公开(公告)号：US20140333936A1

公开(公告)日：2014-11-13

申请号：US14270962

申请日：2014-05-06

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Po-Yi CHANG ,  Chia-Hung CHO ,  Yi-Sha KU ,  Deh-Ming SHYU

IPC: G01B11/06 ,  H01L21/66

CPC classification number: H01L22/26 ,  G01B9/02007 ,  G01B11/0625 ,  G01B11/0675 ,  H01L22/12

Abstract: In a thickness measuring system for a bonding layer according to an exemplary embodiment, an optical element changes the wavelength of a first light source to enable at least one second light source propagating through a bonding layer to be incident to an object, wherein the bonding layer has an upper interface and a lower interface that are attached to the object; and an optical image capturing and analysis unit receives a plurality of reflected lights from the upper and the lower interfaces to capture a plurality of interference images of different wavelengths, and analyzes the intensity of the plurality of interference images to compute the thickness information of the bonding layer.

Abstract translation: 在根据示例性实施例的用于接合层的厚度测量系统中，光学元件改变第一光源的波长，使得能够通过粘合层传播的至少一个第二光源入射到物体，其中，接合层 具有附接到对象的上界面和下界面; 并且光学图像捕获和分析单元从上界面和下界面接收多个反射光以捕获多个不同波长的干涉图像，并且分析多个干涉图像的强度以计算粘合的厚度信息 层。