公开(公告)号：US08373180B2

公开(公告)日：2013-02-12

申请号：US12443314

申请日：2007-09-21

申请人： Hwa Ja Kim ,  Nam Young Kim ,  Myung Hee Lee ,  Kyoung Bo Han ,  Tae Kwang Kim ,  Ji Seop So

发明人： Hwa Ja Kim ,  Nam Young Kim ,  Myung Hee Lee ,  Kyoung Bo Han ,  Tae Kwang Kim ,  Ji Seop So

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.

摘要翻译： 公开了一种用于从发光二极管芯片发射的朝向侧面发射光的侧视型发光二极管封装。 侧视型发光二极管封装包括具有用于在发光方向上曝光发光二极管芯片的开口部分的封装体; 以及覆盖所述发光二极管芯片的透光性树脂，其中，所述开口部的内壁的至少一部分形成有用于将所述开口部分分割成上部和下部的台阶突起，并且所述开口的下部 在台阶突起下面的部分填充有可透光树脂。 因此，可以容易地形成具有凸透镜形状的透光性树脂，从而可以提高其发光效率。

公开(公告)号：US20100096653A1

公开(公告)日：2010-04-22

申请号：US12443314

申请日：2007-09-21

申请人： Hwa Ja Kim ,  Nam Young Kim ,  Myung Hee Lee ,  Kyoung Bo Han ,  Tae Kwang Kim ,  Ji Seop So

发明人： Hwa Ja Kim ,  Nam Young Kim ,  Myung Hee Lee ,  Kyoung Bo Han ,  Tae Kwang Kim ,  Ji Seop So

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.

摘要翻译： 公开了一种用于从发光二极管芯片发射的朝向侧面发射光的侧视型发光二极管封装。 侧视型发光二极管封装包括具有用于在发光方向上曝光发光二极管芯片的开口部分的封装体; 以及覆盖所述发光二极管芯片的透光性树脂，其中，所述开口部的内壁的至少一部分形成有用于将所述开口部分分割成上部和下部的台阶突起，并且所述开口的下部 在台阶突起下面的部分填充有可透光树脂。 因此，可以容易地形成具有凸透镜形状的透光性树脂，从而可以提高其发光效率。

公开(公告)号：US20080048201A1

公开(公告)日：2008-02-28

申请号：US11780051

申请日：2007-07-19

申请人： Hwa Ja KIM ,  Nam Young KIM ,  Myung Hee LEE ,  Kyoung Bo HAN ,  Tae Kwang KIM ,  Ji Seop SO

发明人： Hwa Ja KIM ,  Nam Young KIM ,  Myung Hee LEE ,  Kyoung Bo HAN ,  Tae Kwang KIM ,  Ji Seop SO

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01012 ,  H01L2924/01079 ,  H01L2924/00014

摘要： Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals that are spaced apart from each other. The first lead terminal has a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion. Meanwhile, a package body supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.

摘要翻译： 公开了一种采用具有反射表面的引线端子的发光二极管（LED）封装。 该封装包括彼此间隔开的第一和第二引线端子。 第一引线端子具有LED芯片安装区域的下部，以及从下部弯曲形成的至少一个反射面。 同时，封装体支撑第一和第二引线端子并形成空腔，LED芯片安装区域和第一引线端子的反射表面和第二引线端子的一部分暴露在该空腔中。 第一和第二引线端子延伸到封装体的外部。 因此，从LED芯片发出的光可以以高反射率反射在反射面上，从而能够提高封装的光学效率。

公开(公告)号：US07928968B2

公开(公告)日：2011-04-19

申请号：US11801508

申请日：2007-05-10

申请人： Heung Soo Shon ,  Tae Kwang Kim ,  Chang Keun Lee ,  Hyun Sang Cho

发明人： Heung Soo Shon ,  Tae Kwang Kim ,  Chang Keun Lee ,  Hyun Sang Cho

IPC分类号： G06F3/038

CPC分类号： G09F9/33 ,  G09G3/32 ,  G09G2310/0275 ,  G09G2380/06

摘要： An apparatus for displaying an advertisement image having a plurality of image elements includes a display panel for displaying the advertisement image thereon. The display panel includes a plurality of clusters which are serially connected with one another and are arranged in a pattern same as that of the advertisement image. Each of the clusters has at least one LED cell corresponding to one image element in the advertisement image, respectively, and a driving unit for driving the LED cell to represent the corresponding image element on the LED cell. An image editor performs an editing of the advertisement image by way of changing color and/or brightness of the respective image elements cells. And a control module controls the driving of the clusters in synchronization with an editing period for the advertisement image.

摘要翻译： 用于显示具有多个图像元素的广告图像的装置包括用于在其上显示广告图像的显示面板。 显示面板包括彼此串联连接并以与广告图像相同的图案排列的多个簇。 每个簇分别具有对应于广告图像中的一个图像元素的至少一个LED单元，以及用于驱动LED单元以在LED单元上表示相应图像元素的驱动单元。 图像编辑器通过改变各个图像元素单元的颜色和/或亮度来执行广告图像的编辑。 并且控制模块与广告图像的编辑周期同步地控制群集的驱动。

公开(公告)号：US20100315835A1

公开(公告)日：2010-12-16

申请号：US12828633

申请日：2010-07-01

申请人： Jae-Ho Cho ,  Sean-Jhin Yoon ,  Tae-Kwang Kim ,  Kyung-Nam Kim

发明人： Jae-Ho Cho ,  Sean-Jhin Yoon ,  Tae-Kwang Kim ,  Kyung-Nam Kim

IPC分类号： F21V7/22 ,  F21V21/00

CPC分类号： H01L33/60 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED includes a light-emitting chip, a metal member, and a housing. The light-emitting chip generates light. The light-emitting chip is arranged on the metal member. The housing is combined with the metal member to fix the metal member. The housing has an opening portion exposing at least a portion of the light-emitting chip and the metal member. The metal member includes a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and including a metal.

摘要翻译： LED包括发光芯片，金属构件和壳体。 发光芯片产生光。 发光芯片布置在金属构件上。 壳体与金属构件组合以固定金属构件。 壳体具有露出发光芯片和金属构件的至少一部分的开口部分。 金属构件包括基底金属层，布置在基底金属层上的光反射层和布置在光反射层上并包括金属的保护层。

公开(公告)号：USD535037S1

公开(公告)日：2007-01-09

申请号：US29235166

申请日：2005-07-27

申请人： Tae Kwang Kim ,  Kwang Il Park

设计人： Tae Kwang Kim ,  Kwang Il Park

公开(公告)号：US20100301376A1

公开(公告)日：2010-12-02

申请号：US12851191

申请日：2010-08-05

申请人： Nam Young KIM ,  Tae Kwang Kim ,  Kyoung Bo Han ,  Myung Hee Lee

发明人： Nam Young KIM ,  Tae Kwang Kim ,  Kyoung Bo Han ,  Myung Hee Lee

IPC分类号： H01L33/62 ,  H01L33/64

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.

摘要翻译： 在侧视型发光二极管（LED）封装中，引线框架部分和引线框架电接触部分暴露在封装体的外部以用作额外的散热路径。 侧视型LED封装包括LED芯片，具有用于接收LED芯片的开口的侧表面的封装体和用于向LED芯片施加电流的引线框架。 引线框架包括电连接到封装主体内的LED芯片的内部引线; 从所述内引线延伸到所述封装主体的下部并且在所述封装体的垂直于所述侧表面的下表面附近暴露于所述封装体外部的电接触小腿; 以及散热装置，其与电接触小腿分开地从包装体外部的至少一个内引线延伸。

公开(公告)号：US20100202131A1

公开(公告)日：2010-08-12

申请号：US12680097

申请日：2008-09-19

申请人： Tae Kwang Kim ,  Chung Hoon Lee ,  Do Hyung Kim ,  Seung Ryeol Ryu ,  Chan Sung Jeong ,  Woong Joon Hwang

发明人： Tae Kwang Kim ,  Chung Hoon Lee ,  Do Hyung Kim ,  Seung Ryeol Ryu ,  Chan Sung Jeong ,  Woong Joon Hwang

IPC分类号： G02F1/13357 ,  H01L33/58

CPC分类号： H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： Disclosed is a light emitting diode (LED) package. The LED package comprises a package body having a cavity and a stepped portion positioned on a top portion of the cavity; an LED chip mounted on a bottom surface of the cavity; an encapsulant formed in the cavity to cover the LED chip; and a lens having a pattern and attached to the stepped portion on the encapsulant.

摘要翻译： 公开了一种发光二极管（LED）封装。 LED封装包括具有空腔的封装主体和位于空腔顶部的台阶部分; 安装在所述腔的底表面上的LED芯片; 形成在空腔中以覆盖LED芯片的密封剂; 以及具有图案并附着在密封剂上的阶梯部分的透镜。

公开(公告)号：US07999280B2

公开(公告)日：2011-08-16

申请号：US11780051

申请日：2007-07-19

申请人： Hwa Ja Kim ,  Nam Young Kim ,  Myung Hee Lee ,  Kyoung Bo Han ,  Tae Kwang Kim ,  Ji Seop So

发明人： Hwa Ja Kim ,  Nam Young Kim ,  Myung Hee Lee ,  Kyoung Bo Han ,  Tae Kwang Kim ,  Ji Seop So

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01012 ,  H01L2924/01079 ,  H01L2924/00014

摘要： Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals that are spaced apart from each other. The first lead terminal has a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion. Meanwhile, a package body supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.

摘要翻译： 公开了一种采用具有反射表面的引线端子的发光二极管（LED）封装。 该封装包括彼此间隔开的第一和第二引线端子。 第一引线端子具有LED芯片安装区域的下部，以及从下部弯曲形成的至少一个反射面。 同时，封装体支撑第一和第二引线端子并形成空腔，LED芯片安装区域和第一引线端子的反射表面和第二引线端子的一部分暴露在该空腔中。 第一和第二引线端子延伸到封装体的外部。 因此，从LED芯片发出的光可以以高反射率反射在反射面上，从而能够提高封装的光学效率。

公开(公告)号：US07804105B2

公开(公告)日：2010-09-28

申请号：US12299882

申请日：2007-06-27

申请人： Nam Young Kim ,  Tae Kwang Kim ,  Kyoung Bo Han ,  Myung Hee Lee

发明人： Nam Young Kim ,  Tae Kwang Kim ,  Kyoung Bo Han ,  Myung Hee Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.

摘要翻译： 在侧视型发光二极管（LED）封装中，引线框架部分和引线框架电接触部分暴露在封装体的外部以用作额外的散热路径。 侧视型LED封装包括LED芯片，具有用于接收LED芯片的开口的侧表面的封装体和用于向LED芯片施加电流的引线框架。 引线框架包括电连接到封装主体内的LED芯片的内部引线; 从所述内引线延伸到所述封装主体的下部并且在所述封装体的垂直于所述侧表面的下表面附近暴露于所述封装体外部的电接触小腿; 以及散热装置，其与电接触小腿分开地从包装体外部的至少一个内引线延伸。