公开(公告)号：US11553601B2

公开(公告)日：2023-01-10

申请号：US17080927

申请日：2020-10-27

Applicant: IBIDEN CO., LTD.

Inventor： Kazuyuki Ueda ,  Shota Tachibana

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/00 ,  H05K3/10

Abstract: A wiring board includes a resin insulating layer having a component mounting surface, first connection pads formed on the component mounting surface of the resin insulating layer, second connection pads formed on the component mounting surface of the resin insulating layer such that the second connection pads are surrounding the first connection pads, and a protruding part including a metal material and formed on the component mounting surface of the resin insulating layer such that a portion of the protruding part is embedded in the resin insulating layer and that the protruding part is positioned between the first connection pads and the second connection pads and surrounding the first connection pads.

公开(公告)号：US11678440B2

公开(公告)日：2023-06-13

申请号：US16874847

申请日：2020-05-15

Applicant: IBIDEN CO., LTD.

Inventor： Yoji Sawada ,  Nobuhisa Kuroda ,  Kazuyuki Ueda ,  Shota Tachibana

IPC: H05K1/11 ,  H05K3/40 ,  H05K1/18

CPC classification number: H05K3/4092 ,  H05K1/115 ,  H05K3/4061 ,  H05K1/111 ,  H05K1/18 ,  H05K2201/0373

Abstract: A printed wiring board includes a resin insulating layer, a metal post formed in the insulating layer and protruding from first surface of the insulating layer, a conductor layer formed on second surface of the insulating layer, and a via conductor penetrating through the insulating layer and connecting the metal post and conductor layer. The metal post has a protruding portion protruding from the first surface of the insulating layer and an embedded portion connected to the protruding portion and embedded in the insulating layer such that the protruding portion does not extend onto the insulating layer, and the metal post has upper and side surfaces such that the side surface has unevenness including a first unevenness on side surface of the protruding portion and a second unevenness formed on side surface of the embedded portion and having a size that is larger than a size of the first unevenness.

公开(公告)号：US11222791B2

公开(公告)日：2022-01-11

申请号：US15931696

申请日：2020-05-14

Applicant: IBIDEN CO., LTD.

Inventor： Yoji Sawada ,  Nobuhisa Kuroda ,  Kazuyuki Ueda ,  Shota Tachibana

IPC: H05K1/18 ,  H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H05K3/46 ,  H01L23/00 ,  H05K1/02

Abstract: A printed wiring board includes a resin insulating layer, a metal post formed in the resin insulating layer such that the metal post is protruding from a first surface of the resin insulating layer, a conductor layer formed on a second surface of the resin insulating layer on the opposite side with respect to the first surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer and connecting the metal post and the conductor layer. The metal post has a protruding portion protruding from the first surface of the resin insulating layer and an embedded portion integrally formed with the protruding portion and embedded in the resin insulating layer.