公开(公告)号：US20230163034A1

公开(公告)日：2023-05-25

申请号：US17578447

申请日：2022-01-19

Applicant: Industrial Technology Research Institute

Inventor： Lung-Tai Chen ,  Chin-Sheng Chang ,  Bor-Shiun Lee ,  Chih-Hsiang Ko

IPC: H01L23/06

CPC classification number: H01L23/06

Abstract: A gas-permeable package lid of a chip package structure and a manufacturing method thereof are provided. The gas-permeable package lid of the chip package structure includes a lid body, a through hole, and a hydrophobic gas-permeable membrane. The lid body is integrally formed. The through hole penetrates the lid body. The hydrophobic gas-permeable membrane is bonded to the lid body and shields the through hole. A part of the hydrophobic gas-permeable membrane is embedded in the lid body.

公开(公告)号：US12191219B2

公开(公告)日：2025-01-07

申请号：US17578447

申请日：2022-01-19

Applicant: Industrial Technology Research Institute

Inventor： Lung-Tai Chen ,  Chin-Sheng Chang ,  Bor-Shiun Lee ,  Chih-Hsiang Ko

IPC: H01L23/06

Abstract: A gas-permeable package lid of a chip package structure and a manufacturing method thereof are provided. The gas-permeable package lid of the chip package structure includes a lid body, a through hole, and a hydrophobic gas-permeable membrane. The lid body is integrally formed. The through hole penetrates the lid body. The hydrophobic gas-permeable membrane is bonded to the lid body and shields the through hole. A part of the hydrophobic gas-permeable membrane is embedded in the lid body.

公开(公告)号：US20140185181A1

公开(公告)日：2014-07-03

申请号：US13891774

申请日：2013-05-10

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jyun-Cheng Huang ,  Chih-Hsiang Ko ,  Tsun-Che Huang ,  Chin-Hung Wang

IPC: H01G7/00

CPC classification number: H01G5/38 ,  B81B3/0056 ,  B81B2201/0221 ,  H01G5/18 ,  H03J3/20 ,  H03J2200/39

Abstract: A tunable capacitor includes a substrate, a movable member, a first capacitive plate, a second capacitive plate, a third capacitive plate and a set of electrode plates. The movable member is disposed on the substrate. The movable member is adapted for moving away or toward the substrate to have a first position and a second position, respectively. The first capacitive plate is disposed on the movable member and faces the substrate. The second capacitive plate and the third capacitive plate are disposed on the substrate and face the first capacitive plate. The set of electrode plates, disposed on the substrate, faces the at least one movable member. The set of electrode plates, driven by an electrical voltage, generates electrostatic force causing the movable member to be drawn from the first position to the second position thereof to correspondingly adjust capacitance between the capacitive plates.

Abstract translation: 可调谐电容器包括基板，可移动元件，第一电容板，第二电容板，第三电容板和一组电极板。 可移动部件设置在基板上。 可移动部件适于移动或朝向基板移动以分别具有第一位置和第二位置。 第一电容板设置在可动构件上并且面向衬底。 第二电容板和第三电容板设置在基板上并面向第一电容板。 设置在基板上的电极板组面向至少一个可移动部件。 由电压驱动的一组电极板产生静电力，导致可动构件从第一位置拉至其第二位置，以对应地调节电容板之间的电容。