公开(公告)号：US20100133422A1

公开(公告)日：2010-06-03

申请号：US12408653

申请日：2009-03-20

申请人： Hui-Hsiung Lin ,  Wen-Hsun Yang ,  Yu-Nan Pao ,  Chia-Jen Ting

发明人： Hui-Hsiung Lin ,  Wen-Hsun Yang ,  Yu-Nan Pao ,  Chia-Jen Ting

IPC分类号： G02B6/42

CPC分类号： G02B6/0023 ,  F24S23/00 ,  F24S23/12 ,  G02B3/08 ,  H01L31/02325 ,  Y02E10/44

摘要： A light concentrating module includes an optical film having a light incident surface and a light outgoing surface facing the light incident surface, an optical wedge plate having a first surface, a second surface facing the first surface and having an angle with respect to the first surface and a third surface adjacent to the first and second surfaces, and at least one photoelectric chip disposed near the third surface. Light from a light source penetrates the optical film, and the light enters the first surface of the optical wedge by an appropriate incident angle and has total reflection between the first and second surfaces, whereby the light propagates in the optical wedge, and the light leaves the optical wedge from the third surface and is received by the photoelectric chip.

摘要翻译： 光聚集模块包括具有光入射表面和面向光入射表面的光出射表面的光学膜，光楔板，其具有第一表面，第二表面面向第一表面并且相对于第一表面具有一角度 以及与第一和第二表面相邻的第三表面，以及设置在第三表面附近的至少一个光电芯片。 来自光源的光穿透光学膜，并且光以适当的入射角进入光楔的第一表面，并且在第一和第二表面之间具有全反射，由此光在光楔中传播，并且光离开 光楔从第三表面被光电芯片接收。

公开(公告)号：US08183519B2

公开(公告)日：2012-05-22

申请号：US12408653

申请日：2009-03-20

申请人： Hui-Hsiung Lin ,  Wen-Hsun Yang ,  Yu-Nan Pao ,  Chia-Jen Ting

发明人： Hui-Hsiung Lin ,  Wen-Hsun Yang ,  Yu-Nan Pao ,  Chia-Jen Ting

IPC分类号： G02B6/42 ,  F21V8/00

CPC分类号： G02B6/0023 ,  F24S23/00 ,  F24S23/12 ,  G02B3/08 ,  H01L31/02325 ,  Y02E10/44

摘要： A light concentrating module includes an optical film having a light incident surface and a light outgoing surface facing the light incident surface, an optical wedge element having a first surface, a second surface facing the first surface and having an angle with respect to the first surface and a third surface adjacent to the first and second surfaces, and at least one photoelectric chip disposed near the third surface. Light from a light source penetrates the optical film, and the light enters the first surface of the optical wedge element by an appropriate incident angle and has total reflection between the first and second surfaces, whereby the light propagates in the optical wedge element, and the light leaves the optical wedge element from the third surface and is received by the photoelectric chip.

摘要翻译： 光聚集模块包括具有光入射表面和面向光入射表面的光出射表面的光学膜，光楔元件，其具有第一表面，第二表面面对第一表面并且具有相对于第一表面的角度 以及与第一和第二表面相邻的第三表面，以及设置在第三表面附近的至少一个光电芯片。 来自光源的光穿透光学膜，并且光以适当的入射角进入光楔元件的第一表面，并且在第一和第二表面之间具有全反射，由此光在光楔元件中传播，并且 光从第三表面离开光楔元件并由光电芯片接收。

公开(公告)号：US20130170203A1

公开(公告)日：2013-07-04

申请号：US13602339

申请日：2012-09-04

申请人： Kuei-Yuan Cheng ,  Chia-Jen Ting ,  Meng-Chi Huang ,  Hui-Hsiung Lin ,  Ta-Hsin Chou

发明人： Kuei-Yuan Cheng ,  Chia-Jen Ting ,  Meng-Chi Huang ,  Hui-Hsiung Lin ,  Ta-Hsin Chou

IPC分类号： F21V5/04

CPC分类号： F21V5/007 ,  F21V11/06 ,  F21V13/10 ,  F21Y2105/10 ,  F21Y2115/10

摘要： A light-emitting diode (LED) array light source includes a substrate, a meshed light-shielding layer, LED chips, and a micro-lens array. The meshed light-shielding layer includes bar-shaped light-shielding patterns intersected with one another to define openings. Each bar-shaped light-shielding pattern has a bottom surface, a top surface, and two side surfaces. A width of the top surface is smaller than that of the bottom surface. A thickness of the meshed light-shielding layer is T1. Each LED chip is exclusively located in one of the openings. The micro-lens array covers the substrate, the meshed light-shielding layer, and the LED chips and includes micro-lenses arranged in array. Each micro-lens includes a base portion and a lens portion, and is disposed corresponding to one of the openings, respectively. A vertical distance from a top portion of each micro-lens to the bottom surface is T2, and 0.278≦T1/T2≦0.833.

摘要翻译： 发光二极管（LED）阵列光源包括基板，网状遮光层，LED芯片和微透镜阵列。 网状遮光层包括彼此相交的条形遮光图案，以限定开口。 每个条形遮光图案具有底表面，顶表面和两个侧表面。 上表面的宽度小于底面的宽度。 网状遮光层的厚度为T1。 每个LED芯片都位于其中一个开口中。 微透镜阵列覆盖基板，网状遮光层和LED芯片，并且包括排列成阵列的微透镜。 每个微透镜包括基部和透镜部分，并且分别对应于一个开口设置。 从每个微透镜的顶部到底面的垂直距离为T2，0.278 @ T1 / T2 @ 0.833。

公开(公告)号：US5726812A

公开(公告)日：1998-03-10

申请号：US636415

申请日：1996-04-23

申请人： Hsieh Min-Lang ,  Chia-Jen Ting

发明人： Hsieh Min-Lang ,  Chia-Jen Ting

IPC分类号： G02B7/10 ,  G02B15/22

CPC分类号： G02B7/10

摘要： A locking mechanism of zoom lens which is primarily applied on zoom lens to prevent the lens group of the zoom lens to prevent the lens group of the zoom lens structure from entering into the non-zooming zone of the curvilinear slots through its zooming zone. The said locking mechanism of zoom lens mainly consists of a reverse rotation stopping block, a spring-loaded restoring slider, a stopping piece and a cap. Among them, the reverse rotation stopping block is fixed at the linear-slot-sleeve in the said zoom lens structure through the transverse slot of curvilinear-slot-sleeve and the outer sleeve in the said zoom lens structure; the cap is fixed on the said stopping block, and the said stopping piece has one end with inclined plane which can make the reverse rotation stopping block to move, only in one direction, along the transverse slots on the curvilinear-slot-sleeve and its outer sleeve and enable the lens group of the said zoom lens structure to enter into the zooming operation zone of the said curvilinear-slot-sleeve through the non-zooming operation zone of the said curvilinear-slot-sleeve to perform zooming action. Whenever one does not need to use the zoom lens, one can press the cap directly to make the inclined plane's end retreat from the transverse slot of the outer sleeve which, in sequence, makes the lens group enter the zooming operation zone of the said curvilinear slots through the non-zooming operation zone of the said curvilinear slots to attain the object of shortening the zoom lens.

摘要翻译： 变焦镜头的锁定机构主要应用在变焦镜头上，以防止变焦镜头的透镜组通过其变焦区域防止变焦镜头结构的透镜组进入曲线槽的非变焦区域。 所述变焦镜头的所述锁定机构主要包括反转挡块，弹簧加载的复位滑块，止挡件和盖。 其中，反转止动块通过曲线槽套筒的横向槽和所述变焦镜头结构中的外套筒固定在所述变焦镜头结构中的直线槽套筒上; 所述止动块固定在所述止动块上，并且所述止动件具有倾斜平面的一端，所述倾斜平面可以使所述反向止动块沿着所述曲线槽套筒上的横向狭槽沿一个方向沿一个方向移动，并且其 并且使所述变焦透镜结构的透镜组能够通过所述曲线槽套筒的非变焦操作区域进入所述曲线槽套筒的变焦操作区域，以执行变焦动作。 每当不需要使用变焦镜头时，可以直接按压盖子使倾斜平面的端部从外套筒的横向槽缩回，这样使镜片组依次进入所述曲线的变焦操作区域 通过所述曲线槽的非变焦操作区插槽，以达到缩短变焦透镜的目的。

公开(公告)号：US20110141765A1

公开(公告)日：2011-06-16

申请号：US12958403

申请日：2010-12-02

申请人： Yem-Yeu Chang ,  Chia-Jen Ting

发明人： Yem-Yeu Chang ,  Chia-Jen Ting

IPC分类号： F21V13/00 ,  G02B5/30

CPC分类号： G02B5/045

摘要： A planar light source module including a light guide plate (LGP), a light source, an optical film, and a reflector is provided. The light source for emitting a light beam is disposed adjacent to the side light-incident surface, wherein the light beam enters the LGP from a side light-incident surface and leaves the LGP from a light-emergence surface in an emergence angle θ1, θ1≧70 degrees. The optical film is disposed above the LGP to collimate the light beam from the LGP. The optical film includes a prism layer module and a bonding layer module stacked alternately. The prism layer module comprises prism layers and each prism layer includes micro-prisms. The bonding layer module comprises at least one bonding layer bonded with two prism layers adjacent thereto. The refraction index of the prism layers is greater than that of the bonding layer. The reflector is disposed under the bottom surface.

摘要翻译： 提供了包括导光板（LGP），光源，光学膜和反射器的平面光源模块。 用于发射光束的光源设置成与侧光入射表面相邻，其中光束从侧光入射表面进入LGP，并以出射角离开出射表面的LGP; 1 ，＆thetas; 1≧70度。 光学膜设置在LGP上方以准直来自LGP的光束。 光学膜包括交替堆叠的棱镜层模块和粘合层模块。 棱镜层模块包括棱镜层，每个棱镜层包括微棱镜。 结合层模块包括至少一个与两个邻接的棱镜层结合的结合层。 棱镜层的折射率大于接合层的折射率。 反射器设置在底面下方。

公开(公告)号：US20080152901A1

公开(公告)日：2008-06-26

申请号：US11898618

申请日：2007-09-13

申请人： Chia-Jen Ting ,  Chin-Ju Hsu ,  Ya-Yu Nieh ,  Chang-Pin Chou

发明人： Chia-Jen Ting ,  Chin-Ju Hsu ,  Ya-Yu Nieh ,  Chang-Pin Chou

IPC分类号： B32B5/14 ,  B23B9/00 ,  B32B17/06

CPC分类号： G02B5/282 ,  B82Y20/00 ,  Y10T428/256 ,  Y10T428/26 ,  Y10T428/269

摘要： A nano-structure optical insulating membrane includes a substrate, a nano-structure layer formed on the substrate, and a metal layer formed on the nano-structure layer is disclosed. Upon exposure to light, the nano-structure layer increases visible light transmission but reduces internal reflection, and the metal layer blocks infrared light and thereby provides thermal insulation. The nano-structure optical insulating membrane of the present invention enhances illumination, spares lighting equipment, saves energy, and enables users to see farther.

摘要翻译： 公开了纳米结构的光学绝缘膜，其包括基板，形成在基板上的纳米结构层和形成在纳米结构层上的金属层。 在曝光时，纳米结构层增加了可见光透射率，但减少了内反射，并且金属层阻挡了红外光，从而提供了绝热。 本发明的纳米结构光学绝缘膜增强照明，备用照明设备，节约能源，使用户看得更远。

公开(公告)号：US20060090691A1

公开(公告)日：2006-05-04

申请号：US10978566

申请日：2004-11-02

申请人： Shih-Shian Ho ,  Hung-Yin Tsai ,  Chia-Jen Ting ,  Chun-Fa Lan ,  Chij-Chang Chen

发明人： Shih-Shian Ho ,  Hung-Yin Tsai ,  Chia-Jen Ting ,  Chun-Fa Lan ,  Chij-Chang Chen

IPC分类号： C30B23/00 ,  C30B25/00 ,  C30B28/12 ,  C30B28/14

CPC分类号： C30B29/30 ,  C30B29/32 ,  C30B33/06

摘要： A method for manufacturing a bonded wafer with ultra-thin single crystal ferroelectric film is provided, comprising the following steps: providing a single crystal ferroelectric wafer and a carrier wafer while activating the surfaces of the single crystal ferroelectric wafer and the carrier wafer; bonding the activated surface of the single crystal ferroelectric wafer to the activated surface of the carrier wafer; and thinning the single crystal ferroelectric wafer for forming an ultra-thin single crystal ferroelectric film. Wherein, the thinning process in the aforesaid preferred embodiment is the method of polishing, grinding, chemical mechanical polishing, or etching. And the bonding force generated in the bonding process is strong enough to resist the shearing force.

摘要翻译： 提供一种制造具有超薄单晶铁电体膜的接合晶片的方法，包括以下步骤：在激活单晶铁电晶片和载体晶片的表面的同时提供单晶铁电晶片和载体晶片; 将单晶铁电晶片的活化表面结合到载体晶片的活化表面; 并使用于形成超薄单晶铁电体膜的单晶铁电晶片变薄。 其中，上述优选实施方式中的变薄处理是抛光，研磨，化学机械抛光或蚀刻的方法。 并且在接合过程中产生的结合力足够强以抵抗剪切力。

公开(公告)号：US07329364B2

公开(公告)日：2008-02-12

申请号：US10978566

申请日：2004-11-02

申请人： Shih-Shian Ho ,  Hung-Yin Tsai ,  Chia-Jen Ting ,  Chun-Fa Lan ,  Chii-Chang Chen

发明人： Shih-Shian Ho ,  Hung-Yin Tsai ,  Chia-Jen Ting ,  Chun-Fa Lan ,  Chii-Chang Chen

IPC分类号： B44C1/22

CPC分类号： C30B29/30 ,  C30B29/32 ,  C30B33/06

摘要： A method for manufacturing a bonded wafer with ultra-thin single crystal ferroelectric film is provided, comprising the following steps: providing a single crystal ferroelectric wafer and a carrier wafer while activating the surfaces of the single crystal ferroelectric wafer and the carrier wafer; bonding the activated surface of the single crystal ferroelectric wafer to the activated surface of the carrier wafer; and thinning the single crystal ferroelectric wafer for forming an ultra-thin single crystal ferroelectric film. Wherein, the thinning process in the aforesaid preferred embodiment is the method of polishing, grinding, chemical mechanical polishing, or etching. And the bonding force generated in the bonding process is strong enough to resist the shearing force.

摘要翻译： 提供一种制造具有超薄单晶铁电体膜的接合晶片的方法，包括以下步骤：在激活单晶铁电晶片和载体晶片的表面的同时提供单晶铁电晶片和载体晶片; 将单晶铁电晶片的活化表面结合到载体晶片的活化表面; 并使用于形成超薄单晶铁电体膜的单晶铁电晶片变薄。 其中，上述优选实施方式中的变薄处理是抛光，研磨，化学机械抛光或蚀刻的方法。 并且在接合过程中产生的结合力足够强以抵抗剪切力。