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公开(公告)号:US3141920A
公开(公告)日:1964-07-21
申请号:US7970160
申请日:1960-12-30
Applicant: IBM
Inventor: BEBB HERBERT B , HEATH HERBERT E , HILBORN JR REGINALD B , MADDOCKS FRED S
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2.Method of manufacturing multilayer microcircuitry including electropolishing to smooth film conductors 失效
Title translation: 制造多层微电路的方法,包括电镀抛光到光滑膜导体公开(公告)号:US3314869A
公开(公告)日:1967-04-18
申请号:US25262863
申请日:1963-01-21
Applicant: IBM
Inventor: DOBBIN WILLIAM J , LESSOR JR ARTHUR E , MADDOCKS FRED S
IPC: C23F1/02 , C23F1/26 , H01B3/00 , H01L49/02 , H05K1/03 , H05K3/06 , H05K3/07 , H05K3/10 , H05K3/22 , H05K3/38
CPC classification number: H05K3/22 , C23F1/02 , C23F1/26 , H01B3/004 , H01L49/02 , H05K1/0306 , H05K3/067 , H05K3/07 , H05K3/108 , H05K3/388 , H05K2201/0338 , H05K2203/0346 , Y10T29/49126
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公开(公告)号:US3271192A
公开(公告)日:1966-09-06
申请号:US20025662
申请日:1962-06-05
Applicant: IBM
Inventor: THUN RUDOLF E , MADDOCKS FRED S
CPC classification number: C23C14/08 , C23C14/0694
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