Abstract:
A gravure offset printing apparatus includes two clamps, a printing roller and a driving device. The two clamps are applicable to clamp individually two opposing ends of a blanket. The printing roller having an axial direction parallel to a first direction is disposed between the two clamps. The blanket wraps part of a radial periphery of the printing roller. The driving device is to drive the two clamps to undergo reverse motions so as to displace the blanket, and the blanket further rotates the printing roller. A gravure module, disposed on a platform of the gravure offset printing apparatus, has a groove for containing an offset ink. While the two clamps pull the blanket to undergo the reverse motions, a surface of the blanket contacts the gravure module so as to adhere the offset ink on the surface of the blanket.
Abstract:
A gravure offset printing apparatus includes two clamps, a printing roller and a driving device. The two clamps are applicable to clamp individually two opposing ends of a blanket. The printing roller having an axial direction parallel to a first direction is disposed between the two clamps. The blanket wraps part of a radial periphery of the printing roller. The driving device is to drive the two clamps to undergo reverse motions so as to displace the blanket, and the blanket further rotates the printing roller. A gravure module, disposed on a platform of the gravure offset printing apparatus, has a groove for containing an offset ink. While the two clamps pull the blanket to undergo the reverse motions, a surface of the blanket contacts the gravure module so as to adhere the offset ink on the surface of the blanket.
Abstract:
A manufacturing method of multilayer wiring is provided, wherein a multilayer wiring structure including a wiring layer and a conductive via is formed on a substrate. The wiring layer is formed by forming a patterned colloidal layer having a first catalyzer on the substrate, activating the first catalyzer, and forming a conductive layer on a surface of the patterned colloidal layer. The conductive via is formed by forming an insulation colloidal layer containing a second catalyzer on the substrate and the conductive layer and forming at least one opening in the colloidal insulation layer by laser to expose the conductive layer and activate a portion of the second catalyzer. Electroless plating is performed on the activated second catalyzer to form the conductive via in the opening. An interface is between the patterned colloidal layer and the conductive layer in the multilayer wiring structure.