公开(公告)号：US20140311772A1

公开(公告)日：2014-10-23

申请号：US14255986

申请日：2014-04-18

Applicant: IBIDEN CO., LTD.

Inventor： Yoshio MIZUTANI ,  Hiroaki WATANABE

IPC: H05K1/02 ,  H05K3/40

CPC classification number: H05K3/462 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2203/1476 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A printed wiring board includes: a multilayer core substrate including first and second insulation layers and a double-sided board between the first and second insulation layers. The core substrate has a cylindrical through-hole structure including a cylindrical conductor through the insulation layers and the board, a resin filler filling inside the cylindrical conductor and covering circuits covering the filler at the ends of the cylindrical conductor, respectively. The core substrate includes a conductive layer including a through-hole land around end of the structure such that the land is directly connected to the cylindrical conductor, the land includes a first electroless film, a first electrolytic film, a second electroless film and a second electrolytic film, and the cylindrical conductor includes the second electroless and electrolytic films such that the second electroless film is in contact with the side walls of the first electroless and electrolytic films.

Abstract translation: 印刷电路板包括：包括第一绝缘层和第二绝缘层的多层芯基板和在第一绝缘层和第二绝缘层之间的双面板。 核心基板具有圆柱形通孔结构，其包括穿过绝缘层和板的圆柱形导体，填充在圆柱形导体内部的树脂填料和覆盖圆柱形导体端部的填料的覆盖电路。 核心基板包括导电层，该导电层包括在结构的端部周围的通孔焊盘，使得焊盘直接连接到圆柱形导体，焊盘包括第一化学镀膜，第一电解膜，第二无电镀膜和第二 所述圆筒形导体包括所述第二无电电解膜和所述电解质膜，使得所述第二无电解膜与所述第一无电解电解质膜和所述电解质膜的侧壁接触。