公开(公告)号：US11901615B2

公开(公告)日：2024-02-13

申请号：US17589380

申请日：2022-01-31

申请人： Huawei Technologies Co., Ltd.

发明人： Shineng Chen ,  Dezheng Liu ,  Feng Peng ,  Jin Jiang

IPC分类号： H01Q1/24 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q1/42 ,  H01Q1/52

CPC分类号： H01Q1/246 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q1/42 ,  H01Q1/526

摘要： The present invention discloses a base station, including a radome, a radiator, and an adapter board. The adapter board includes a first board surface and a second board surface that are disposed oppositely, the radome is fastened to the first board surface, a first cavity configured to accommodate an antenna component of the communication base station is formed between the radome and the adapter board, the radiator includes a mounting surface and a side wall that are neighboring to each other, a second cavity configured to accommodate a radio frequency component of the communication base station is recessed on the mounting surface, the mounting surface is fixedly connected to the second board surface, the second cavity is communicated with the first cavity, a connector configured to communicate the radio frequency component with an external circuit is mounted on the side wall, and is electrically connected to the radio frequency component.

公开(公告)号：US09968001B2

公开(公告)日：2018-05-08

申请号：US15356103

申请日：2016-11-18

申请人： Huawei Technologies Co., Ltd.

发明人： Xingxing Huang ,  Kaikai Liu ,  Shineng Chen

IPC分类号： H05K7/20 ,  F25B21/02 ,  G02B6/42 ,  H05K5/00

CPC分类号： H05K7/20263 ,  F25B21/02 ,  F25B2321/023 ,  F25B2321/0251 ,  F25B2321/0252 ,  G02B6/42 ,  G02B6/4266 ,  G02B6/4268 ,  G02B6/4271 ,  H05K5/0026 ,  H05K7/20281 ,  H05K7/20336 ,  H05K7/20445 ,  H05K7/2049

摘要： Embodiments of the present invention disclose a heat dissipation assembly including: a cage, a TEC assembly, a mounting kit, an elastic carrier, and a heat pipe, where a window is provided in a side face of the cage, the TEC assembly is located on an outer side of the cage, and a cold side of the TEC assembly passes through the window and thermally communicates with the heat emitting device in the cage; the mounting kit is configured to mount the TEC assembly and enable the TEC assembly to move in a direction leaving or approaching the heat emitting device; and a heat absorption portion of the heat pipe is mounted on the elastic carrier, and the heat absorption portion that is of the heat pipe and that is mounted on the elastic carrier thermally communicates with a hot side of the TEC assembly.