Photolithographic masks of semiconductor material
    1.
    发明授权
    Photolithographic masks of semiconductor material 失效
    半导体材料的光刻掩模

    公开(公告)号:US3701659A

    公开(公告)日:1972-10-31

    申请号:US3701659D

    申请日:1970-06-01

    Applicant: IBM

    CPC classification number: G03F1/54

    Abstract: A PHOTOLITHOGRAPHIC MASK COMPRISING A SUBSTRATE OF QUARTZ OR GLASS AND A PATTERN-DEFINING LAYER OF A SEMICONDUCTOR MATERIAL SUCH AS SILICON. THE PATTERN IS DEFINED IN THE SEMICONDUCTOR MATERIAL BY ETCHING OF THE SEMICONDUCTOR, INVOLVING DISPLACEMENT OF THE SEMICONDUCTOR IN SELECTED AREAS WITH A METAL SUCH AS COPPER. IN THIS WAY, A HIGH RESOLUTION MASK IS OBTAINABLE HAVING THE ADDED FEATURE OF BEING PARTIALLY TRANSPARENT.

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