Method of forming fine patterns of a semiconductor device
    1.
    发明授权
    Method of forming fine patterns of a semiconductor device 有权
    形成半导体器件精细图案的方法

    公开(公告)号:US08173358B2

    公开(公告)日:2012-05-08

    申请号:US12432357

    申请日:2009-04-29

    摘要: A method of forming fine patterns of a semiconductor device includes forming a plurality of first mask patterns on a substrate such that the plurality of first mask patterns are separated from one another by a space located therebetween, in a direction parallel to a main surface of the substrate, forming a plurality of capping films formed of a first material having a first solubility in a solvent on sidewalls and a top surface of the plurality of first mask patterns. The method further includes forming a second mask layer formed of a second material having a second solubility in the solvent, which is less than the first solubility, so as to fill the space located between the plurality of first mask patterns, and forming a plurality of second mask patterns corresponding to residual portions of the second mask layer which remain in the space located between the plurality of first mask patterns, after removing the plurality of capping films and a portion of the second mask layer using the solvent.

    摘要翻译: 一种形成半导体器件的精细图案的方法包括在衬底上形成多个第一掩模图案,使得多个第一掩模图案在平行于所述第一掩模图案的主表面的方向上彼此分开位于其间的空间 形成多个由第一材料形成的封盖膜,该第一材料在溶剂中具有第一溶解性,并且在多个第一掩模图案的侧壁和顶表面上形成。 该方法还包括形成由溶剂中第二溶解度小于第一溶解度的第二材料形成的第二掩模层,以填充位于多个第一掩模图案之间的空间,并形成多个 第二掩模图案对应于残留在位于多个第一掩模图案之间的空间中的第二掩模层的残留部分,在使用溶剂除去多个封盖膜和第二掩模层的一部分之后。