公开(公告)号：USRE45165E1

公开(公告)日：2014-09-30

申请号：US13372622

申请日：2012-02-14

申请人： Hung-Wei Chen ,  Tang-Xuan Zhong ,  Sheng-Da Liu ,  Chang-Yu Chang ,  Ping-Kun Wu ,  Chao-Hsiung Wang ,  Fu-Liang Yang

发明人： Hung-Wei Chen ,  Tang-Xuan Zhong ,  Sheng-Da Liu ,  Chang-Yu Chang ,  Ping-Kun Wu ,  Chao-Hsiung Wang ,  Fu-Liang Yang

IPC分类号： H01L23/12 ,  H01L23/053 ,  H01L29/06 ,  H01L27/085 ,  H01L29/04

CPC分类号： H01L29/1079 ,  H01L21/823412 ,  H01L21/823431 ,  H01L21/823437 ,  H01L21/823456 ,  H01L29/66795 ,  H01L29/7831 ,  H01L29/7851 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for forming a semiconductor device and a device made using the method are provided. In one example, the method includes forming a hard mask layer on a semiconductor substrate and patterning the hard mask layer to form multiple openings. The substrate is etched through the openings to form forming a plurality of trenches separating multiple semiconductor mesas. The trenches are partially filled with a dielectric material. The hard mask layer is removed and multiple-gate features are formed, with each multiple-gate feature being in contact with a top surface and sidewalls of at least one of the semiconductor mesas.

公开(公告)号：US06552914B1

公开(公告)日：2003-04-22

申请号：US09535190

申请日：2000-03-27

申请人： Chang-Yu Chang

发明人： Chang-Yu Chang

IPC分类号： H05K714

CPC分类号： H05K7/142 ,  H05K1/144

摘要： A circuit board assembly mechanism for assembling a first circuit board in suspension in the circuit board assembly mechanism includes a base and connecting bracket. The base has a pillar extruding from a bottom plate of the base and a side plate bending from a wing of the bottom plate. The pillar is positioned corresponding to a first hole of first circuit board and houses it atop by inserting a fixer through the first hole into the pillar. The connecting bracket has a first end and a second end in opposition to each other for connecting the first circuit board with the side plate of the base by fixing the first end on the first circuit board and restricting the second end on the side plate, thereby assembling the first plate in suspension within the base by the pillar and the connecting bracket and reserving the space between the first circuit board and the bottom plate for assembling a second circuit board.

摘要翻译： 用于将悬挂在电路板组装机构中的第一电路板组装的电路板组装机构包括底座和连接支架。 底座具有从基座的底板挤压的柱和从底板的翼弯曲的侧板。 该柱被定位成对应于第一电路板的第一孔，并通过将固定器穿过第一孔插入支柱而将其置于顶部。 连接支架具有彼此相对的第一端和第二端，用于通过将第一端固定在第一电路板上并将第二端限制在侧板上，从而将第一电路板与基座的侧板连接，由此 通过支柱和连接支架将第一板悬挂在基座内，并且保留第一电路板和底板之间的空间以组装第二电路板。