公开(公告)号：US10292253B2

公开(公告)日：2019-05-14

申请号：US15518970

申请日：2014-10-17

申请人： Huawei Technologies Co., Ltd.

发明人： Xiaoqing Li ,  Jinjing Jiang ,  Zhiguo Zhang ,  Bin Wang

IPC分类号： H05K1/02 ,  C09J9/02 ,  H01L23/367 ,  H05K9/00 ,  H01L23/36 ,  H01L23/42 ,  H01L23/552

摘要： A heat-dissipation and shielding structure, including a shielding case, a thermal pad, and a heat sink. The bottom of the shielding case is connected to a circuit board used to carry a heat emitting element, the heat sink is disposed on the top of the shielding case, the top of the shielding case is provided with an opening, the thermal pad runs through the opening, a bottom surface of the thermal pad is attached to the heat emitting element, and a top surface of the thermal pad is attached to the heat sink; and the heat-dissipation and shielding structure further includes a metal spring plate, where the metal spring plate is located on a periphery of the opening and encircles the opening, and the metal spring plate is elastically connected between the shielding case and the heat sink.

公开(公告)号：US20170238410A1

公开(公告)日：2017-08-17

申请号：US15518970

申请日：2014-10-17

申请人： Huawei Technologies Co., Ltd.

发明人： Xiaoqing Li ,  Jinjing Jiang ,  Zhiguo Zhang ,  Bin Wang

IPC分类号： H05K1/02 ,  H05K9/00 ,  C09J9/02 ,  H01L23/367

CPC分类号： H05K1/0203 ,  C09J9/02 ,  C09J2201/128 ,  C09J2201/602 ,  C09J2203/326 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/0212 ,  H05K9/0009 ,  H05K9/0032 ,  H05K2201/066 ,  H05K2201/0715 ,  H05K2201/10371 ,  H01L2924/00

摘要： A heat-dissipation and shielding structure, including a shielding case, a thermal pad, and a heat sink. The bottom of the shielding case is connected to a circuit board used to carry a heat emitting element, the heat sink is disposed on the top of the shielding case, the top of the shielding case is provided with an opening, the thermal pad runs through the opening, a bottom surface of the thermal pad is attached to the heat emitting element, and a top surface of the thermal pad is attached to the heat sink; and the heat-dissipation and shielding structure further includes a metal spring plate, where the metal spring plate is located on a periphery of the opening and encircles the opening, and the metal spring plate is elastically connected between the shielding case and the heat sink.