公开(公告)号：US20180114760A1

公开(公告)日：2018-04-26

申请号：US15792307

申请日：2017-10-24

Applicant: Huawei Technologies Co., Ltd.

Inventor： HuiLi Fu ,  Jianwei Guo ,  Tiejun Liu

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31 ,  H01L23/66

CPC classification number: H01L23/562 ,  H01L21/4857 ,  H01L23/3185 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/66 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00

Abstract: A package substrate, including a first reference layer and a second reference layer disposed opposite to each other, a first composite layer disposed on a side of the first reference layer and close to the second reference layer, a second composite layer disposed on a side of the second reference layer and close to the first reference layer, and a metal trace is laminated between the first composite layer and the second composite layer. The first composite layer and the second composite layer each include a first dielectric layer and a second dielectric layer disposed opposite to and in contact with each other, the first dielectric layer is in contact with the metal trace, and a stiffness of the second dielectric layer is greater than a stiffness of the first dielectric layer.