公开(公告)号：US08296944B2

公开(公告)日：2012-10-30

申请号：US12787426

申请日：2010-05-26

申请人： Hung-Lin Chang ,  Chen-Chuan Chang

发明人： Hung-Lin Chang ,  Chen-Chuan Chang

IPC分类号： H01K3/10

CPC分类号： H05K3/0035 ,  H05K3/244 ,  H05K3/427 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/0317 ,  H05K2203/0361 ,  H05K2203/072 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method for manufacturing a printed circuit board includes the steps of: providing a base board having a first surface layer; performing a first patterning process to the base board to form a bottom circuit on the first surface layer; forming a metal protection layer on the bottom circuit; performing a second patterning process to the metal protection layer to form a patterned metal protection layer; performing a build-up process to the base board to form a first built-up layer on the bottom circuit and the patterned metal protection layer; performing a third patterning process to the first built-up layer to form a first built-up layer circuit; performing a laser manufacturing process to the first built-up layer to form a cavity structure; and clearing the patterned metal protection layer.

摘要翻译： 一种制造印刷电路板的方法包括以下步骤：提供具有第一表面层的基板; 对所述基板执行第一图案化处理以在所述第一表面层上形成底部电路; 在底部电路上形成金属保护层; 对金属保护层进行第二图案化处理以形成图案化的金属保护层; 对基板进行积聚处理以在底部电路和图案化的金属保护层上形成第一组合层; 对所述第一累积层执行第三图案化处理以形成第一累积层电路; 对所述第一组合层执行激光制造工艺以形成空腔结构; 并清除图案化的金属保护层。

公开(公告)号：US20100299917A1

公开(公告)日：2010-12-02

申请号：US12787426

申请日：2010-05-26

申请人： Hung-Lin Chang ,  Chen-Chuan Chang

发明人： Hung-Lin Chang ,  Chen-Chuan Chang

IPC分类号： H05K3/36

CPC分类号： H05K3/0035 ,  H05K3/244 ,  H05K3/427 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/0317 ,  H05K2203/0361 ,  H05K2203/072 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method for manufacturing a printed circuit board is disclosed. The method comprises the steps of: providing a base board, wherein the base board comprises a first surface layer; performing a first patterning process to the base board to form a bottom circuit on the first surface layer; forming a metal protection layer on the bottom circuit; performing a second patterning process to the metal protection layer to form a patterned metal protection layer; performing a build-up process to the base board to form a first built-up layer on the bottom circuit and the patterned metal protection layer; performing a third patterning process to the first built-up layer to form a first built-up layer circuit; performing a laser manufacturing process to the first built-up layer to form a cavity structure; and clearing the patterned metal protection layer.

摘要翻译： 公开了一种印刷电路板的制造方法。 该方法包括以下步骤：提供基板，其中基板包括第一表面层; 对所述基板执行第一图案化处理以在所述第一表面层上形成底部电路; 在底部电路上形成金属保护层; 对金属保护层进行第二图案化处理以形成图案化的金属保护层; 对基板进行积聚处理以在底部电路和图案化的金属保护层上形成第一组合层; 对所述第一累积层执行第三图案化处理以形成第一累积层电路; 对所述第一组合层执行激光制造工艺以形成空腔结构; 并清除图案化的金属保护层。

公开(公告)号：US07207843B1

公开(公告)日：2007-04-24

申请号：US11408869

申请日：2006-04-24

申请人： Hung-Lin Chang

发明人： Hung-Lin Chang

IPC分类号： H01R33/945

CPC分类号： H01R13/6666

摘要： A spark leakage shutoff protective device for a plug includes an upright snapping lever, a leakage detection electromagnetic valve, a restoring member, and an upright support wall. The snapping lever is located between the restoring member and the leakage detection electromagnetic valve. Thus, the snapping lever is hidden in the restoring member to reduce the volume of the spark leakage shutoff protective device so that the spark leakage shutoff protective device occupies a smaller space in the plug. In addition, the snapping lever is supported by the support wall, so that the snapping lever is not easily deformed or worn out during a long-term utilization, thereby enhancing the lifetime of the snapping lever.

摘要翻译： 用于插头的火花塞关闭保护装置包括直立卡扣杆，泄漏检测电磁阀，恢复构件和直立支撑壁。 捕捉杆位于恢复构件和泄漏检测电磁阀之间。 因此，卡扣杆隐藏在恢复构件中以减小火花塞泄漏关闭保护装置的体积，使得火花塞泄漏关闭保护装置在插头中占据较小的空间。 此外，卡扣杆由支撑壁支撑，使得卡扣杆在长期使用期间不容易变形或磨损，从而提高卡扣杆的寿命。