公开(公告)号：US20230249176A1

公开(公告)日：2023-08-10

申请号：US18003284

申请日：2022-02-18

Applicant: Illumina, Inc.

Inventor： Jonathan Ziebarth ,  Jon Aday ,  Paul Crivelli ,  Gerald Kreindl ,  Amit Sharma

IPC: B01L3/00 ,  B29C45/14

CPC classification number: B01L3/502707 ,  B29C45/14778 ,  B01L2300/0896 ,  B29C2045/0094

Abstract: Provided herein include various examples of a method for manufacturing aspects of flow cell. The method may include performing chemical processes on a surface of the patterned wafer to prepare the surface of the patterned, singulating the wafer into individual dies, orienting each die on a temporary substrate, where the orienting creates spaces between each individual die, and molding a material over the spaces to create a hybrid wafer comprised of glass and molded material. The method may also include bonding two of the hybrid wafers together, forming a bonded wafer stack.

公开(公告)号：US12296333B2

公开(公告)日：2025-05-13

申请号：US18003284

申请日：2022-02-18

Applicant: Illumina, Inc.

Inventor： Jonathan Ziebarth ,  Jon Aday ,  Paul Crivelli ,  Gerald Kreindl ,  Amit Sharma

IPC: B29C45/14 ,  B01L3/00 ,  B29C45/00

Abstract: Provided herein include various examples of a method for manufacturing aspects of flow cell. The method may include performing chemical processes on a surface of the patterned wafer to prepare the surface of the patterned, singulating the wafer into individual dies, orienting each die on a temporary substrate, where the orienting creates spaces between each individual die, and molding a material over the spaces to create a hybrid wafer comprised of glass and molded material. The method may also include bonding two of the hybrid wafers together, forming a bonded wafer stack.

公开(公告)号：US20240102913A1

公开(公告)日：2024-03-28

申请号：US18455467

申请日：2023-08-24

Applicant: ILLUMINA, INC.

Inventor： Casey Scott Irvin ,  Jonathan Ziebarth ,  Michael Rapp ,  Danny Yuan Chan ,  Innsu Daniel Kim ,  Avishek Aiyar

IPC: G01N15/14

CPC classification number: G01N15/1436

Abstract: An example flow cell includes a patterned substrate having an active region and a bonding region that at least partially surrounds the active region. The active region includes first depressions defined in a layer of the patterned substrate, surface chemistry positioned in the first depressions, and first interstitial regions surrounding the first depressions. The bonding region includes second depressions defined in the layer and second interstitial regions surrounding the second depressions. An adhesive is positioned over the second depressions and over the second interstitial regions. A cover is attached to the adhesive such that a flow channel is defined between a portion of the cover and the active region.