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公开(公告)号：US20140075751A1
公开(公告)日：2014-03-20
申请号：US13732728
申请日：2013-01-02
发明人： Ting-Hsi LI , Yu-Jen LIN
IPC分类号： H05K13/00
CPC分类号： H05K13/00 , H01L21/4821 , H01L33/0095 , H01L2933/0033 , Y10T29/49149
摘要： The invention relates to a method for manufacturing LED lead frame. The method comprises steps of: (a) forming a metal base with a plurality of lead areas by injection molding; (b) electroplating the metal base; and (c) forming an insulating casing on each of the lead areas.
摘要翻译： 本发明涉及一种LED引线框架的制造方法。 该方法包括以下步骤：（a）通过注射成型形成具有多个引线区域的金属基底; （b）电镀金属基底; 和（c）在每个引导区域上形成绝缘壳体。
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公开(公告)号：US20150129295A1
公开(公告)日：2015-05-14
申请号：US14076780
申请日：2013-11-11
发明人： Ting-Hsi LI , Yu-Jen LIN
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A double-shot injection molding formed LED lead frame structure includes an inner base having an inner bottom portion and an inner surrounding wall surrounding on top of the inner bottom portion, the inner surrounding wall forming a central hollow portion on top of the inner bottom portion, and the inner bottom portion having an inner surface facing toward the central hollow portion; a plurality of conductive pins with each one thereof constructed by a soldering section, a securement section and an extension section respectively; and an outer base comprising an outer bottom portion attached to a bottom of the inner bottom portion and an outer surrounding wall surrounding on top of the outer bottom portion and enclosing an outer of the inner surrounding wall; wherein each one of the securement sections of the conductive pins extends to arch between the inner bottom portion and the inner surrounding wall.
摘要翻译： 一种双射注射成型的LED引线框架结构包括：内底部，其具有围绕内底部顶部的内底部和内围壁，内周壁在内底部的顶部形成中心空心部分 并且内底部具有面向中心中空部的内表面; 多个导电针，其每一个分别由焊接部，固定部和延伸部构成; 以及外底部，其包括附接到所述内底部的底部的外底部和围绕所述外底部的顶部并且包围所述内围环的外部的外围壁; 其中导电针的固定部分中的每一个在内底部和内周围壁之间延伸到拱形。
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