公开(公告)号：US20160316558A1

公开(公告)日：2016-10-27

申请号：US15084992

申请日：2016-03-30

Applicant: IBIDEN CO., LTD.

Inventor： Shunsuke SAKAI ,  Toshiki FURUTANI ,  Kosuke IKEDA ,  Takema ADACHI ,  Takayuki KATSUNO

IPC: H05K1/11 ,  H05K3/18 ,  H05K1/09 ,  H05K3/00 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/11 ,  H01L21/486 ,  H01L23/12 ,  H01L23/145 ,  H01L23/49861 ,  H05K3/205 ,  H05K3/382 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/0307

Abstract: A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the wiring layer has first surface exposed from the insulating layer, and a conductor post formed in the insulating layer and on second surface of the wiring layer on the opposite side with respect to the first surface of the wiring layer such that the conductor post has side surface covered by the insulating layer and end surface exposed from the insulating layer on the opposite side with respect to the wiring layer. The conductor post is formed such that the side surface of the conductor post is a roughened side surface having surface roughness of first roughness R1, the end surface of the conductor post is a roughened end surface having surface roughness of second roughness R2, and the first and second roughnesses R1, R2 satisfy R1>R2.

Abstract translation: 印刷布线板包括树脂绝缘层，布置在绝缘层中的布线导体层，使得布线层具有从绝缘层露出的第一表面，以及形成在绝缘层中的导体柱和布线层的第二表面 在相对于布线层的第一表面的相对侧，使得导体柱具有被绝缘层覆盖的侧表面和相对于布线层的相对侧上的绝缘层暴露的端面。 导体柱形成为使得导体柱的侧表面是具有第一粗糙度R1的表面粗糙度的粗糙化侧表面，导体柱的端面是具有第二粗糙度R2的表面粗糙度的粗糙化端面，并且第一 第二粗糙度R1，R2满足R1> R2。