公开(公告)号：US20150230346A1

公开(公告)日：2015-08-13

申请号：US14621828

申请日：2015-02-13

Applicant: IBIDEN CO., LTD.

Inventor： Katsuhiko TANNO ,  Yusuke KAWAMURA ,  Seito ADACHI

IPC: H05K3/34 ,  B32B38/10 ,  H05K3/00 ,  B32B37/24 ,  B23K1/00 ,  B23K3/06

CPC classification number: B32B38/10 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/203 ,  B23K3/0623 ,  B23K2101/42 ,  H05K3/288 ,  H05K3/3478 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  Y10T156/1057

Abstract: A method for manufacturing a printed wiring board includes clamping a mask device at clamping portioned formed in the mask device with a movable clamp device to apply tensile force to the mask device, positioning the mask device over a printed wiring board having connection pads, applying the tensile force to the mask device through the clamping portions such that a mask of the mask device undergoes elastic deformation and positions of opening portions in the mask are vertically aligned relative to positions of the connection pads of the printed wiring board, and loading solder balls through the opening portions in the mask onto the connection pads of the printed wiring board, respectively.

Abstract translation: 一种制造印刷电路板的方法，包括：利用可移动的夹紧装置将形成在掩模装置中的夹持部分的掩模装置夹持，以对该掩模装置施加张力，将掩模装置定位在具有连接焊盘的印刷线路板上， 通过夹持部分对掩模装置施加张力，使得掩模装置的掩模经历弹性变形，并且掩模中的开口部分的位置相对于印刷线路板的连接焊盘的位置垂直取向，并且通过 掩模中的开口部分分别连接到印刷电路板的连接焊盘上。