-
公开(公告)号：US11726449B2
公开(公告)日：2023-08-15
申请号：US16606967
申请日：2018-02-19
Inventor： Marcelo Aita Riss , Thiago Barbosa Lima De Moura , Alyne Gomes Soares Cantal , Ana Patricia Del Angel , Jun Zeng , Scott A White , Sebastia Cortes i Herms
IPC: G05B19/4099 , G06T15/00
CPC classification number: G05B19/4099 , G06T15/00 , G05B2219/49023
Abstract: According to examples, an apparatus may include a processor and a memory on which is stored machine readable instructions that when executed by the processor are to cause the processor to access a reduced resolution three-dimensional (3D) model file of an object to be built in a build bed of a 3D printing system, the reduced resolution 3D model file comprising a reduced resolution file of a first resolution 3D model file of the object. The instructions may also cause the processor to determine a packing arrangement for the object and a plurality of other objects to be built in the build bed through use of the reduced resolution 3D model file and output the determined packing arrangement for the 3D printing system to print the object and the other objects.
-
公开(公告)号：US20230186524A1
公开(公告)日：2023-06-15
申请号：US17552219
申请日：2021-12-15
Inventor： Juan Carlos Catana Salazar , Marco Antonio Medrano Acosta , Alyne Gomes Soares Cantal , Jun Zeng
CPC classification number: G06T9/001 , G06T17/005
Abstract: Examples of methods are described herein. In some examples, a method includes determining a quantity of inner voxels in a canonical direction from each surface voxel of a set of surface voxels of a three-dimensional (3D) object model. In some examples, the method includes generating an encoded representation of the 3D object model, the encoded representation indicating a location of each surface voxel and the quantity of inner voxels for each surface voxel.
-
公开(公告)号：US20210349428A1
公开(公告)日：2021-11-11
申请号：US17283617
申请日：2018-12-12
Inventor： Marcelo Aita Riss , Alyne Gomes Soares Cantal , He Luan , Jun Zeng , Scott Alan White , Sebastia Cortes i Herms , Nailson Boaz Costa Leite , Brian Schmitz Tani
Abstract: Examples of methods for object manufacturing visualization by an electronic device are described herein. In some examples, a predicted thermal image of additive manufacturing is determined using a machine learning model. In some examples, a captured thermal image is obtained. In some examples, a graphical overlay of the predicted thermal image with the captured thermal image is presented.
-
公开(公告)号：US12026923B2
公开(公告)日：2024-07-02
申请号：US17552219
申请日：2021-12-15
Inventor： Juan Carlos Catana Salazar , Marco Antonio Medrano Acosta , Alyne Gomes Soares Cantal , Jun Zeng
CPC classification number: G06T9/001 , G06T17/005
Abstract: Examples of methods are described herein. In some examples, a method includes determining a quantity of inner voxels in a canonical direction from each surface voxel of a set of surface voxels of a three-dimensional (3D) object model. In some examples, the method includes generating an encoded representation of the 3D object model, the encoded representation indicating a location of each surface voxel and the quantity of inner voxels for each surface voxel.
-
公开(公告)号：US11975483B2
公开(公告)日：2024-05-07
申请号：US17299645
申请日：2018-12-19
Inventor： Jun Zeng , Alyne Gomes Soares Cantal , Juan Carlos Catana Salazar
IPC: B33Y50/00 , B29C64/171 , B29C64/386 , G05B19/4099 , B29C64/124 , B29C64/153
CPC classification number: B29C64/171 , B29C64/386 , B33Y50/00 , G05B19/4099 , B29C64/124 , B29C64/153 , G05B2219/49023
Abstract: Examples of methods for part packing are described herein. In some examples, a first subset and a second subset of a set of parts are determined. In some examples a first packing of the first subset is determined. In some examples, a second packing of the second subset is determined based on the first packing.
-
Patent Agency Ranking
公开(公告)号：US11511492B2
公开(公告)日：2022-11-29
申请号：US16612945
申请日：2017-08-01
Inventor： Marcelo Aita Riss , Thiago B. Lima de Moura , Alyne Gomes Soares Cantal , Ana Patricia Del Angel , Jun Zeng , Scott White , Sebastia Cortes i Herms
IPC: B29C64/393 , B33Y50/02 , B33Y80/00
Abstract: A method of manufacturing an object via three-dimensional printing is disclosed. Data regarding the object is received. The object is three-dimensionally printed from the data. A wrapper is also three-dimensionally printed from the data. The wrapper encloses the object and includes information regarding the object.
-
公开(公告)号：US20220016833A1
公开(公告)日：2022-01-20
申请号：US17299645
申请日：2018-12-19
Inventor： Jun Zeng , Alyne Gomes Soares CANTAL , Juan Carlos Catana Salazar
IPC: B29C64/171 , B29C64/386 , B33Y50/00 , G05B19/4099
Abstract: Examples of methods for part packing are described herein. In some examples, a first subset and a second subset of a set of parts are determined. In some examples a first packing of the first subset is determined. In some examples, a second packing of the second subset is determined based on the first packing.
-
公开(公告)号：US20200379436A1
公开(公告)日：2020-12-03
申请号：US16606967
申请日：2018-02-19
Inventor： Marcelo Aita Riss , Thiago Barbosa Lima De Moura , Alyne Gomes Soares Cantal , Ana Patricia Del Angel , Jun Zeng , Scott A White , Sebastia Cortes I Herms
IPC: G05B19/4099 , G06T15/00
Abstract: According to examples, an apparatus may include a processor and a memory on which is stored machine readable instructions that when executed by the processor are to cause the processor to access a reduced resolution three-dimensional (3D) model file of an object to be built in a build bed of a 3D printing system, the reduced resolution 3D model file comprising a reduced resolution file of a first resolution 3D model file of the object. The instructions may also cause the processor to determine a packing arrangement for the object and a plurality of other objects to be built in the build bed through use of the reduced resolution 3D model file and output the determined packing arrangement for the 3D printing system to print the object and the other objects.
-
公开(公告)号：US11971689B2
公开(公告)日：2024-04-30
申请号：US17283617
申请日：2018-12-12
Inventor： Marcelo Aita Riss , Alyne Gomes Soares Cantal , He Luan , Jun Zeng , Scott Alan White , Sebastia Cortes i Herms , Nailson Boaz Costa Leite , Brian Schmitz Tani
CPC classification number: G05B13/027 , B29C64/393 , B33Y30/00 , B33Y50/02 , G06T7/001 , G06T19/006 , G06T19/20 , G06T2207/20076 , G06T2207/20081 , G06T2207/20084 , G06T2207/30144 , G06T2219/2012
Abstract: Examples of methods for object manufacturing visualization by an electronic device are described herein. In some examples, a predicted thermal image of additive manufacturing is determined using a machine learning model. In some examples, a captured thermal image is obtained. In some examples, a graphical overlay of the predicted thermal image with the captured thermal image is presented.
-
公开(公告)号：US11971699B2
公开(公告)日：2024-04-30
申请号：US17056191
申请日：2018-10-29
Applicant: Hewlett-Packard Development Company, L.P.
IPC: G06T3/4046 , B29C64/393 , B33Y30/00 , B33Y50/02 , G05B19/4099 , G06N3/08 , G06T3/4053
CPC classification number: G05B19/4099 , B29C64/393 , B33Y30/00 , B33Y50/02 , G06N3/08 , G06T3/4046 , G06T3/4053 , G05B2219/49007 , G06T2207/10048 , G06T2207/20081 , G06T2207/20084
Abstract: Examples of methods for thermal mapping by an electronic device are described herein. In some examples, a map is obtained. In some examples, a first thermal image at a first resolution is obtained. In some examples, a neural network is used to determine a second thermal image at a second resolution based on the map and the first thermal image. The second resolution is greater than the first resolution in some examples.
-
-
-
-
-
-
-
-
-
Search Results
136
records
(took 0.019 seconds)
