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Patent Agency Ranking
公开(公告)号：US12058803B2
公开(公告)日：2024-08-06
申请号：US18372828
申请日：2023-09-26
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Chaojun Deng , Fei Ma , Wei Fang , Zhiwen Yang , Chungang Li , Shun Hao
CPC classification number: H05K1/0203 , G02B6/4269 , G02B6/4284 , H05K1/181 , H05K7/023 , H05K7/026 , H05K7/20409
Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.
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公开(公告)号：US11805592B2
公开(公告)日：2023-10-31
申请号：US17155324
申请日：2021-01-22
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Chaojun Deng , Fei Ma , Wei Fang , Zhiwen Yang , Chungang Li , Shun Hao
CPC classification number: H05K1/0203 , G02B6/4269 , G02B6/4284 , H05K1/181 , H05K7/023 , H05K7/026 , H05K7/20409
Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.
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公开(公告)号：US11849559B2
公开(公告)日：2023-12-19
申请号：US17732665
申请日：2022-04-29
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Xuguang Yang , Zhiwen Yang , Shaohua Zhang , Zelong Jiao
IPC: H05K7/14
CPC classification number: H05K7/1489 , H05K7/1491
Abstract: An interconnection structure used in an electronic device includes a chassis, a first line board, a second line board, and a heat dissipation component. The heat dissipation component is disposed on a first side surface of the chassis, the first side surface includes a first opening, the second line board is horizontally disposed inside the chassis, the first line board is vertically inserted onto a side surface of the second line board, and a second side surface that is of the chassis and that is opposite to the first side surface includes a second opening. The second line board is horizontally disposed inside the chassis, and the first line board is vertically inserted onto the side surface of the second line board, to reduce a quantity of parts on a system air duct, reduce a flow resistance of a system, and improve a heat dissipation capability of the system.
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公开(公告)号：US10264716B2
公开(公告)日：2019-04-16
申请号：US15676055
申请日：2017-08-14
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yaqin Hong , Zhiwen Yang , Bingduo Yan
Abstract: An outdoor display screen includes a housing, a display screen, a control module, a heat dissipation module, and a power supply component. A first cavity and a second cavity are disposed on the housing. The display screen, the control module, and the power supply component are mounted in the first cavity, and the heat dissipation module is mounted in the second cavity. A cable-through hole is disposed on the housing. An air exhaust vent connected to an air intake vent of an internal circulation path and an air intake vent connected to an air exhaust vent of the internal circulation path are disposed in the first cavity to form an internal circulation heat-dissipation air duct. An air intake vent and an air exhaust vent are disposed in the second cavity to form an external circulation heat-dissipation air duct.
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公开(公告)号：US20170345346A1
公开(公告)日：2017-11-30
申请号：US15676055
申请日：2017-08-14
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yaqin Hong , Zhiwen Yang , Bingduo Yan
CPC classification number: H05K7/20972 , F21V29/50 , F24F12/006 , G09F9/30 , G09F19/22 , H05K7/20 , H05K7/20145 , H05K7/202
Abstract: An outdoor display screen includes a housing, a display screen, a control module, a heat dissipation module, and a power supply component. A first cavity and a second cavity are disposed on the housing. The display screen, the control module, and the power supply component are mounted in the first cavity, and the heat dissipation module is mounted in the second cavity. A cable-through hole is disposed on the housing. An air exhaust vent connected to an air intake vent of an internal circulation path and an air intake vent connected to an air exhaust vent of the internal circulation path are disposed in the first cavity to form an internal circulation heat-dissipation air duct. An air intake vent and an air exhaust vent are disposed in the second cavity to form an external circulation heat-dissipation air duct.
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