公开(公告)号：US20240164056A1

公开(公告)日：2024-05-16

申请号：US18550265

申请日：2022-03-11

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Huipeng Wu ,  Xinpei Huang ,  Tao Liu ,  Along Zhou ,  Jian Shi

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20272 ,  G06F1/203 ,  H05K7/20254

Abstract: This application relates to the field of liquid cooling technologies, and provides a gas collection apparatus, configured to collect bubbles generated due to loss of a working medium in a liquid cooling apparatus. The gas collection apparatus includes a cooling plate. The cooling plate includes at least one gas collection structure disposed inside the cooling plate, a first flow channel disposed inside the cooling plate, a second flow channel disposed inside the gas collection structure, and at least one connecting channel configured to connect the first flow channel and the second flow channel. The at least one connecting channel is configured to transfer, to the second flow channel, bubbles carried when the working medium flows in the first flow channel. The at least one gas collection structure is configured to collect the bubbles from the second flow channel.

公开(公告)号：US20200245501A1

公开(公告)日：2020-07-30

申请号：US16851337

申请日：2020-04-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Huipeng Wu ,  Quanming Li ,  Guo Yang

IPC: H05K7/20 ,  F28F3/02 ,  G09F9/30

Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a tangent-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.

公开(公告)号：US11963336B2

公开(公告)日：2024-04-16

申请号：US17859034

申请日：2022-07-07

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Huipeng Wu ,  Quanming Li ,  Guo Yang

IPC: H05K7/20 ,  F28F3/02 ,  G09F9/30

CPC classification number: H05K7/20481 ,  F28F3/02 ,  G09F9/301 ,  H05K7/20963

Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a cutting-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.

公开(公告)号：US11406044B2

公开(公告)日：2022-08-02

申请号：US16851337

申请日：2020-04-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Huipeng Wu ,  Quanming Li ,  Guo Yang

IPC: H05K7/20 ,  F28F3/02 ,  G09F9/30

Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a tangent-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.

公开(公告)号：US20240389264A1

公开(公告)日：2024-11-21

申请号：US18564897

申请日：2022-05-26

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jianliang Wang ,  Along Zhou ,  Huipeng Wu ,  Jian Shi ,  Shoubiao Xu

IPC: H05K7/20

Abstract: A heat dissipation system includes a first heat dissipation panel, a second heat dissipation panel, a first rotating shaft assembly, a second rotating shaft assembly, and a driving apparatus. The first heat dissipation panel is provided with a first liquid channel, and the first liquid channel includes a first interface and a second interface. The second heat dissipation panel is provided with a second liquid channel, and the second liquid channel includes a third interface and a fourth interface. The first interface is in communication with the third interface through the first rotating shaft assembly, and the second interface is in communication with the fourth interface through the second rotating shaft assembly. The driving apparatus is configured to drive a liquid medium to flow between the first heat dissipation panel and the second heat dissipation panel.