公开(公告)号：US12064905B2

公开(公告)日：2024-08-20

申请号：US17460615

申请日：2021-08-30

Applicant: ILLUMINA, INC.

Inventor： Michael Rapp ,  Timothy Merkel ,  Audrey Zak

IPC: B29C39/44 ,  B29C33/20 ,  B29C39/02 ,  B29C39/26

CPC classification number: B29C39/44 ,  B29C33/202 ,  B29C39/02 ,  B29C39/26 ,  B29C2033/207 ,  B29C2791/006

Abstract: Fixtures and related system and methods are disclosed. In accordance with an implementation, a method includes applying a resin onto a substrate and positioning the substrate on over a chuck of a base of a fixture. The method also includes moving a mold into engagement with the resin and curing the resin. The method also includes detaching the mold and the resin and, while detaching the mold and the resin, determining a detachment force applied as a function of a distance of detachment between the mold and the resin.

公开(公告)号：US20220063147A1

公开(公告)日：2022-03-03

申请号：US17460615

申请日：2021-08-30

Applicant: ILLUMINA, INC.

Inventor： Michael Rapp ,  Timothy Merkel ,  Audrey Zak

IPC: B29C39/44 ,  B29C33/20 ,  B29C39/02 ,  B29C39/26

Abstract: Fixtures and related system and methods are disclosed. In accordance with an implementation, a method includes applying a resin onto a substrate and positioning the substrate on over a chuck of a base of a fixture. The method also includes moving a mold into engagement with the resin and curing the resin. The method also includes detaching the mold and the resin and, while detaching the mold and the resin, determining a detachment force applied as a function of a distance of detachment between the mold and the resin.

公开(公告)号：US20240102913A1

公开(公告)日：2024-03-28

申请号：US18455467

申请日：2023-08-24

Applicant: ILLUMINA, INC.

Inventor： Casey Scott Irvin ,  Jonathan Ziebarth ,  Michael Rapp ,  Danny Yuan Chan ,  Innsu Daniel Kim ,  Avishek Aiyar

IPC: G01N15/14

CPC classification number: G01N15/1436

Abstract: An example flow cell includes a patterned substrate having an active region and a bonding region that at least partially surrounds the active region. The active region includes first depressions defined in a layer of the patterned substrate, surface chemistry positioned in the first depressions, and first interstitial regions surrounding the first depressions. The bonding region includes second depressions defined in the layer and second interstitial regions surrounding the second depressions. An adhesive is positioned over the second depressions and over the second interstitial regions. A cover is attached to the adhesive such that a flow channel is defined between a portion of the cover and the active region.