Semiconductor memory device having vertical channel transistor and method for fabricating the same
    1.
    发明授权
    Semiconductor memory device having vertical channel transistor and method for fabricating the same 有权
    具有垂直沟道晶体管的半导体存储器件及其制造方法

    公开(公告)号:US08283714B2

    公开(公告)日:2012-10-09

    申请号:US13085898

    申请日:2011-04-13

    IPC分类号: H01L29/94

    摘要: Channels of two transistors are vertically formed on portions of two opposite side surfaces of one active region, and gate electrodes are vertically formed on a device isolation layer contacting the channels of the active region. A common bit line contact plug is formed in the central portions of the active region, two storage node contact plugs are formed on both sides of the bit line contact plug, and an insulating spacer is formed on a side surface of the bit line contact plug. A word line, a bit line, and a capacitor are sequentially stacked on the semiconductor substrate, like a conventional semiconductor memory device. Thus, effective space arrangement of a memory cell is possible such that a 4F2 structure is constituted, and a conventional line and contact forming process can be applied such that highly integrated semiconductor memory device is readily fabricated.

    摘要翻译: 两个晶体管的沟道垂直地形成在一个有源区的两个相对的侧表面的部分上,并且栅极垂直地形成在与有源区的沟道接触的器件隔离层上。 在有源区域的中心部分形成共同的位线接触插塞,在位线接触插塞的两侧形成两个存储节点接触插塞,并且在位线接触插头的侧面上形成绝缘间隔件 。 像现有的半导体存储器件一样,在半导体衬底上顺序层叠字线,位线和电容器。 因此,存储单元的有效空间布置是可能的,使得构成4F2结构,并且可以应用常规的线和接触形成工艺,从而容易地制造高度集成的半导体存储器件。

    SEMICONDUCTOR MEMORY DEVICE HAVING VERTICAL CHANNEL TRANSISTOR AND METHOD FOR FABRICATING THE SAME
    2.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE HAVING VERTICAL CHANNEL TRANSISTOR AND METHOD FOR FABRICATING THE SAME 有权
    具有垂直通道晶体管的半导体存储器件及其制造方法

    公开(公告)号:US20110186923A1

    公开(公告)日:2011-08-04

    申请号:US13085898

    申请日:2011-04-13

    IPC分类号: H01L29/78

    摘要: Channels of two transistors are vertically formed on portions of two opposite side surfaces of one active region, and gate electrodes are vertically formed on a device isolation layer contacting the channels of the active region. A common bit line contact plug is formed in the central portions of the active region, two storage node contact plugs are formed on both sides of the bit line contact plug, and an insulating spacer is formed on a side surface of the bit line contact plug. A word line, a bit line, and a capacitor are sequentially stacked on the semiconductor substrate, like a conventional semiconductor memory device. Thus, effective space arrangement of a memory cell is possible such that a 4F2 structure is constituted, and a conventional line and contact forming process can be applied such that highly integrated semiconductor memory device is readily fabricated

    摘要翻译: 两个晶体管的沟道垂直地形成在一个有源区的两个相对的侧表面的部分上,并且栅极垂直地形成在与有源区的沟道接触的器件隔离层上。 在有源区域的中心部分形成共同的位线接触插塞,在位线接触插塞的两侧形成两个存储节点接触插塞,并且在位线接触插头的侧面上形成绝缘间隔件 。 像现有的半导体存储器件一样,在半导体衬底上顺序层叠字线,位线和电容器。 因此,存储单元的有效空间布置是可能的,使得构成4F2结构,并且可以应用常规的线和接触形成工艺,使得容易制造高度集成的半导体存储器件

    Circuit device including vertical transistors connected to buried bitlines and method of manufacturing the same
    3.
    发明授权
    Circuit device including vertical transistors connected to buried bitlines and method of manufacturing the same 有权
    电路装置包括连接到埋地位线的垂直晶体管及其制造方法

    公开(公告)号:US07586149B2

    公开(公告)日:2009-09-08

    申请号:US11541756

    申请日:2006-10-02

    IPC分类号: H01L23/528 H01L27/108

    摘要: A circuit device including vertical transistors connected to buried bitlines and a method of manufacturing the circuit device. The circuit device includes a semiconductor substrate including a peripheral circuit region and left and right cell regions at both sides of the peripheral circuit region, bottom active regions arranged on the semiconductor substrate to be spaced apart from one another in a column direction and to extend from the peripheral circuit region alternately to the left cell region and the right cell region in a row direction, channel pillars protruding from the bottom active regions in a vertical direction and arranged to be aligned in the row direction and spaced apart from one another, gate electrodes provided with a gate dielectric layer and attached to surround side surfaces of the channel pillars, and buried bitlines extending along the bottom active regions, the bottom active regions including a bottom source/drain region.

    摘要翻译: 一种包括连接到掩埋位线的垂直晶体管的电路器件和制造该电路器件的方法。 该电路装置包括半导体衬底,该半导体衬底包括外围电路区域和在外围电路区域的两侧的左侧和右侧电池区域,布置在半导体衬底上的底部有源区域在列方向上彼此间隔开并从 所述外围电路区域与所述左侧单元区域和右侧单元区域交替地排列成行方向,所述通道柱从所述底部有源区域沿垂直方向突出并且被配置为在所述行方向上彼此对准并且彼此间隔开,栅电极 设置有栅介电层并且被附接到环绕通道柱的侧表面,以及沿底部有源区延伸的掩埋位线,底部有源区包括底部源极/漏极区。

    Semiconductor memory device having vertical channel transistor and method for fabricating the same
    4.
    发明授权
    Semiconductor memory device having vertical channel transistor and method for fabricating the same 有权
    具有垂直沟道晶体管的半导体存储器件及其制造方法

    公开(公告)号:US08482045B2

    公开(公告)日:2013-07-09

    申请号:US13549648

    申请日:2012-07-16

    IPC分类号: H01L27/108 H01L21/8242

    摘要: Channels of two transistors are vertically formed on portions of two opposite side surfaces of one active region, and gate electrodes are vertically formed on a device isolation layer contacting the channels of the active region. A common bit line contact plug is formed in the central portions of the active region, two storage node contact plugs are formed on both sides of the bit line contact plug, and an insulating spacer is formed on a side surface of the bit line contact plug. A word line, a bit line, and a capacitor are sequentially stacked on the semiconductor substrate, like a conventional semiconductor memory device. Thus, effective space arrangement of a memory cell is possible such that a 4F2 structure is constituted, and a conventional line and contact forming process can be applied such that highly integrated semiconductor memory device is readily fabricated.

    摘要翻译: 两个晶体管的沟道垂直地形成在一个有源区的两个相对的侧表面的部分上,并且栅极垂直地形成在与有源区的沟道接触的器件隔离层上。 在有源区域的中心部分形成共同的位线接触插塞,在位线接触插塞的两侧形成两个存储节点接触插塞,并且在位线接触插头的侧面上形成绝缘间隔件 。 像现有的半导体存储器件一样,在半导体衬底上顺序层叠字线,位线和电容器。 因此,存储单元的有效空间布置是可能的,使得构成4F2结构,并且可以应用常规的线和接触形成工艺,从而容易地制造高度集成的半导体存储器件。

    Semiconductor memory device having vertical channel transistor and method for fabricating the same
    5.
    发明申请
    Semiconductor memory device having vertical channel transistor and method for fabricating the same 有权
    具有垂直沟道晶体管的半导体存储器件及其制造方法

    公开(公告)号:US20070152255A1

    公开(公告)日:2007-07-05

    申请号:US11600568

    申请日:2006-11-16

    IPC分类号: H01L29/94

    摘要: Channels of two transistors are vertically formed on portions of two opposite side surfaces of one active region, and gate electrodes are vertically formed on a device isolation layer contacting the channels of the active region. A common bit line contact plug is formed in the central portions of the active region, two storage node contact plugs are formed on both sides of the bit line contact plug, and an insulating spacer is formed on a side surface of the bit line contact plug. A word line, a bit line, and a capacitor are sequentially stacked on the semiconductor substrate, like a conventional semiconductor memory device. Thus, effective space arrangement of a memory cell is possible such that a 4F2 structure is constituted, and a conventional line and contact forming process can be applied such that highly integrated semiconductor memory device is readily fabricated

    摘要翻译: 两个晶体管的沟道垂直地形成在一个有源区的两个相对的侧表面的部分上,并且栅极垂直地形成在与有源区的沟道接触的器件隔离层上。 在有源区域的中心部分形成共同的位线接触插塞,在位线接触插塞的两侧形成两个存储节点接触插塞,并且在位线接触插头的侧面上形成绝缘间隔件 。 像现有的半导体存储器件一样,在半导体衬底上顺序层叠字线,位线和电容器。 因此,存储单元的有效空间布置是可能的,使得构成4F 2结构,并且可以应用传统的线和接触形成工艺,使得容易制造高度集成的半导体存储器件

    SEMICONDUCTOR MEMORY DEVICE HAVING VERTICAL CHANNEL TRANSISTOR AND METHOD FOR FABRICATING THE SAME
    6.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE HAVING VERTICAL CHANNEL TRANSISTOR AND METHOD FOR FABRICATING THE SAME 有权
    具有垂直通道晶体管的半导体存储器件及其制造方法

    公开(公告)号:US20120273898A1

    公开(公告)日:2012-11-01

    申请号:US13549648

    申请日:2012-07-16

    IPC分类号: H01L27/088

    摘要: Channels of two transistors are vertically formed on portions of two opposite side surfaces of one active region, and gate electrodes are vertically formed on a device isolation layer contacting the channels of the active region. A common bit line contact plug is formed in the central portions of the active region, two storage node contact plugs are formed on both sides of the bit line contact plug, and an insulating spacer is formed on a side surface of the bit line contact plug. A word line, a bit line, and a capacitor are sequentially stacked on the semiconductor substrate, like a conventional semiconductor memory device. Thus, effective space arrangement of a memory cell is possible such that a 4F2 structure is constituted, and a conventional line and contact forming process can be applied such that highly integrated semiconductor memory device is readily fabricated

    摘要翻译: 两个晶体管的沟道垂直地形成在一个有源区的两个相对的侧表面的部分上,并且栅极垂直地形成在与有源区的沟道接触的器件隔离层上。 在有源区域的中心部分形成共同的位线接触插塞,在位线接触插塞的两侧形成两个存储节点接触插塞,并且在位线接触插头的侧面上形成绝缘间隔件 。 像现有的半导体存储器件一样,在半导体衬底上顺序层叠字线,位线和电容器。 因此,存储单元的有效空间布置是可能的,使得构成4F2结构,并且可以应用常规的线和接触形成工艺,使得容易制造高度集成的半导体存储器件

    Semiconductor memory device having vertical channel transistor and method for fabricating the same
    7.
    发明授权
    Semiconductor memory device having vertical channel transistor and method for fabricating the same 有权
    具有垂直沟道晶体管的半导体存储器件及其制造方法

    公开(公告)号:US08022457B2

    公开(公告)日:2011-09-20

    申请号:US11600568

    申请日:2006-11-16

    IPC分类号: H01L29/94

    摘要: Channels of two transistors are vertically formed on portions of two opposite side surfaces of one active region, and gate electrodes are vertically formed on a device isolation layer contacting the channels of the active region. A common bit line contact plug is formed in the central portions of the active region, two storage node contact plugs are formed on both sides of the bit line contact plug, and an insulating spacer is formed on a side surface of the bit line contact plug. A word line, a bit line, and a capacitor are sequentially stacked on the semiconductor substrate, like a conventional semiconductor memory device. Thus, effective space arrangement of a memory cell is possible such that a 4F2 structure is constituted, and a conventional line and contact forming process can be applied such that highly integrated semiconductor memory device is readily fabricated.

    摘要翻译: 两个晶体管的沟道垂直地形成在一个有源区的两个相对的侧表面的部分上,并且栅极垂直地形成在与有源区的沟道接触的器件隔离层上。 在有源区域的中心部分形成共同的位线接触插塞,在位线接触插塞的两侧形成两个存储节点接触插塞,并且在位线接触插头的侧面上形成绝缘间隔件 。 像现有的半导体存储器件一样,在半导体衬底上顺序层叠字线,位线和电容器。 因此,存储单元的有效空间布置是可能的,使得构成4F2结构,并且可以应用常规的线和接触形成工艺,从而容易地制造高度集成的半导体存储器件。

    Circuit device including vertical transistors connected to buried bitlines and method of manufacturing the same
    8.
    发明申请
    Circuit device including vertical transistors connected to buried bitlines and method of manufacturing the same 有权
    电路装置包括连接到埋地位线的垂直晶体管及其制造方法

    公开(公告)号:US20070075359A1

    公开(公告)日:2007-04-05

    申请号:US11541756

    申请日:2006-10-02

    IPC分类号: H01L21/8238

    摘要: In a circuit device including vertical transistors connected to buried bitlines and a method of manufacturing the circuit device, the circuit device includes a semiconductor substrate including a peripheral circuit region and left and right cell regions at both sides of the peripheral circuit region; bottom active regions arranged on the semiconductor substrate to be spaced apart from one another in a column direction and to extend from the peripheral circuit region alternately to the left cell region and the right cell region in a row direction; channel pillars protruding from the bottom active regions in a vertical direction and arranged to be aligned in the row direction and spaced apart from one another; gate electrodes provided with a gate dielectric layer and attached to surround side surfaces of the channel pillars; buried bitlines extending along the bottom active regions, the bottom active regions including a bottom source/drain region; local interconnection lines contacting side surfaces of the gate electrodes in the peripheral circuit region and extending between the gate electrodes to commonly interconnect the gate electrodes in the peripheral circuit region, thereby configuring a peripheral circuit; signal lines electrically connected to upper surfaces of the channel pillars or to at least one of the local interconnection lines; and interconnection contacts electrically connecting the local interconnection line to the buried bitline of a different row from that of the commonly-connected gate electrodes or electrically connecting the local interconnection lines to the signal lines, thereby configuring the peripheral circuit.

    摘要翻译: 在包括连接到掩埋位线的垂直晶体管的电路器件和制造电路器件的方法中,电路器件包括半导体衬底,该半导体衬底包括外围电路区域和外围电路区域两侧的左右单元区域; 布置在半导体衬底上的底部有源区域在列方向上彼此间隔开并且从外围电路区域交替地延伸到左小区区域和右小区区域在行方向上延伸; 通道柱从垂直方向从底部有源区域突出并且布置成在行方向上对齐并且彼此间隔开; 栅极电极设置有栅极电介质层并附接到环绕通道柱的侧表面; 掩埋位线沿着底部有源区延伸,底部有源区域包括底部源极/漏极区域; 局部互连线与外围电路区域中的栅电极的侧表面接触并在栅电极之间延伸,以在外围电路区域中共同连接栅电极,从而构成外围电路; 信号线电连接到通道柱的上表面或至少一个局部互连线; 以及互连触点将本地互连线电连接到与共用栅极电极的不同行的掩埋位线或将本地互连线电连接到信号线,从而配置外围电路。

    SEMICONDUCTOR MEMORY DEVICE WITH VERTICAL CHANNEL TRANSISTOR AND METHOD OF FABRICATING THE SAME
    9.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE WITH VERTICAL CHANNEL TRANSISTOR AND METHOD OF FABRICATING THE SAME 有权
    具有垂直通道晶体管的半导体存储器件及其制造方法

    公开(公告)号:US20080211013A1

    公开(公告)日:2008-09-04

    申请号:US12118268

    申请日:2008-05-09

    IPC分类号: H01L29/78

    摘要: In a semiconductor memory device having a vertical channel transistor a body of which is connected to a substrate and a method of fabricating the same, the semiconductor memory device includes a semiconductor substrate including a plurality of pillars arranged spaced apart from one another, and each of the pillars includes a body portion and a pair of pillar portions extending from the body portion and spaced apart from each other. A gate electrode is formed to surround each of the pillar portions. A bitline is disposed on the body portion to penetrate a region between a pair of the pillar portions of each of the first pillars arranged to extend in a first direction. A wordline is disposed over the bitline, arranged to extend in a second direction intersecting the first direction, and configured to contact the side surface of the gate electrode. A first doped region is formed in the upper surface of each of the pillar portions of the pillar. A second doped region is formed on the body portion of the pillar and connected electrically to the bitline. Storage node electrodes are connected electrically to the first doped region and disposed on each of the pillar portions.

    摘要翻译: 在具有其主体连接到基板的垂直沟道晶体管的半导体存储器件及其制造方法中,半导体存储器件包括:半导体衬底,其包括彼此间隔布置的多个柱,并且每个 支柱包括主体部分和从主体部分延伸并彼此间隔开的一对柱部分。 形成围绕每个支柱部分的栅电极。 位于所述主体部分上的位线穿过所述第一支柱中的所述第一支柱的一对支柱之间的区域,所述第一支柱布置成沿第一方向延伸。 字线布置在位线之外,布置成沿与第一方向相交的第二方向延伸,并且被配置为接触栅电极的侧表面。 第一掺杂区域形成在柱的每个柱部分的上表面中。 第二掺杂区形成在柱的主体部分上并与电位线连接。 存储节点电极与第一掺杂区域电连接并设置在每个柱部分上。

    Semiconductor memory device with vertical channel transistor and method of fabricating the same
    10.
    发明授权
    Semiconductor memory device with vertical channel transistor and method of fabricating the same 有权
    具有垂直沟道晶体管的半导体存储器件及其制造方法

    公开(公告)号:US07387931B2

    公开(公告)日:2008-06-17

    申请号:US11546581

    申请日:2006-10-11

    IPC分类号: H01L21/8242 H01L21/336

    摘要: In a semiconductor memory device having a vertical channel transistor a body of which is connected to a substrate and a method of fabricating the same, the semiconductor memory device includes a semiconductor substrate including a plurality of pillars arranged spaced apart from one another, and each of the pillars includes a body portion and a pair of pillar portions extending from the body portion and spaced apart from each other. A gate electrode is formed to surround each of the pillar portions. A bitline is disposed on the body portion to penetrate a region between a pair of the pillar portions of each of the first pillars arranged to extend in a first direction. A wordline is disposed over the bitline, arranged to extend in a second direction intersecting the first direction, and configured to contact the side surface of the gate electrode. A first doped region is formed in the upper surface of each of the pillar portions of the pillar. A second doped region is formed on the body portion of the pillar and connected electrically to the bitline. Storage node electrodes are connected electrically to the first doped region and disposed on each of the pillar portions.

    摘要翻译: 在具有其主体连接到基板的垂直沟道晶体管的半导体存储器件及其制造方法中,半导体存储器件包括:半导体衬底,其包括彼此间隔布置的多个柱,并且每个 支柱包括主体部分和从主体部分延伸并彼此间隔开的一对柱部分。 形成围绕每个支柱部分的栅电极。 位于所述主体部分上的位线穿过所述第一支柱中的所述第一支柱的一对支柱之间的区域,所述第一支柱布置成沿第一方向延伸。 字线布置在位线之外,布置成沿与第一方向相交的第二方向延伸,并且被配置为接触栅电极的侧表面。 第一掺杂区域形成在柱的每个柱部分的上表面中。 第二掺杂区形成在柱的主体部分上并与电位线连接。 存储节点电极与第一掺杂区域电连接并设置在每个柱部分上。