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公开(公告)号:US3400014A
公开(公告)日:1968-09-03
申请号:US39660464
申请日:1964-09-15
Applicant: IBM
Inventor: BLUMBERG REX H , CASWELL HOLLIS L , CHARLES CHIOU
CPC classification number: G11C11/44 , C23C14/541 , C23C14/545 , H01L39/24
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公开(公告)号:US3036933A
公开(公告)日:1962-05-29
申请号:US84475459
申请日:1959-10-06
Applicant: IBM
Inventor: CASWELL HOLLIS L
CPC classification number: H01J41/12 , C23C14/56 , H01B1/00 , Y10S505/819
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公开(公告)号:US3350222A
公开(公告)日:1967-10-31
申请号:US33347563
申请日:1963-12-26
Applicant: IBM
Inventor: IRVING AMES , CASWELL HOLLIS L
IPC: H01L21/316 , H01L21/3205 , H01L23/485 , H01L23/532
CPC classification number: H01L23/5329 , H01L21/02178 , H01L21/02266 , H01L21/02269 , H01L21/3162 , H01L21/32051 , H01L23/485 , H01L2924/0002 , Y10S148/053 , Y10T29/49124 , Y10T428/24917 , Y10T428/31804 , H01L2924/00
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公开(公告)号:US3058852A
公开(公告)日:1962-10-16
申请号:US1864760
申请日:1960-03-30
Applicant: IBM
Inventor: CASWELL HOLLIS L , CHARLES CHIOU
CPC classification number: C23C14/5806 , C23C14/042 , C23C14/044 , C23C14/58 , C23C14/5873 , C23F1/02 , G11C11/44 , H01B1/00 , H01L39/00 , H01L39/18 , H01L39/24 , Y10S336/01 , Y10S505/82 , Y10S505/833 , Y10S505/882 , Y10T29/49014 , Y10T428/24355 , Y10T428/24488
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5.Sputtering processes for depositing thin films of controlled thickness 失效
Title translation: 用于沉积受控厚度的薄膜的溅射工艺-
6.Method for forming thin film electrical circuit elements by preferential nucleation techniques 失效
Title translation: 通过优先成核技术形成薄膜电路元件的方法公开(公告)号:US3392051A
公开(公告)日:1968-07-09
申请号:US37334664
申请日:1964-06-08
Applicant: IBM
Inventor: CASWELL HOLLIS L , GREGOR LAWRENCE V , MCGEE HANSEL L
CPC classification number: B05D1/60 , B05D3/06 , B05D3/068 , C09D4/00 , C23C14/042 , C23C14/048 , H01G4/145 , H01J37/30 , H01L49/02 , C08F220/00 , C08F218/00
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公开(公告)号:US3248256A
公开(公告)日:1966-04-26
申请号:US21266462
申请日:1962-07-26
Applicant: IBM
Inventor: YOSHIRO BUDO , CASWELL HOLLIS L , PRIEST JOSEPH R
IPC: C23C14/00
CPC classification number: C23C14/0021 , Y10S438/944
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