公开(公告)号：US20150027642A1

公开(公告)日：2015-01-29

申请号：US14509837

申请日：2014-10-08

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Dong-Sen CHEN ,  Hsiao-Fen WEI ,  Liang-You JIANG ,  Yu-Yang CHANG

IPC: B32B43/00

CPC classification number: B32B43/006 ,  G02F1/133305 ,  G02F2001/13613 ,  Y10T156/1116

Abstract: Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated.

Abstract translation: 提供了从支撑基板分离柔性膜的方法和用于制造电子器件的方法。 从支撑衬底分离柔性膜的方法包括提供具有顶表面的衬底。 表面处理受到基板的顶表面的影响，形成具有脱离特性的顶面。 在顶表面上形成具有脱离特性的柔性膜。 切割和隔离具有脱离特性的顶表面内的柔性膜。