05K1/144 , H05K1/0209 , H05K2201/042 , H05K2201/047 , H05K2201/10098 , H05K2201/10719
Abstract: Embodiments of this application disclose an electronic component and an electronic device, to achieve a three-dimensional stacked structure, reduce an area, and improve heat dissipation. In embodiments of this application, the electronic component includes an upper cover plate, a lower cover plate, and an enclosure frame. The upper cover plate carries a first circuit. The lower cover plate carries a second circuit. The enclosure frame is separately connected to the upper cover plate and the lower cover plate. An interconnection circuit is disposed in the enclosure frame, and the interconnection circuit is configured to implement interconnection between the first circuit and the second circuit. The first circuit and the second circuit overlap in a vertical direction without interfering with each other.
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公开(公告)号：US20220304138A1
公开(公告)日：2022-09-22
申请号：US17837445
申请日：2022-06-10
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Chenyang HE , Ruiming MO , Jie SUN
Abstract: An electronic element, a circuit board with an electronic element, and an electronic device are provided. The electronic element includes a substrate and a first input pad, at least one chip, and a first output pad that are disposed on a first surface of the substrate, where the first input pad, the at least one chip, and the first output pad are sequentially connected, the first input pad and the first output pad are directly disposed on the first surface of the substrate, and a surface of the first input pad facing away from the substrate and a surface of the first output pad facing away from the substrate constitute a partial area of an outer surface of the electronic element.
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公开(公告)号：US20220200541A1
公开(公告)日：2022-06-23
申请号：US17695065
申请日：2022-03-15
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Jie SUN , Yijun SUN , Hailei SUO , Jinhu CHEN , Song LI
Abstract: A power amplifier circuit, a transmitter, and a network device are provided. The power amplifier circuit includes N input ports, N power amplifier branches, one combiner circuit, and one output port. Each of the N input ports is connected to one power amplifier branch, each of the power amplifier branches is connected to the combiner circuit, and the combiner circuit is further connected to the output port; the N power amplifier branches and the combiner circuit are configured to perform power amplification and combining on N input signals, to generate an output signal. The N power amplifier branches include one first power amplifier branch operates in a class AB or class B operating mode, and N−1 second power amplifier branches operate in a class C operating mode with different gate bias voltages, the gate bias voltages of the N−1 second power amplifier branches become lower in order.
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公开(公告)号：US20210288616A1
公开(公告)日：2021-09-16
申请号：US17333299
申请日：2021-05-28
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Zhixiong ZENG , Jie SUN , Hailei SUO
Abstract: A power amplifier circuit is provided, to improve efficiency of a power amplifier. The circuit includes: a first branch, including a first amplifier and a first matching network that are cascaded; a second branch, including a second amplifier and a second matching network that are cascaded, where a first coupled line enables the first branch and the second branch to form a first combiner; a third branch, including a third amplifier and a third matching network that are cascaded; and a fourth branch, including a fourth amplifier and a fourth matching network that are cascaded, where a second coupled line enables the third branch and the fourth branch to form a second combiner. A first output end of the first coupled line is a signal output end of the circuit, and a second output end of the first coupled line is connected to a first output end of the second coupled line, to enable the first combiner and the second combiner to form a series combiner.
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