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Patent Agency Ranking
公开(公告)号：US20190276704A1
公开(公告)日：2019-09-12
申请号：US16234073
申请日：2018-12-27
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Dong-Sen CHEN , Yu-Ju KUO , Chyi-Ming LEU
Abstract: A polyimide precursor solution is provided. The polyimide precursor solution includes 100 parts by weight of a fully aromatic polyamic acid, from 5 to 20 parts by weight of silica particles, from 5 to 80 parts by weight of an alkoxysilane, and from 40 to 80 parts by weight of a solvent.
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公开(公告)号：US20150027642A1
公开(公告)日：2015-01-29
申请号：US14509837
申请日：2014-10-08
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Dong-Sen CHEN , Hsiao-Fen WEI , Liang-You JIANG , Yu-Yang CHANG
IPC: B32B43/00
CPC classification number: B32B43/006 , G02F1/133305 , G02F2001/13613 , Y10T156/1116
Abstract: Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated.
Abstract translation: 提供了从支撑基板分离柔性膜的方法和用于制造电子器件的方法。 从支撑衬底分离柔性膜的方法包括提供具有顶表面的衬底。 表面处理受到基板的顶表面的影响，形成具有脱离特性的顶面。 在顶表面上形成具有脱离特性的柔性膜。 切割和隔离具有脱离特性的顶表面内的柔性膜。
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公开(公告)号：US20220204705A1
公开(公告)日：2022-06-30
申请号：US17139336
申请日：2020-12-31
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Dong-Sen CHEN , Yu-Ju KUO , Yung-Lung TSENG , Chun-Wei SU
IPC: C08G77/455 , C08G73/10 , C08G77/26 , C08G77/24 , C08G77/00 , C08K5/00 , C08G77/20 , C08G77/16 , C08G77/18 , C08L79/08 , C08G77/12
Abstract: A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II) wherein A1 and A3 are independently tetravalent moiety; A2 is a divalent moiety; n≥1; m≥1; R1 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, or C6-12 aryl; and R2 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, C6-12 aryl, or a reactive functional group.
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公开(公告)号：US20190202996A1
公开(公告)日：2019-07-04
申请号：US15858426
申请日：2017-12-29
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Dong-Sen CHEN , Yu-Ju KUO , Chyi-Ming LEU
IPC: C08G83/00 , C09D187/00 , C08G73/10 , C09D179/08
CPC classification number: C08G83/001 , C08G73/1028 , C08G73/1067 , C08G83/003 , C09D179/08 , C09D187/005
Abstract: A polyimide precursor solution is provided. The polyimide precursor solution includes 100 parts by weight of a fully aromatic polyamic acid, 5-20 parts by weight of silica particles, 10-40 parts by weight of an alkoxysilane, and 60-80 parts by weight of a solvent.
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公开(公告)号：US20190196098A1
公开(公告)日：2019-06-27
申请号：US15857121
申请日：2017-12-28
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Chih-Jen YANG , Li-Ting HUANG , Dong-Sen CHEN , Chyi-Ming LEU
CPC classification number: G02B6/12007 , C08F2/44 , G02B6/12002 , G02B6/1221 , G02B6/136
Abstract: An optical waveguide includes a lower clad layer, a core layer, and an upper clad layer, wherein the core layer is disposed between the lower clad layer and the upper clad layer. The lower clad layer has a composition including unetchable closed-loop polyimide and plate-shaped clay in a range of 20 wt %-60 wt %. The core layer has a composition including etchable closed-loop polyimide and plate-shaped clay in a range of 20 wt %-60 wt %. The upper clad layer has a composition including an organic material and plate-shaped clay in a range of 20 wt %-60 wt %. The core layer has a refractive index lager than that of the upper clad layer and the lower clad layer.
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