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    Integral polishing pad and manufacturing method thereof
    1.
    发明授权
    Integral polishing pad and manufacturing method thereof 有权
    一体抛光垫及其制造方法

    公开(公告)号：US07029747B2

    公开(公告)日：2006-04-18

    申请号：US10648403

    申请日：2003-08-27

    申请人： Hyun Huh ,  Sang-Mok Lee ,  Kee-Cheon Song ,  Seung-geun Kim ,  Do-Kwon Son

    发明人： Hyun Huh ,  Sang-Mok Lee ,  Kee-Cheon Song ,  Seung-geun Kim ,  Do-Kwon Son

    IPC分类号： B32B3/26 ,  B32B7/02 ,  B24B1/00 ,  C09K3/14 ,  B24D11/00

    CPC分类号： B24B37/205 ,  B24D3/32 ,  Y10T428/24372 ,  Y10T428/24405 ,  Y10T428/24612 ,  Y10T428/24983 ,  Y10T428/249978 ,  Y10T428/24998 ,  Y10T428/249988 ,  Y10T428/2984

    摘要： An integral polishing pad includes an elastic support layer and a polishing layer, which is formed on the elastic support layer and has a higher hardness than the elastic support layer. The elastic support layer and the polishing layer are made from materials chemically compatible with each other so that a structural border between the elastic support layer and the polishing layer does not exist. In addition, the integral polishing pad also includes a transparent region, which is transparent to a light source used to detect the surface state of an object being polished and integrated with the other elements of the integral polishing pad. The integral polishing pad has high planarization efficiency and uniform properties, and thus can be reliably used for polishing. In addition, the integral polishing pad prevents a congestion of a polishing slurry and facilitates delivery of the polishing slurry. The integral polishing pad does not need an adhesive for connecting elements or a process for bonding the elements, thereby simplifying manufacturing processes.

    摘要翻译： 整体抛光垫包括弹性支撑层和抛光层，其形成在弹性支撑层上并且具有比弹性支撑层更高的硬度。 弹性支撑层和抛光层由彼此化学相容的材料制成，使得弹性支撑层和抛光层之间的结构边界不存在。 此外，整体抛光垫还包括对于用于检测待抛光物体的表面状态的光源透明的透明区域，并与整体抛光垫的其它元件集成。 整体抛光垫具有高的平坦化效率和均匀的性能，因此可以可靠地用于抛光。 此外，整体抛光垫防止抛光浆料的挤塞并且有利于抛光浆料的输送。 整体抛光垫不需要用于连接元件的粘合剂或用于粘合元件的工艺，从而简化了制造工艺。

    Integral polishing pad and manufacturing method thereof
    2.
    发明申请
    Integral polishing pad and manufacturing method thereof 有权
    一体抛光垫及其制造方法

    公开(公告)号：US20050260928A1

    公开(公告)日：2005-11-24

    申请号：US10648403

    申请日：2003-08-27

    申请人： Hyun Huh ,  Sang-Mok Lee ,  Kee-Cheon Song ,  Seung-Geun Kim ,  Do-Kwon Son

    发明人： Hyun Huh ,  Sang-Mok Lee ,  Kee-Cheon Song ,  Seung-Geun Kim ,  Do-Kwon Son

    IPC分类号： B24B1/00 ,  B24B37/07 ,  B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  B24D3/00 ,  B24D3/32 ,  B24D11/00 ,  H01L21/304

    CPC分类号： B24B37/205 ,  B24D3/32 ,  Y10T428/24372 ,  Y10T428/24405 ,  Y10T428/24612 ,  Y10T428/24983 ,  Y10T428/249978 ,  Y10T428/24998 ,  Y10T428/249988 ,  Y10T428/2984

    摘要： An integral polishing pad includes an elastic support layer and a polishing layer, which is formed on the elastic support layer and has a higher hardness than the elastic support layer. The elastic support layer and the polishing layer are made from materials chemically compatible with each other so that a structural border between the elastic support layer and the polishing layer does not exist. In addition, the integral polishing pad also includes a transparent region, which is transparent to a light source used to detect the surface state of an object being polished and integrated with the other elements of the integral polishing pad. The integral polishing pad has high planarization efficiency and uniform properties, and thus can be reliably used for polishing. In addition, the integral polishing pad prevents a congestion of a polishing slurry and facilitates delivery of the polishing slurry. The integral polishing pad does not need an adhesive for connecting elements or a process for bonding the elements, thereby simplifying manufacturing processes.

    摘要翻译： 整体抛光垫包括弹性支撑层和抛光层，其形成在弹性支撑层上并且具有比弹性支撑层更高的硬度。 弹性支撑层和抛光层由彼此化学相容的材料制成，使得弹性支撑层和抛光层之间的结构边界不存在。 此外，整体抛光垫还包括对于用于检测待抛光物体的表面状态的光源透明的透明区域，并与整体抛光垫的其它元件集成。 整体抛光垫具有高的平坦化效率和均匀的性能，因此可以可靠地用于抛光。 此外，整体抛光垫防止抛光浆料的挤塞并且有利于抛光浆料的输送。 整体抛光垫不需要用于连接元件的粘合剂或用于粘合元件的工艺，从而简化了制造工艺。