公开(公告)号：US20190236240A1

公开(公告)日：2019-08-01

申请号：US16383683

申请日：2019-04-15

Applicant: I-SHOU UNIVERSITY

Inventor： Yu-Jung Huang ,  Chung-Long Pan ,  Mei-Hui Guo

IPC: G06F17/50 ,  G06N20/00 ,  G06F11/22 ,  G06F11/263

Abstract: A defect detection method for a multilayer daisy chain structure, including: generating a plurality of physical models having a defect of at least one defect type based on the at least one defect type of a daisy chain structure; generating a group of training samples for each of the physical models; generating a classifier model by using a machine learning technique algorithm via scattering parameter values of a training set; measuring an error value by comparing scattering parameter values of a testing set with the classifier model, using the classifier model as a defect model of the defect type based on the error value, and determining that the multilayer daisy chain has a defect corresponding to the at least one defect type by comparing actual measurements of scattering parameter values.

公开(公告)号：US09748621B2

公开(公告)日：2017-08-29

申请号：US14983635

申请日：2015-12-30

Applicant: I-SHOU UNIVERSITY

Inventor： Chung-Long Pan ,  Rong-Ching Wu ,  Tsu-Chung Tan

IPC: H01P1/203

CPC classification number: H01P1/20363

Abstract: A step impedance resonator filter including a first resonator and a second resonator is disclosed. The first resonator includes a first coupled line and a first tapped line connected to the first coupled line. The second resonator includes a second coupled line and a second tapped line connected to the second coupled line. The second coupled line is coupled with the first coupled line. The first tapped line has a first central line which is spaced from an end face of the first coupled line at a first distance. The second tapped line has a second central line which is spaced from an end face of the second coupled line at a second distance. The first distance is larger than the second distance. As such, the performance of the step impedance resonator filter can be improved.

公开(公告)号：US10776559B2

公开(公告)日：2020-09-15

申请号：US16383683

申请日：2019-04-15

Applicant: I-SHOU UNIVERSITY

Inventor： Yu-Jung Huang ,  Chung-Long Pan ,  Mei-Hui Guo

IPC: G06F30/398 ,  G06F11/263 ,  G06F11/22 ,  G06N20/00

Abstract: A defect detection method for a multilayer daisy chain structure, including: generating a plurality of physical models having a defect of at least one defect type based on the at least one defect type of a daisy chain structure; generating a group of training samples for each of the physical models; generating a classifier model by using a machine learning technique algorithm via scattering parameter values of a training set; measuring an error value by comparing scattering parameter values of a testing set with the classifier model, using the classifier model as a defect model of the defect type based on the error value, and determining that the multilayer daisy chain has a defect corresponding to the at least one defect type by comparing actual measurements of scattering parameter values.

公开(公告)号：US10303823B2

公开(公告)日：2019-05-28

申请号：US15604671

申请日：2017-05-25

Applicant: I-SHOU UNIVERSITY

Inventor： Yu-Jung Huang ,  Chung-Long Pan ,  Shih-Chun Lin ,  Mei-Hui Guo

IPC: G06F17/50 ,  G06N20/00

Abstract: A defect detection method for a 3D chip and a system using the same are provided. The method includes: generating a plurality of physical models having a defect of at least one defect type based on the at least one defect type of a 3D chip; generating a group of training samples for each of the physical models; generating a classifier model by using a machine learning technique algorithm via scattering parameter values of a training set; measuring an error value by comparing scattering parameter values of a testing set with the classifier model, using the classifier model as a defect model of the defect type based on the error value, and determining that a Through Silicon Via of a single die 3D chip or a stacked die 3D chip has a defect corresponding to the at least one defect type by comparing actual measurements of scattering parameter values.

公开(公告)号：US20180285493A1

公开(公告)日：2018-10-04

申请号：US15604671

申请日：2017-05-25

Applicant: I-SHOU UNIVERSITY

Inventor： Yu-Jung Huang ,  Chung-Long Pan ,  Shih-Chun Lin ,  Mei-Hui Guo

IPC: G06F17/50 ,  G06N99/00

CPC classification number: G06F17/5009 ,  G06F17/5081 ,  G06N99/005

Abstract: A defect detection method for a 3D chip and a system using the same are provided. The method includes: generating a plurality of physical models having a defect of at least one defect type based on the at least one defect type of a 3D chip; generating a group of training samples for each of the physical models; generating a classifier model by using a machine learning technique algorithm via scattering parameter values of a training set; measuring an error value by comparing scattering parameter values of a testing set with the classifier model, using the classifier model as a defect model of the defect type based on the error value, and determining that a Through Silicon Via of a single die 3D chip or a stacked die 3D chip has a defect corresponding to the at least one defect type by comparing actual measurements of scattering parameter values.

公开(公告)号：US09774068B2

公开(公告)日：2017-09-26

申请号：US14983648

申请日：2015-12-30

Applicant: I-SHOU UNIVERSITY

Inventor： Chung-Long Pan ,  Rong-Ching Wu ,  Tsu-Chung Tan

IPC: H01P1/203 ,  H03H7/38

CPC classification number: H03H7/38 ,  H01P1/20363

Abstract: A filter configuration including a substrate, a primary microstrip line and a first defected ground structure is disclosed. The substrate has a first face and a second face. The second face is a ground face. The primary microstrip line is arranged on the first face and extends in a first direction. The first defected ground structure is arranged on the second face. The first defected ground structure includes a first section, a first circular section, a second section, a second circular section and a third section that are connected to each other in sequence in a second direction perpendicular to the first direction. The second section is covered by the primary microstrip line in a vertical direction perpendicular to the first and second faces. The primary microstrip line has a width equal to a minimum length of the second section. As such, the filtering effect can be improved.

公开(公告)号：US20190222071A1

公开(公告)日：2019-07-18

申请号：US16039240

申请日：2018-07-18

Applicant: I-SHOU UNIVERSITY

Inventor： Chung-Long Pan ,  Rong-Ching Wu ,  Wei-Cheng Lin ,  You-Hua Jiang

IPC: H02J50/23 ,  H02J50/27 ,  H01Q19/30

CPC classification number: H02J50/23 ,  H01Q19/30 ,  H02J50/27

Abstract: A wireless power transmission system is provided. The wireless power transmission system includes a transmitting antenna and a receiving antenna. The transmitting antenna is coupled to a power source device, and the transmitting antenna is a Yagi-Uda antenna. The transmitting antenna receives a first power signal provided by the power source device and transmits a power radiation signal toward a first direction. The receiving antenna is coupled to a rectifier, the rectifier is coupled to a power receiver, and the receiving antenna is a Yagi-Uda antenna. The receiving antenna has a predetermined distance from the transmitting antenna. The receiving antenna receives the power radiation signal and converts the power radiation signal into a second power signal. The rectifier converts the second power signal into a third power signal and transmits the third power signal to the power receiver.

公开(公告)号：US20170194684A1

公开(公告)日：2017-07-06

申请号：US14983648

申请日：2015-12-30

Applicant: I-SHOU UNIVERSITY

Inventor： Chung-Long Pan ,  Rong-Ching Wu ,  Tsu-Chung Tan

IPC: H01P1/203

CPC classification number: H03H7/38 ,  H01P1/20363

Abstract: A filter configuration including a substrate, a primary microstrip line and a first defected ground structure is disclosed. The substrate has a first face and a second face. The second face is a ground face. The primary microstrip line is arranged on the first face and extends in a first direction.The first defected ground structure is arranged on the second face. The first defected ground structure includes a first section, a first circular section, a second section, a second circular section and a third section that are connected to each other in sequence in a second direction perpendicular to the first direction. The second section is covered by the primary microstrip line in a vertical direction perpendicular to the first and second faces. The primary microstrip line has a width equal to a minimum length of the second section. As such, the filtering effect can be improved.