利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

11 条记录 (耗时 0.028 秒)

    Light emitting diode package employing lead terminal with reflecting surface
    1.
    发明授权
    Light emitting diode package employing lead terminal with reflecting surface 有权
    发光二极管封装采用带反射面的引线端子

    公开(公告)号：US07999280B2

    公开(公告)日：2011-08-16

    申请号：US11780051

    申请日：2007-07-19

    申请人： Hwa Ja Kim ,  Nam Young Kim ,  Myung Hee Lee ,  Kyoung Bo Han ,  Tae Kwang Kim ,  Ji Seop So

    发明人： Hwa Ja Kim ,  Nam Young Kim ,  Myung Hee Lee ,  Kyoung Bo Han ,  Tae Kwang Kim ,  Ji Seop So

    IPC分类号： H01L33/00

    CPC分类号： H01L33/60 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01012 ,  H01L2924/01079 ,  H01L2924/00014

    摘要： Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals that are spaced apart from each other. The first lead terminal has a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion. Meanwhile, a package body supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.

    摘要翻译： 公开了一种采用具有反射表面的引线端子的发光二极管（LED）封装。 该封装包括彼此间隔开的第一和第二引线端子。 第一引线端子具有LED芯片安装区域的下部，以及从下部弯曲形成的至少一个反射面。 同时，封装体支撑第一和第二引线端子并形成空腔，LED芯片安装区域和第一引线端子的反射表面和第二引线端子的一部分暴露在该空腔中。 第一和第二引线端子延伸到封装体的外部。 因此，从LED芯片发出的光可以以高反射率反射在反射面上，从而能够提高封装的光学效率。

    Light emitting diode package
    2.
    发明授权
    Light emitting diode package 有权
    发光二极管封装

    公开(公告)号：US08373180B2

    公开(公告)日：2013-02-12

    申请号：US12443314

    申请日：2007-09-21

    申请人： Hwa Ja Kim ,  Nam Young Kim ,  Myung Hee Lee ,  Kyoung Bo Han ,  Tae Kwang Kim ,  Ji Seop So

    发明人： Hwa Ja Kim ,  Nam Young Kim ,  Myung Hee Lee ,  Kyoung Bo Han ,  Tae Kwang Kim ,  Ji Seop So

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.

    摘要翻译： 公开了一种用于从发光二极管芯片发射的朝向侧面发射光的侧视型发光二极管封装。 侧视型发光二极管封装包括具有用于在发光方向上曝光发光二极管芯片的开口部分的封装体; 以及覆盖所述发光二极管芯片的透光性树脂，其中，所述开口部的内壁的至少一部分形成有用于将所述开口部分分割成上部和下部的台阶突起，并且所述开口的下部 在台阶突起下面的部分填充有可透光树脂。 因此，可以容易地形成具有凸透镜形状的透光性树脂，从而可以提高其发光效率。

    LIGHT EMITTING DIODE PACKAGE
    3.
    发明申请
    LIGHT EMITTING DIODE PACKAGE 有权
    发光二极管封装

    公开(公告)号：US20100096653A1

    公开(公告)日：2010-04-22

    申请号：US12443314

    申请日：2007-09-21

    申请人： Hwa Ja Kim ,  Nam Young Kim ,  Myung Hee Lee ,  Kyoung Bo Han ,  Tae Kwang Kim ,  Ji Seop So

    发明人： Hwa Ja Kim ,  Nam Young Kim ,  Myung Hee Lee ,  Kyoung Bo Han ,  Tae Kwang Kim ,  Ji Seop So

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.

    摘要翻译： 公开了一种用于从发光二极管芯片发射的朝向侧面发射光的侧视型发光二极管封装。 侧视型发光二极管封装包括具有用于在发光方向上曝光发光二极管芯片的开口部分的封装体; 以及覆盖所述发光二极管芯片的透光性树脂，其中，所述开口部的内壁的至少一部分形成有用于将所述开口部分分割成上部和下部的台阶突起，并且所述开口的下部 在台阶突起下面的部分填充有可透光树脂。 因此，可以容易地形成具有凸透镜形状的透光性树脂，从而可以提高其发光效率。

    SIDE VIEW TYPE LED PACKAGE
    4.
    发明申请
    SIDE VIEW TYPE LED PACKAGE 有权
    侧视图类型LED封装

    公开(公告)号：US20100301376A1

    公开(公告)日：2010-12-02

    申请号：US12851191

    申请日：2010-08-05

    申请人： Nam Young KIM ,  Tae Kwang Kim ,  Kyoung Bo Han ,  Myung Hee Lee

    发明人： Nam Young KIM ,  Tae Kwang Kim ,  Kyoung Bo Han ,  Myung Hee Lee

    IPC分类号： H01L33/62 ,  H01L33/64

    CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.

    摘要翻译： 在侧视型发光二极管（LED）封装中，引线框架部分和引线框架电接触部分暴露在封装体的外部以用作额外的散热路径。 侧视型LED封装包括LED芯片，具有用于接收LED芯片的开口的侧表面的封装体和用于向LED芯片施加电流的引线框架。 引线框架包括电连接到封装主体内的LED芯片的内部引线; 从所述内引线延伸到所述封装主体的下部并且在所述封装体的垂直于所述侧表面的下表面附近暴露于所述封装体外部的电接触小腿; 以及散热装置，其与电接触小腿分开地从包装体外部的至少一个内引线延伸。

    Side view type LED package
    5.
    发明授权
    Side view type LED package 有权
    侧视型LED封装

    公开(公告)号：US07935982B2

    公开(公告)日：2011-05-03

    申请号：US12851191

    申请日：2010-08-05

    申请人： Nam Young Kim ,  Tae Kwang Kim ,  Kyoung Bo Han ,  Myung Hee Lee

    发明人： Nam Young Kim ,  Tae Kwang Kim ,  Kyoung Bo Han ,  Myung Hee Lee

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.

    摘要翻译： 在侧视型发光二极管（LED）封装中，引线框架部分和引线框架电接触部分暴露在封装体的外部以用作额外的散热路径。 侧视型LED封装包括LED芯片，具有用于接收LED芯片的开口的侧表面的封装体和用于向LED芯片施加电流的引线框架。 引线框架包括电连接到封装主体内的LED芯片的内部引线; 从所述内引线延伸到所述封装主体的下部并且在所述封装体的垂直于所述侧表面的下表面附近暴露于所述封装体外部的电接触小腿; 以及散热装置，其与电接触小腿分开地从包装体外部的至少一个内引线延伸。

    SIDE VIEW TYPE LED PACKAGE
    6.
    发明申请
    SIDE VIEW TYPE LED PACKAGE 有权
    侧视图类型LED封装

    公开(公告)号：US20090179219A1

    公开(公告)日：2009-07-16

    申请号：US12299882

    申请日：2007-06-27

    申请人： Nam Young Kim ,  Tae Kwang Kim ,  Kyoung Bo Han ,  Myung Hee Lee

    发明人： Nam Young Kim ,  Tae Kwang Kim ,  Kyoung Bo Han ,  Myung Hee Lee

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.

    摘要翻译： 在侧视型发光二极管（LED）封装中，引线框架部分和引线框架电接触部分暴露在封装体的外部以用作额外的散热路径。 侧视型LED封装包括LED芯片，具有用于接收LED芯片的开口的侧表面的封装体和用于向LED芯片施加电流的引线框架。 引线框架包括电连接到封装主体内的LED芯片的内部引线; 从所述内引线延伸到所述封装主体的下部并且在所述封装体的垂直于所述侧表面的下表面附近暴露于所述封装体外部的电接触小腿; 以及散热装置，其与电接触小腿分开地从包装体外部的至少一个内引线延伸。

    Side view type LED package
    7.
    发明授权
    Side view type LED package 有权
    侧视型LED封装

    公开(公告)号：US07804105B2

    公开(公告)日：2010-09-28

    申请号：US12299882

    申请日：2007-06-27

    申请人： Nam Young Kim ,  Tae Kwang Kim ,  Kyoung Bo Han ,  Myung Hee Lee

    发明人： Nam Young Kim ,  Tae Kwang Kim ,  Kyoung Bo Han ,  Myung Hee Lee

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.

    摘要翻译： 在侧视型发光二极管（LED）封装中，引线框架部分和引线框架电接触部分暴露在封装体的外部以用作额外的散热路径。 侧视型LED封装包括LED芯片，具有用于接收LED芯片的开口的侧表面的封装体和用于向LED芯片施加电流的引线框架。 引线框架包括电连接到封装主体内的LED芯片的内部引线; 从所述内引线延伸到所述封装主体的下部并且在所述封装体的垂直于所述侧表面的下表面附近暴露于所述封装体外部的电接触小腿; 以及散热装置，其与电接触小腿分开地从包装体外部的至少一个内引线延伸。