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1.Sputtering processes for depositing thin films of controlled thickness 失效
Title translation: 用于沉积受控厚度的薄膜的溅射工艺-
2.
公开(公告)号:US3343256A
公开(公告)日:1967-09-26
申请号:US42145264
申请日:1964-12-28
Applicant: IBM
Inventor: SMITH MERLIN G , EMANUEL STERN
IPC: H01J37/34 , H01L21/263 , H01L21/60 , H01L21/768 , H01L23/48
CPC classification number: H01L24/80 , H01J37/34 , H01L21/2633 , H01L21/76898 , H01L23/481 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01072 , H01L2924/01074 , H01L2924/12033 , H01L2924/14 , H01L2924/3011 , Y10S148/085 , Y10T29/49165 , H01L2924/00
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