公开(公告)号：US11745478B2

公开(公告)日：2023-09-05

申请号：US17903516

申请日：2022-09-06

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Hsin-Chung Wu ,  Mei-Ru Lin ,  En-Yu Pan

IPC: B32B27/40 ,  B32B27/08 ,  B32B27/30 ,  B32B27/26

CPC classification number: B32B27/08 ,  B32B27/26 ,  B32B27/308 ,  B32B27/40 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2250/05 ,  B32B2250/24 ,  B32B2307/412 ,  B32B2307/51 ,  B32B2333/08 ,  B32B2333/12 ,  B32B2367/00 ,  B32B2369/00 ,  B32B2375/00 ,  B32B2379/08 ,  B32B2383/00

Abstract: The present disclosure provides a transparent elastic composite film, which includes a first film layer; a thermoplastic polyurethane layer; and a second film layer; wherein the first film layer and the second film layer have a crosslinked network structure; the first film layer includes acrylic resin and aliphatic polyisocyanate, wherein the acrylic resin includes hydroxyl-containing acrylic resin, and a weight ratio of the acrylic resin to the aliphatic polyisocyanate is 1/1 to 1/1.2, and a weight ratio of the hydroxyl-containing acrylic resin to the acrylic resin is 0.1/1 to 0.18/1.

公开(公告)号：US20160174366A1

公开(公告)日：2016-06-16

申请号：US15051645

申请日：2016-02-23

Applicant: Industrial Technology Research Institute

Inventor： Shu-Tang Yeh ,  Chia-Hao Tsai ,  Mei-Ru Lin

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0274 ,  H05K1/183 ,  H05K5/064

Abstract: A package structure of an electronic device includes a first substrate, a second substrate, an electronic device and a first barrier structure. The first substrate includes a first light-transmitting portion and a periphery portion. The second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion. The first light-transmitting portion is disposed corresponding to the second light-transmitting portion, and a device disposition region exists therebetween. The covering portions cover the periphery portion of the first substrate and two opposite side surfaces of the first substrate. The electronic device is disposed on the first or second substrate, and is located in the device disposition region. The first barrier structure disposed on the first substrate or the second substrate is disposed corresponding to the periphery portion and disposed on at least one side of the device disposition region.

Abstract translation: 电子器件的封装结构包括第一衬底，第二衬底，电子器件和第一屏障结构。 第一基板包括第一透光部分和周边部分。 第二基板包括第二透光部分和位于第二光透射部分两侧的两个覆盖部分。 第一光透射部分对应于第二光透射部分设置，并且在其间存在器件配置区域。 覆盖部分覆盖第一基板的周边部分和第一基板的两个相对的侧表面。 电子设备设置在第一或第二基板上，并且位于设备配置区域中。 设置在第一基板或第二基板上的第一阻挡结构相对于周边部分设置并设置在装置配置区域的至少一侧。

公开(公告)号：US10005881B2

公开(公告)日：2018-06-26

申请号：US14859946

申请日：2015-09-21

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Wen-Hsien Wang ,  Tzong-Ming Lee ,  Min-Tsung Kuan ,  Ming-Chia Li ,  Mei-Ru Lin

IPC: C09K11/06 ,  C08G63/82 ,  C08G63/08 ,  G02B1/14 ,  C08G63/685 ,  C09K11/00

CPC classification number: C08G63/823 ,  C08G63/08 ,  C08G63/6852 ,  C09K11/00 ,  C09K11/06 ,  C09K2211/1475 ,  G02B1/14

Abstract: A wavelength-converting polymer, a method for fabricating the same and a wavelength-converting device employing the same are provided. The wavelength-converting polymer has a chemical structure represented by formula (I): In formula (I), B and D are the same or different and independently include hydrogen, C1-8 alkyl group, C1-8 alkoxy group, aryloxy group, carboxyl group, —COOK, —COONa or —NH2, or B and D are connected to form a heteroaromatic ring, wherein Z is hydrogen, C1-8 alkyl group, cycloalkyl group or aryloxy group, X1-X4 are the same or different and independently include hydrogen, halogen, C1-8 alkyl group or C1-8 alkoxy group, R is C1-8 alkyl group with or without substitution, and n is an integer of 5 to 1,000.

公开(公告)号：US09795028B2

公开(公告)日：2017-10-17

申请号：US15051645

申请日：2016-02-23

Applicant: Industrial Technology Research Institute

Inventor： Shu-Tang Yeh ,  Chia-Hao Tsai ,  Mei-Ru Lin

IPC: H05K1/02 ,  H05K5/06 ,  H05K1/18

CPC classification number: H05K1/0274 ,  H05K1/183 ,  H05K5/064

Abstract: A package structure of an electronic device includes a first substrate, a second substrate, an electronic device and a first barrier structure. The first substrate includes a first light-transmitting portion and a periphery portion. The second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion. The first light-transmitting portion is disposed corresponding to the second light-transmitting portion, and a device disposition region exists therebetween. The covering portions cover the periphery portion of the first substrate and two opposite side surfaces of the first substrate. The electronic device is disposed on the first or second substrate, and is located in the device disposition region. The first barrier structure disposed on the first substrate or the second substrate is disposed corresponding to the periphery portion and disposed on at least one side of the device disposition region.

公开(公告)号：US20140198435A1

公开(公告)日：2014-07-17

申请号：US13934222

申请日：2013-07-02

Applicant: Industrial Technology Research Institute

Inventor： Shu-Tang Yeh ,  Chia-Hao Tsai ,  Mei-Ru Lin

IPC: H05K5/02

CPC classification number: H05K1/0274 ,  H05K1/183 ,  H05K5/064

Abstract: A package structure of an electronic device includes a first substrate, a second substrate, an electronic device and a first barrier structure. The first substrate includes a first light-transmitting portion and a periphery portion. The second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion. The first light-transmitting portion is disposed corresponding to the second light-transmitting portion, and a device disposition region exists therebetween. The covering portions cover the periphery portion of the first substrate and two opposite side surfaces of the first substrate. The electronic device is disposed on the first or second substrate, and is located in the device disposition region. The first barrier structure disposed on the first substrate or the second substrate is disposed corresponding to the periphery portion and disposed on at least one side of the device disposition region.

Abstract translation: 电子器件的封装结构包括第一衬底，第二衬底，电子器件和第一屏障结构。 第一基板包括第一透光部分和周边部分。 第二基板包括第二透光部分和位于第二光透射部分两侧的两个覆盖部分。 第一光透射部分对应于第二光透射部分设置，并且在其间存在器件配置区域。 覆盖部分覆盖第一基板的周边部分和第一基板的两个相对的侧表面。 电子设备设置在第一或第二基板上，并且位于设备配置区域中。 设置在第一基板或第二基板上的第一阻挡结构相对于周边部分设置并设置在装置配置区域的至少一侧。